Ultrasonic polishing systems and methods of polishing brittle components for electronic devices

Abstract

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

What is claimed is: 
     
       1. An ultrasonic polishing system for polishing a non-planar feature formed in a brittle component, the system comprising:
 an ultrasonic driver; 
 a polishing head operatively coupled to the ultrasonic driver and having a surface shape that corresponds to a shape of the non-planar feature formed in the brittle component; and 
 an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head; wherein 
 the ultrasonic driver is configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component. 
 
     
     
       2. The ultrasonic polishing system of  claim 1 , wherein the abrasive slurry comprises a solid abrasive material suspended in a liquid, the solid abrasive material having a hardness greater than the brittle component. 
     
     
       3. The ultrasonic polishing system of  claim 2 , wherein a gap formed between the polishing head and the non-planar feature of the brittle component is greater than a grain size of the solid abrasive material. 
     
     
       4. The ultrasonic polishing system of  claim 3 , wherein the polishing head is displaced to:
 contact the non-planar feature of the brittle component; and 
 to form the gap between the polishing head and the non-planar feature of the brittle component that is approximately 150% of the grain size of the solid abrasive material. 
 
     
     
       5. The ultrasonic polishing system of  claim 1 , further comprising an actuating gantry coupled to the ultrasonic driver and configured to move the polishing head in at least one of:
 a first direction; and 
 a second direction, perpendicular to the first direction. 
 
     
     
       6. The ultrasonic polishing system of  claim 1 , wherein the surface shape of the polishing head comprises at least one of:
 a substantially non-linear transition portion; 
 a groove; 
 a protrusion; or 
 an aperture. 
 
     
     
       7. The ultrasonic polishing system of  claim 1 , further comprising an insert surrounding the brittle component and configured to substantially secure the brittle component while the ultrasonic driver displaces the polishing head. 
     
     
       8. The ultrasonic polishing system of  claim 1  further comprising a media flow system in fluid communication with the abrasive slurry, the media flow system configured to recirculate the abrasive slurry. 
     
     
       9. A method for polishing a non-planar feature of a brittle component, the method comprising:
 positioning a polishing head adjacent the non-planar feature of the brittle component, the brittle component at least partially submerged in an abrasive slurry disposed within a housing; 
 moving, at an ultrasonic frequency, at least one of the housing or the polishing head in at least one of:
 a first direction; or 
 a second direction, perpendicular to the first direction; and 
 
 in response to moving at least one of the housing of the polishing head, displacing the abrasive slurry to abrade and polish the non-planar feature of the brittle component; wherein 
 the polishing head comprises a surface shape that corresponds to a shape of the non-planar feature of the brittle component. 
 
     
     
       10. The method of  claim 9 , wherein moving the polishing head comprises repeatedly displacing the polishing head toward and away from the non-planar feature of the brittle component. 
     
     
       11. The method of  claim 10 , wherein displacing the polishing head comprises moving the polishing head to:
 contact the non-planar feature of the brittle component; and 
 form a gap between the polishing head and the non-planar feature of the brittle component, the gap equal to approximately 150% of a grain size of a solid abrasive material of the abrasive slurry. 
 
     
     
       12. The method of  claim 9 , wherein moving the housing comprises repeatedly displacing the brittle component toward and away from the polishing head. 
     
     
       13. The method of  claim 9 , wherein displacing the abrasive slurry to abrade and polish the non-planar feature of the brittle component comprises continuously recirculating the abrasive slurry over the non-planar feature. 
     
     
       14. The method of  claim 9 , further comprising securing the brittle component within the housing prior to positioning the polishing head adjacent the non-planar feature of the brittle component. 
     
     
       15. An ultrasonic polishing system comprising:
 a housing for receiving a brittle component comprising a non-planar feature; 
 a polishing head positioned within the housing, the polishing head having a surface shape that corresponds to a shape of the non-planar feature formed in the brittle component; 
 an abrasive slurry positioned within the housing, the abrasive slurry comprising a solid abrasive material suspended in a liquid; and 
 an ultrasonic driver configured to move at least one of the housing or the polishing head at an ultrasonic frequency to polish the non-planar feature of the brittle component using the abrasive slurry. 
 
     
     
       16. The ultrasonic polishing system of  claim 15 , wherein
 the polishing head comprises a projection having a shape that corresponds to a shape of a groove formed in the brittle component. 
 
     
     
       17. The ultrasonic polishing system of  claim 15 , wherein
 the polishing head comprises a recess having a shape that corresponds to a shape of a protrusion formed in the brittle component. 
 
     
     
       18. The ultrasonic polishing system of  claim 15 , wherein
 the polishing head comprises a T-shaped structure having a shape corresponding to a shape of an aperture formed in the brittle component and a portion of the brittle component surrounding the aperture. 
 
     
     
       19. The ultrasonic polishing system of  claim 15 , wherein a gap formed between the polishing head and the non-planar feature of the brittle component is greater than a grain size of the solid abrasive material. 
     
     
       20. The ultrasonic polishing system of  claim 15 , wherein the solid abrasive material has a hardness greater than the brittle component.