P
US10129968B2ActiveUtilityPatentIndex 40

Electro-conducting tile or floorboard floor covering

Assignee: GERFLORPriority: Mar 2, 2015Filed: Feb 25, 2016Granted: Nov 13, 2018
Est. expiryMar 2, 2035(~8.7 yrs left)· nominal 20-yr term from priority
Inventors:CEYSSON OLIVIERCARIN AURÉLIEN
B32B 7/12B32B 2307/718B32B 2307/732B32B 2262/101B32B 27/304B32B 2264/12B32B 5/024B32B 2255/26E04F 2201/09E04C 1/00E04F 15/105B32B 2471/00B32B 2307/412H05F 3/025B32B 27/18E04F 2290/047B32B 2307/21B32B 27/12B32B 27/20B32B 2250/40E04F 15/107B32B 2307/738B32B 2419/04B32B 3/06B32B 2264/108B32B 2255/10H01B 1/04B32B 5/028B32B 2307/202B32B 5/022
40
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Cited by
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References
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Claims

Abstract

A component, such as a title or a floorboard, has electro-conductive properties for producing a floor covering, or a similar system, in particular for a medium sensitive to static electricity. The component includes a stack of layers integral with one another and including successively: a wearing layer of plastic consisting of granules of conductive material spread out through the thickness of said wearing layer, a first textile reinforcing armature, a middle layer of plastic comprising granules of conductive material spread out through the thickness of said middle layer, a second textile reinforcing armature, and an under layer of plastic material consisting of granules of conductive material spread out through the thickness of said under layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A floor covering component having electro-conductive properties, the floor covering component comprising:
 a stack of layers integral with one another and including: 
 a wearing layer of plastic comprising granules of conductive material spread out through the thickness of said wearing layer; 
 a first textile reinforcing armature; 
 a middle layer of plastic comprising granules of conductive material spread out through the thickness of said middle layer; 
 a second textile reinforcing armature; and 
 an under layer of plastic material comprising granules of conductive material spread out through the thickness of said under layer. 
 
     
     
       2. A floor covering component according to  claim 1 , wherein said first and/or second reinforcing armature are coated with a conductive binder. 
     
     
       3. A floor covering component according to  claim 2 , wherein the first and/or second reinforcing armatures are coated in a conductive binder in a quantity included between 2 and 50 g/m2. 
     
     
       4. A floor covering component according to  claim 3 , wherein the conductive binder contains carbon black in a quantity included between 30% and 80% by weight. 
     
     
       5. A floor covering component according to  claim 1 , wherein the granules of conductive material in the wearing layer and/or the middle layer and the under layer are granules of carbon black. 
     
     
       6. A floor covering component according to  claim 5 , wherein the wearing layer includes between 4% and 10% by weight of conductive granules, which conductive granules contain between 15% and 25% by weight of carbon black. 
     
     
       7. A floor covering component according to  claim 5 , wherein the middle layer and the under layer comprise between 8% and 25% by weight of conductive granules, which conductive granules contain between 20% and 35% by weight of carbon black. 
     
     
       8. A floor covering component according to  claim 1 , wherein the wearing layer is aligned on at least one of its faces, or on both, with a layer of conductive varnish. 
     
     
       9. A floor covering component according to  claim 1 , wherein the under layer is coated, on the reverse side, with a layer of conductive varnish.

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