Resistor element and method of manufacturing the same

Abstract

A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

What is claimed is: 
     
       1. A resistor element comprising:
 a base substrate; 
 a resistor layer disposed on one surface of the base substrate; 
 a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other; 
 a third electrode layer immovably disposed in electrical contact with the resistor layer in a space separating the first electrode layer and the second electrode layer and spaced apart from the first electrode layer and the second electrode layer; 
 a conductive resin electrode disposed on at least one end of the third electrode layer; and 
 first to third plating layers covering the first to third electrode layers, respectively. 
 
     
     
       2. The resistor element of  claim 1 , wherein the third plating layer covers the third electrode layer and the conductive resin electrode. 
     
     
       3. The resistor element of  claim 1 , wherein the conductive resin electrode includes conductive particles and a base resin. 
     
     
       4. The resistor element of  claim 3 , wherein the base resin is as a curable resin. 
     
     
       5. A resistor element comprising:
 a base substrate; 
 a resistor layer disposed on one surface of the base substrate; 
 a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other; 
 a third electrode layer disposed in a space separating the first electrode layer and the second electrode layer and spaced apart from the first electrode layer and the second electrode layer; 
 a conductive resin electrode disposed on at least one end of the third electrode layer; and 
 first to third plating layers covering the first to third electrode layers, respectively, 
 wherein the resistor layer includes a first resistor part connected to the first electrode and the third electrode to form resistance, and a second resistor part connected to the second electrode and the third electrode to form resistance, and 
 the first resistor part is integrally formed with the second resistor part. 
 
     
     
       6. The resistor element of  claim 1 , wherein the resistor layer includes a first resistor part connected to the first electrode and the third electrode to form resistance, and a second resistor part connected to the second electrode and the third electrode to form resistance, and
 any one of the first resistor part and the second resistor part is trimmed according to a resistance value thereof to determine a resistance value of the remaining resistor part. 
 
     
     
       7. The resistor element of  claim 1 , further comprising a protective layer disposed on portions of a surface of the resistor layer exposed between the first to third electrode layers. 
     
     
       8. A method of manufacturing a resistor element comprising:
 preparing a base substrate; 
 forming a resistor layer on one surface of the base substrate; 
 forming first to third electrode layers at fixed locations on and in electrical contact with the resistor layer; 
 controlling a resistance value by measuring resistance between two or more electrode layers among the first to third electrode layers; 
 forming a conductive resin electrode on at least one end of the third electrode layer by applying a conductive paste thereto; and 
 forming first to third plating layers covering the first to third electrode layers, respectively. 
 
     
     
       9. The method of  claim 8 , wherein the third plating layer covers the third electrode layer and the conductive resin electrode. 
     
     
       10. The method of  claim 8 , wherein the conductive paste includes conductive particles and a base resin. 
     
     
       11. The method of  claim 10 , wherein the base resin includes a curable resin, and
 the conductive resin electrode is formed by curing the curable resin. 
 
     
     
       12. The resistor element of  claim 1 , wherein the first and second electrode layers are spaced apart from each other in a length direction,
 the third electrode layer is spaced apart from an edge of the base substrate in a width direction orthogonal to the length direction, and 
 the conductive resin electrode is disposed on the one surface of the base substrate between the third electrode layer and the edge of the base substrate in the width direction. 
 
     
     
       13. The method of  claim 8 , wherein the first, second, and third electrode layers are formed at locations spaced apart from each other in a length direction on the resistor layer,
 the third electrode layer is formed to have the at least one end thereof be spaced apart from an edge of the base substrate in a width direction orthogonal to the length direction, and 
 the conductive resin electrode is formed on the one surface of the base substrate between the at least one end of the third electrode layer and the edge of the base substrate in the width direction.