Optoelectronic package

Abstract

An optoelectronic package includes a substrate, a light emitting chip, an optical sealant, and an optical scattering layer. The substrate has a carrying plane and a wiring layer formed on the carrying plane. The light emitting chip used for emitting a light ray is mounted on the carrying plane and electrically connected to the wiring layer. The optical sealant covers the carrying plane and wraps the light emitting chip. The optical sealant is located in the path of the light ray. The optical scattering layer covers the optical sealant. The optical sealant located in the path of the light ray is formed between the substrate and the optical scattering layer. Preferably, the refractive index of the optical sealant is larger than or equal to the refractive index of the optical scattering layer.

What is claimed is: 
     
       1. An optoelectronic package, comprising:
 a substrate having a carrying plane and a wiring layer, the wiring layer is formed on the carrying plane; 
 a light emitting chip used for emitting a light ray mounted on the carrying plane and electrically connected to the wiring layer; 
 an optical sealant covering the carrying plane and wrap the light emitting chip, wherein the optical sealant is located in a path of the light ray; and 
 an optical scattering layer covering the optical sealant, wherein the optical sealant is formed between the substrate and the optical scattering layer, and the optical scattering layer is located in the path of the light ray, wherein a refractive index of the optical sealant is larger than or equal to a refractive index of the optical scattering layer; 
 wherein both the optical sealant and the optical scattering layer have a plurality of scattering particles for scattering the light ray, and a weight percent of the scattering particles in the optical sealant is less than a weight percent of the scattering particles in the optical scattering layer. 
 
     
     
       2. The optoelectronic package of  claim 1 , wherein the light emitting chip has a light emitting surface, and the optical sealant covers and touches the light emitting surface of the light emitting chip. 
     
     
       3. The optoelectronic package of  claim 2 , wherein the light emitting chip further has a back surface opposite to the light emitting surface, and the back surface thereof faces to the carrying plane of the substrate. 
     
     
       4. The optoelectronic package of  claim 1 , wherein the light emitting chip is a LED chip. 
     
     
       5. The optoelectronic package of  claim 1 , wherein a sidewall of the optical sealant is flush with a sidewall of the optical scattering layer. 
     
     
       6. The optoelectronic package of  claim 1 , wherein the optical sealant contains fluorescent material, and the fluorescent material is stimulated by the light ray to emit fluorescent light rays. 
     
     
       7. The optoelectronic package of  claim 1 , wherein an optical transmittance of the optical scattering layer ranges between 50% and 90%. 
     
     
       8. The optoelectronic package of  claim 1 , wherein the light emitting chip is mounted on the carrying plane by wire bonding. 
     
     
       9. The optoelectronic package of  claim 1 , wherein the light emitting chip is mounted on the carrying plane by flip-chip type. 
     
     
       10. The optoelectronic package of  claim 1 , the substrate is a PCB or a package carrier. 
     
     
       11. The optoelectronic package of  claim 1 , wherein a number of the light emitting chips are plural and the number of light emitting chips are mounted on the substrate by Chip On Board (COB). 
     
     
       12. The optoelectronic package of  claim 1 , wherein the optical scattering layer is a single layer structure. 
     
     
       13. The optoelectronic package of  claim 1 , wherein the optical scattering layer is a multilayer structure. 
     
     
       14. The optoelectronic package of  claim 1 , wherein the optical scattering layer comprises a plurality of scattering agents and silicone, in which the scattering agents have the scattering particles, and a weight percent of the scattering agents and silicone ranges between 1:5 and 5:1.