Circuit package with segmented external shield to provide internal shielding between electronic components

Abstract

A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.

What is claimed: 
     
       1. A module, comprising:
 a circuit package, comprising:
 a plurality of electronic components on a substrate; and 
 a molded compound disposed over the substrate and the plurality of electronic components; and 
 
 an external shield disposed on at least one outer surface of the circuit package, the external shield being segmented into a plurality of external shield partitions that are grounded, respectively, adjacent external shield partitions of the plurality of external shield partitions being separated by a corresponding gap located between adjacent electronic components of the plurality of electronic components, 
 wherein the external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress, and 
 wherein each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components. 
 
     
     
       2. The module of  claim 1 , wherein an amount of shielding of the at least one of the electronic components provided by the corresponding gap between the adjacent external shield partitions is a function of a frequency of the internal electromagnetic radiation and a size of the corresponding gap between the adjacent external shield partitions. 
     
     
       3. The module of  claim 1 , wherein at least one corresponding gap is formed entirely through a thickness of the external shield. 
     
     
       4. The module of  claim 1 , wherein at least one corresponding gap is formed partially through a full thickness of the external shield. 
     
     
       5. The module of  claim 1 , wherein at least one of the external shield partitions is grounded via at least one bond wire contacting the at least one of the external shield partitions and a pad on or in the substrate, or to a conductive or non-conductive material dispensed on the pad. 
     
     
       6. The module of  claim 5 , wherein the at least one bond wire is a truncated bond wire, excluding a top portion of a bond wire loop. 
     
     
       7. The module of  claim 5 , wherein the at least one bond wire is a flattened bond wire, having a flat top portion of a bond loop substantially horizontal with respect to a top surface of the molded compound. 
     
     
       8. The module of  claim 5 , wherein the at least one bond wire comprises at least one of gold (Au), silver (Ag), copper (Cu), palladium coated copper (PCC) and aluminum (Al). 
     
     
       9. The module of  claim 1 , wherein at least one of the external shield partitions is grounded via a ground terminal exposed at a side outer surface of the substrate and connected to a metal plane substrate. 
     
     
       10. The module of  claim 1 , wherein the plurality of external shield partitions are of at least one of copper (Cu), silver (Ag), gold (Au), or aluminum (Al). 
     
     
       11. The module of  claim 1 , wherein the external shield is formed of a conformal metal coat and a stainless steel (SUS) applied to the at least one outer surface of the circuit package. 
     
     
       12. The module of  claim 1 , wherein the external shield is further configured to simultaneously provide protection to other circuit packages from electromagnetic radiation emitted by the circuit package of the module. 
     
     
       13. The module of  claim 1 , wherein the corresponding gap is formed in a closed geometric shape, resulting in correspondingly shaped external shield partition. 
     
     
       14. The module of  claim 13 , wherein the geometric shaped gap provides internal shielding surrounding the at least one of the electronic components. 
     
     
       15. A module, comprising:
 a substrate; 
 a plurality of electronic components on the substrate; 
 a molded compound disposed over the substrate and the plurality of electronic components; and 
 an external shield comprising a conformal metal coat disposed on at least one outer surface of the molded compound, the conformal metal coat being segmented into a plurality of partitions that are grounded, respectively, adjacent partitions of the plurality of partitions being separated by a corresponding gap located between adjacent electronic components of the plurality of electronic components, 
 wherein the external shield is configured to protect the plurality of electronic components from external electromagnetic radiation and environmental stress, and 
 wherein each corresponding gap separating the adjacent partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.