Semiconductor component support and semiconductor device

Abstract

A semiconductor component support is provided which includes a component support portion for a semiconductor component to be mounted on the semiconductor component support portion. The component support portion includes a metal part that includes an opening in plan view. The opening of the metal part includes first and second sections. The second section communicates with the first section, and is arranged outside the first section. The second section is wider than the first section. The first section can be at least partially positioned directly under a mount-side main surface of the semiconductor component.

What is claimed is: 
     
       1. A light emitting semiconductor component support comprising:
 a component support portion for a light emitting semiconductor component to be mounted on the component support portion, 
 wherein said component support portion includes a metal part in a film shape that includes openings in plan view, 
 wherein each of said openings of the metal part includes
 a first section, and 
 a second section that communicates with said first section and is arranged outside said first section, the second section being wider than said first section, 
 
 wherein said component support portion is larger than a mount-side main surface of the light emitting semiconductor component that is arranged on or above said component support portion, and said first section is formed linearly with a substantially constant width directly under the mount-side main surface of the light emitting semiconductor component, 
 wherein a part of an outline of said second section extends from said first section in a direction substantially perpendicular to an extension direction of said first section, and the part of the outline of said second section aligns with one rectangular outline where said light emitting semiconductor component is arranged, 
 wherein said metal part of said component support portion has a continuous plane area that extends among said openings, and 
 wherein the total area of parts of the openings of the component support portion that are positioned directly under the light emitting semiconductor component is not less than 10% and not more than 30% of the area of the mount-side main surface of the light emitting semiconductor component. 
 
     
     
       2. A light emitting semiconductor component support comprising:
 a component support portion for a light emitting semiconductor component to be mounted on the component support portion, 
 wherein said component support portion is larger than a mount-side main surface of the light emitting semiconductor component that is arranged on or above said component support portion, 
 wherein said component support portion includes a metal part in a film shape that includes at least two pairs of openings in plan view, 
 wherein one of the pairs of openings are arranged at symmetrical locations with respect to the center vertical line of said component support portion, and another pair of openings are arranged at symmetrical locations with respect to the center horizontal line of said component support portion, 
 wherein each of the openings includes
 a first section, and 
 a second section that communicates with said first section and is arranged outside said first section, the second section being wider than said first section, 
 
 wherein each first section is formed in a linear shape inside one rectangular outline, 
 wherein a part of an outline of said second section extends from said first section in a direction substantially perpendicular to an extension direction of said first section, and the part of the outline of said second section aligns with the one rectangular outline where said light emitting semiconductor component is arranged, 
 wherein said metal part of said component support portion has a continuous plane area that extends among said openings, and 
 wherein the total area of parts of the openings of the component support portion that are positioned directly under the light emitting semiconductor component is not less than 10% and not more than 30% of the area of the mount-side main surface of the light emitting semiconductor component. 
 
     
     
       3. The light emitting semiconductor component support according to  claim 1 , wherein said second section is formed on the outermost area of said component support portion. 
     
     
       4. The light emitting semiconductor component support according to  claim 1 , wherein said second section extends toward the both sides from said first section. 
     
     
       5. The light emitting semiconductor component support according to  claim 1 , wherein said first section extends toward the center of said component support portion. 
     
     
       6. The light emitting semiconductor component support according to  claim 1 , wherein said first section extends in a straight shape. 
     
     
       7. The light emitting semiconductor component support according to  claim 1 , wherein said openings does not divide said metal part so that said metal part is formed in a single part. 
     
     
       8. The light emitting semiconductor component support according to  claim 1 , wherein the openings are arranged at symmetrical locations with respect to the center line of said component support portion. 
     
     
       9. The light emitting semiconductor component support according to  claim 1 , wherein said component support portion has a roughly rectangular shape in plain view,
 wherein said second section is formed on the outermost area of said component support portion, and is spaced away from corners of said metal part. 
 
     
     
       10. The light emitting semiconductor component support according to  claim 1  further comprising an electrically insulating base that holds said component support portion on the electrically insulating base,
 wherein said base has a recessed part or a through hole that is positioned directly under said openings. 
 
     
     
       11. The light emitting semiconductor component support according to  claim 1 , wherein the part of the outline of said second section that aligns with the one rectangular outline is an edge of the metal part defining a portion of the second section. 
     
     
       12. The light emitting semiconductor component support according to  claim 1 , further comprising a base provided with said component support portion and wiring terminal portions connected in communication to an outside of said light emitting semiconductor component support. 
     
     
       13. The light emitting semiconductor component support according to  claim 1 ,
 wherein the light emitting semiconductor component is a light emitting diode or a semiconductor laser, and 
 wherein the part of the outline of said second section aligns with the one rectangular outline where said light emitting diode or said semiconductor laser is arranged. 
 
     
     
       14. The light emitting semiconductor component support according to  claim 2 , wherein two or more second sections are provided as said second section, and partially align with said one rectangular outline. 
     
     
       15. The light emitting semiconductor component support according to  claim 2 , wherein said second section is formed on the outermost area of said component support portion. 
     
     
       16. The light emitting semiconductor component support according to  claim 2 , wherein said second section extends toward the both sides from said first section. 
     
     
       17. The light emitting semiconductor component support according to  claim 2 , wherein said first section extends toward the center of said component support portion. 
     
     
       18. The light emitting semiconductor component support according to  claim 2 , wherein said first section extends in a straight shape. 
     
     
       19. The light emitting semiconductor component support according to  claim 2 , wherein said opening does not divide said metal part so that said metal part is formed in a single part. 
     
     
       20. The light emitting semiconductor component support according to  claim 2 , wherein further comprising an electrically insulating base that holds said component support portion on the electrically insulating base,
 wherein said base has a recessed part or a through hole that is positioned directly under said opening. 
 
     
     
       21. The light emitting semiconductor component support according to  claim 2 , wherein the part of the outline of said second section that aligns with the one rectangular outline is an edge of the metal part defining a portion of the second section. 
     
     
       22. The light emitting semiconductor component support according to  claim 2 , further comprising a base provided with said component support portion and wiring terminal portions connected in communication to an outside of said light emitting semiconductor component support. 
     
     
       23. The light emitting semiconductor component support according to  claim 2 ,
 wherein the light emitting semiconductor component is a light emitting diode or a semiconductor laser, and 
 wherein the part of the outline of said second section aligns with the one rectangular outline where said light emitting diode or said semiconductor laser is arranged. 
 
     
     
       24. A light emitting semiconductor device comprising a light emitting semiconductor component support including: a component support portion for a light emitting semiconductor component to be mounted on the component support portion; and a light emitting semiconductor component that is arranged on or above said component support portion of the light emitting semiconductor component support,
 wherein said component support portion includes a metal part in a film shape that includes openings in plan view, 
 wherein each of said openings of the metal part includes
 a first section, and 
 a second section that communicates with said first section and is arranged outside said first section, the second section being wider than said first section, 
 
 wherein said first section is formed linearly with a substantially constant width directly under a mount-side main surface of the light emitting semiconductor component, 
 wherein a part of an outline of said second section extends from said first section in a direction substantially perpendicular to an extension direction of said first section, and the part of the outline of said second section aligns with one rectangular outline where said light emitting semiconductor component is arranged, 
 wherein said metal part of said component support portion has a continuous plane area that extends among said openings, and 
 wherein the total area of parts of the openings of the component support portion that are positioned directly under the light emitting semiconductor component is not less than 10% and not more than 30% of the area of the mount-side main surface of the light emitting semiconductor component. 
 
     
     
       25. The light emitting semiconductor device according to  claim 24 , wherein the part of the outline of said second section that aligns with the one rectangular outline is an edge of the metal part defining a portion of the second section. 
     
     
       26. The light emitting semiconductor device according to  claim 24 , further comprising a base provided with said component support portion and wiring terminal portions connected in communication to an outside of said light emitting semiconductor component support. 
     
     
       27. The light emitting semiconductor device according to  claim 24 ,
 wherein the light emitting semiconductor component is a light emitting diode or a semiconductor laser, and 
 wherein the part of the outline of said second section aligns with the one rectangular outline where said light emitting diode or said semiconductor laser is arranged. 
 
     
     
       28. A light emitting semiconductor device comprising a light emitting semiconductor component support including: a component support portion for a light emitting semiconductor component to be mounted on the component support portion; and a light emitting semiconductor component that is arranged on or above said component support portion of the light emitting semiconductor component support,
 wherein said component support portion includes a metal part in a film shape that includes at least two pairs of openings in plan view, 
 wherein one of the pairs of openings are arranged at symmetrical locations with respect to the center vertical line of said component support portion, and another pair of openings are arranged at symmetrical locations with respect to the center horizontal line of said component support portion, 
 wherein each of the openings includes
 a first section, and 
 a second section that communicates with said first section and is arranged outside said first section, the second section being wider than said first section, 
 
 wherein each first section is formed in a linear shape inside one rectangular outline, 
 wherein a part of an outline of said second section extends from said first section in a direction substantially perpendicular to an extension direction of said first section, and the part of the outline of said second section aligns with the one rectangular outline where said light emitting semiconductor component is arranged, 
 wherein said metal part of said component support portion has a continuous plane area that extends among said openings, and 
 wherein the total area of parts of the openings of the component support portion that are positioned directly under the light emitting semiconductor component is not less than 10% and not more than 30% of the area of a mount-side main surface of the light emitting semiconductor component. 
 
     
     
       29. The light emitting semiconductor device according to  claim 28 , wherein the part of the outline of said second section that aligns with the one rectangular outline is an edge of the metal part defining a portion of the second section. 
     
     
       30. The light emitting semiconductor device according to  claim 28 , further comprising a base provided with said component support portion and wiring terminal portions connected in communication to an outside of said light emitting semiconductor component support. 
     
     
       31. The light emitting semiconductor device according to  claim 28 ,
 wherein the light emitting semiconductor component is a light emitting diode or a semiconductor laser, and 
 wherein the part of the outline of said second section aligns with the one rectangular outline where said light emitting diode or said semiconductor laser is arranged.