Semiconductor device

Abstract

A semiconductor device includes a semiconductor module and a cooler. The semiconductor device includes semiconductor element(s) within a molded resin and a heat sink plate exposed on the molded resin. The cooler includes a cooling plate located on the heat sink plate of the semiconductor module via thermal grease. The cooling plate includes a bimetal structure in which two layers having different linear expansion coefficients are laminated. The heat sink plate includes a first facing surface facing the cooling plate and the semiconductor module is configured to thermally expand such that the first facing surface displaces with respect to the cooling plate. The cooling plate includes a second facing surface facing the heat sink plate, and the bimetal structure is configured to thermally expand such that the second facing surface of the cooling plate displaces in a same direction as the first facing surface of the heat sink plate.

What is claimed is: 
     
       1. A semiconductor device comprising:
 a semiconductor module comprising at least one semiconductor element encapsulated within a molded resin and a heat sink plate exposed on a surface of the molded resin; and 
 a cooler comprising a cooling plate located on the heat sink plate of the semiconductor module via thermal grease, 
 wherein the cooling plate comprises a bimetal structure in winch a first metal layer and a second metal layer are laminated, the second metal layer having a different linear expansion coefficient from the first metal layer, 
 the heat sink plate comprises a first facing surface facing the cooling plate, the semiconductor module being configured to thermally expand with a rise in temperature of the semiconductor module such that the first facing surface displaces with respect to the cooling plate, and 
 the cooling plate comprises a second facing surface facing the heat sink plate, the bimetal structure of the cooling plate being configured to thermally expand with a rise in temperature of the cooling plate such that the second facing surface of the cooling plate displaces in a same direction as the first facing surface of the heat sink plate. 
 
     
     
       2. The semiconductor device according to  claim 1 , further comprising an adjuster configured to adjust an amount of displacement of at least one of the first facing surface of the heat sink plate and the second facing surface of the cooling plate in accordance with the temperature of the semiconductor module. 
     
     
       3. The semiconductor device according to  claim 2 , wherein
 the adjuster comprises: 
 at least one heater configured to heat the cooling plate; and 
 a heater controller configured to adjust an amount of heat generation of the at least one heater in accordance with the temperature of the semiconductor module. 
 
     
     
       4. The semiconductor device according to  claim 3 , wherein
 the at least one semiconductor element comprises a first semiconductor element and a second semiconductor element, 
 the at least one heater comprises: 
 a first heater configured to heat the second facing surface of the cooling plate a first range close to the first semiconductor element; and 
 a second heater configured to heat the second facing surface of the cooling plate in a second range close to the second semiconductor element, and 
 the heater controller is configured to adjust an amount of heat generation of the first heater in accordance with temperature of the first semiconductor element and adjust an amount of heat generation of the second heater in accordance with temperature of the second semiconductor element. 
 
     
     
       5. The semiconductor device according to  claim 2 , wherein
 the adjuster comprises: 
 a plate actuator configured to deform the cooling plate by applying force to the cooling plate; and 
 a first actuator controller configured to adjust an operation of the plate actuator in accordance with the temperature of the semiconductor module. 
 
     
     
       6. The semiconductor device according to  claim 2 , wherein
 the adjuster comprises: 
 a module actuator configured to deform the semiconductor module by applying force to the semiconductor module; and 
 an actuator controller configured to adjust an operation of the module actuator in accordance with the temperature of the semiconductor module.