P
US10150277B2ActiveUtilityPatentIndex 69

Connection element, connection arrangement, method for producing a connection element and method for producing a connection arrangement

Assignee: AIRBUS DEFENCE & SPACE GMBHPriority: Dec 8, 2015Filed: Dec 7, 2016Granted: Dec 11, 2018
Est. expiryDec 8, 2035(~9.4 yrs left)· nominal 20-yr term from priority
Inventors:MEER THOMAS
B32B 2310/027B29C 65/08B32B 27/08B32B 27/286B32B 27/28B32B 2250/03B32B 27/365B32B 2250/24B29C 65/0672B32B 27/281B32B 27/285B32B 2270/00B29C 65/0627B32B 2307/308B32B 7/10B32B 27/38B32B 2262/106B32B 2250/02B32B 37/04B29C 65/0645B29C 65/5007B29C 66/91951B29C 66/92921B29C 66/92443B29C 66/91921B29C 65/5021B29C 66/3474B29C 66/91411B29C 66/73117B29C 65/06B29C 66/91445B29C 65/8253B29C 66/474B29C 66/721B29C 66/723B29C 65/4815B29C 66/73755B29C 66/73941B29C 66/7212B29C 66/131B29C 66/112B29C 66/73115B29C 66/71B29C 66/43B29C 66/7394B29C 65/5057B29C 66/73921B29C 66/1122
69
PatentIndex Score
2
Cited by
6
References
34
Claims

Abstract

A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A connection element comprising:
 a composite component comprising a cured epoxy resin; 
 a first layer comprising a first thermoplastic polymer; 
 an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer; 
 wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; 
 wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; 
 wherein the curing temperature of the epoxy resin is up to 180° C.; 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and 
 wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer. 
 
     
     
       2. The connection element of  claim 1 , wherein the first layer is provided externally on the composite component. 
     
     
       3. The connection element of  claim 1 , wherein the first layer consists of the first thermoplastic polymer. 
     
     
       4. The connection element of  claim 1 , wherein the first thermoplastic polymer is selected from at least one of a group consisting of polyetherimide, polysulphone, polyphenylsulphone, polyhydroxyether, and polycarbonate. 
     
     
       5. The connection element of  claim 1 , wherein the first layer has a thickness in a range of greater than 50 micrometers (μm) to less than or equal to 300 μm. 
     
     
       6. The connection element of  claim 5 , wherein the thickness of the first layer is in a range of from 100 μm to 150 μm. 
     
     
       7. The connection element of  claim 1 , wherein the composite component comprises a fiber-reinforced plastics material. 
     
     
       8. The connection element of  claim 7 , wherein the fiber-reinforced plastics material is configured as a carbon-fiber-reinforced plastics material. 
     
     
       9. The connection element of  claim 1 , wherein the composite component comprises a sandwich structure comprising a fiber-reinforced plastics material cover layer. 
     
     
       10. The connection element of  claim 9 , wherein the fiber-reinforced plastics material cover layer is a carbon-fiber-reinforced plastics material cover layer. 
     
     
       11. The connection element of  claim 1 , comprising a second layer having a second thermoplastic polymer arranged on the first layer. 
     
     
       12. The connection element of  claim 11 , wherein the second thermoplastic polymer is selected from at least one of a group consisting of polyetheretherketone, polyethersulphone, polyamide, and polyphenylsulphone. 
     
     
       13. The connection element of  claim 1 , wherein the intermediate layer has a thickness in a range of from 20 micrometers (μm)to 100 μm or from 30 μm to 80 μm. 
     
     
       14. The connection element of  claim 13 , wherein the thickness of the intermediate layer has a is in a range of from 30 μm to 80 μm. 
     
     
       15. The connection element of  claim 1 , wherein the intermediate layer comprises a continuous concentration transition from the epoxy resin to the first thermoplastic polymer. 
     
     
       16. The connection element of  claim 1 ., wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the composite component is greater than 1 micrometer (μm) and is less than 1 μm in the region of the intermediate layer that is adjacent to the first layer. 
     
     
       17. The connection element of  claim 16 , wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the composite component is in a range of from 1 μm to 20 μm. 
     
     
       18. The connection element of  claim 16 , wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the first layer is less than 0.1 μm. 
     
     
       19. A connection arrangement comprising:
 a connection element comprising:
 a composite component comprising a cured epoxy resin; 
 a first layer comprising a first thermoplastic polymer; and 
 an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer; 
 wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; 
 wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; 
 wherein the curing temperature of the epoxy resin is up to 180° C.; 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 18° C., in particular higher than 200° C.; and 
 wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer; and 
 
 a component connected to the connection element, wherein the component is welded to the first layer of the connection element. 
 
     
     
       20. The connection arrangement of  claim 19 , wherein the component is welded to the first layer of the connection element by friction welding. 
     
     
       21. The connection arrangement of  claim 20 , wherein the component is welded to the first layer of the connection element by circular vibration friction welding. 
     
     
       22. A connection arrangement comprising:
 a connection element comprising:
 a composite component comprising a cured epoxy resin: 
 a first layer comprising a first thermoplastic polymer: 
 an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer and 
 a second layer comprising a second thermoplastic polymer arranged on the first layer; 
 wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin, 
 wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; 
 wherein the curing temperature of the epoxy resin is up to 180° C.; 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and 
 wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer; and 
 
 a component connected to the connection element, wherein the component is welded to the second layer of the connection element. 
 
     
     
       23. The connection arrangement of  claim 22 , wherein the component is welded to the second layer of the connection element by friction welding. 
     
     
       24. The connection arrangement of  claim 23 , wherein the component is welded to the second layer of the connection element by circular vibration friction welding. 
     
     
       25. A method for manufacturing a connection element, the method comprising:
 providing a raw composite component comprising at least one uncured epoxy resin; 
 applying a first layer comprising a first thermoplastic polymer to the raw composite component, the first thermoplastic polymer having a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; 
 and 
 curing the raw composite component at a temperature of at least 150° C., the first thermoplastic polymer dissolving at a temperature of at least 150° C. in the at least one uncured epoxy resin, 
 wherein the curing temperature of the epoxy resin is up to 180° C., and 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C. 
 
     
     
       26. A method for producing a connection arrangement, the method comprising:
 providing a connection element comprising:
 a composite component comprising a cured epoxy resin: 
 a first layer comprising a first thermoplastic polymer: 
 an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer 
 wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; 
 wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; 
 wherein the curing temperature of the epoxy resin is up to 180° C., and 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C. and 
 
 welding a component, which is configured to be connected to the connection element, to the first layer of the connection element by friction welding. 
 
     
     
       27. The method of  claim 26 , wherein the friction welding is implemented in a form of vibration friction welding. 
     
     
       28. The method of  claim 27 , wherein the vibration friction welding is implemented in a form of circular vibration friction welding. 
     
     
       29. A method for producing a connection arrangement, the method comprising:
 providing a connection element comprising:
 a composite component comprising a cured epoxy resin; 
 a first layer comprising a first thermoplastic polymer; 
 an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer; and 
 a second layer comprising a second thermoplastic polymer arranged on the first layer; 
 wherein the first thermoplastic polymer has a melting point, in particular glass transition temperature, above a curing temperature of the epoxy resin; 
 wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; 
 wherein the curing temperature of the epoxy resin is up to 180° C.; and 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and 
 
 welding a component, which is configured to be connected to the connection element, to the second layer of the connection element by friction welding. 
 
     
     
       30. The method of  claim 29 , wherein the friction welding is implemented in a form of vibration friction welding. 
     
     
       31. The method of  claim 30 , wherein the vibration friction welding is implemented in a form of circular vibration friction welding. 
     
     
       32. A method for producing a connection arrangement comprising:
 providing a connection element produced by a method comprising:
 providing a raw composite component comprising at least one uncured epoxy resin; 
 applying a first layer comprising a first thermoplastic polymer to the raw composite component, the first thermoplastic polymer having a melting point, in particular glass transition temperature, above a curing temperature of the epoxy resin; and 
 curing the raw composite component at a temperature of at least 150° C., the first thermoplastic polymer dissolving at a temperature of at least 150° C. in the at least one uncured epoxy resin; 
 wherein the curing temperature of the epoxy resin is up to 180° C.; and 
 wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and 
 
 welding a component, which is configured to be connected to the connection element, to the first layer of the connection element by friction welding. 
 
     
     
       33. The method of  claim 32 , wherein the friction welding is implemented in a form of vibration friction welding. 
     
     
       34. The method of  claim 33 , wherein the vibration friction welding is implemented in a form of circular vibration friction welding.

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