Heat dissipation device

Abstract

A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.

What is claimed is: 
     
       1. A heat dissipation device, comprising:
 a housing having a housing chamber and at least one opening; the housing chamber having a working fluid and a housing wick structure forming on an inner surface of the housing chamber; and the opening is extended through a top side of the housing and communicated with the housing chamber; 
 a heat pipe having a heat pipe wall, a closed end, and an open end; the heat pipe wall having an outer and an inner side; an extended portion in which the heat pipe wall is partially cut away as a notch being integrally extended from the open end, the inner side of the heat pipe wall internally defining a heat pipe chamber communicated with the open end, and a heat pipe wick structure formed on the inner side of the heat pipe wall; and 
 the open end of the heat pipe being inserted into the opening of the housing, and the extended portion of the open end of the heat pipe being connected to a bottom side of the housing chamber with an upper edge of the notch being flush with the upper wick structure of the housing and a vertical edge of the notch perpendicular to the top upper edge of the notch and forming a housing support; the heat pipe chamber being connected to the housing chamber via the open end of the heat pipe, and the heat pipe wick structure being in contact with the housing wick structure. 
 
     
     
       2. The heat dissipation device as claimed in  claim 1 , wherein the heat pipe wick structure formed on the inner side of the heat pipe wall is connected to the housing wick structure formed on the top side in the housing chamber of the housing, whereas the heat pipe wick structure in the extended portion of the heat pipe is connected to the housing wick structure on the bottom side in the housing chamber of the housing. 
     
     
       3. The heat dissipation device as claimed in  claim 2 , wherein the housing has at least one raised portion, which is upwardly extended from the periphery of the opening of housing, and an inner wall of the opening together an inner side of the raised portion of the housing is connected to the outer side of the heat pipe. 
     
     
       4. The heat dissipation device as claimed in  claim 1 , wherein the housing further includes a lateral and a bottom side, which is formed between the top and the bottom side, and the housing chamber is defined between the top, the bottom, and the lateral side. 
     
     
       5. The heat dissipation device as claimed in  claim 1 , wherein the housing is selected from the group consisting of a vapor chamber and a heat pipe. 
     
     
       6. The heat dissipation device as claimed in  claim 1 , wherein a heat radiation fin assembly is vertically extended through the heat pipe and connected to the outer side of the heat pipe wall of the heat pipe. 
     
     
       7. The heat dissipation device as claimed in  claim 1 , wherein a slot is formed between the open end and the extended portion of the heat pipe.