Fan module and electronic device

Abstract

A fan module and an electronic device are provided. The fan module includes a fan housing, a fan and a heat dissipating member. The fan housing has an open side and an enclosing side which surrounds the open side, wherein the open side is provided with a first airflow guiding channel. The fan is disposed within the fan housing, the heat dissipating member is disposed at the open side, the heat dissipating member has a second airflow guiding channel which is communicated with the first airflow guiding channel, and the air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting. The electronic device includes a chassis and the fan module, and the fan module is mounted in the chassis.

What is claimed is: 
     
       1. A fan module, comprising:
 a fan housing, having an open side and an enclosing side which surrounds the open side, wherein a first airflow guiding channel is disposed at the open side; 
 a fan, disposed in the fan housing; and 
 a heat dissipating member, disposed at the open side, wherein the heat dissipating member has a second airflow guiding channel, the second airflow guiding channel is communicated with the first airflow guiding channel, and an air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting, 
 wherein the heat dissipating member comprises a heat sink body and a plurality of heat dissipating fins, and the heat dissipating fins are disposed at a near side, which is near to the fan, of the heat sink body and a far side, which is far from the fan, of the heat sink body, 
 wherein each of the heat dissipating fins located at the far side has a length protruded from the heat sink body, the length of each of the heat dissipating fins located at an outlet of the second airflow guiding channel is shorter than the length of each of the rest of the heat dissipating fins located at the far side. 
 
     
     
       2. The fan module as claimed in  claim 1 , wherein the fan housing has a side wall and a guiding wall, and the first airflow guiding channel is formed by the side wall and the guiding wall. 
     
     
       3. The fan module as claimed in  claim 1 , wherein the second airflow guiding channel is formed by hollowing out a portion of the heat dissipating member. 
     
     
       4. The fan module as claimed in  claim 1 , wherein the heat dissipating member further comprises a heat pipe disposed on the heat sink body. 
     
     
       5. An electronic device, comprising:
 a chassis; 
 a fan module, disposed within the chassis, comprising: 
 a fan housing, having an open side and an enclosing side which surrounds the open side, wherein a first airflow guiding channel is disposed at the open side; 
 a fan, disposed in the fan housing; and 
 a heat dissipating member, disposed at the open side, wherein the heat dissipating member has a second airflow guiding channel, the second airflow guiding channel is communicated with the first airflow guiding channel, and an air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting, 
 wherein the heat dissipating member comprises a heat sink body and a plurality of heat dissipating fins, and the heat dissipating fins are disposed at a near side, which is near to the fan, of the heat sink body and a far side, which is far from the fan, of the heat sink body, 
 wherein each of the heat dissipating fins located at the far side has a length protruded from the heat sink body, the length of each of the heat dissipating fins located at an outlet of the second airflow guiding channel is shorter than the length of each of the rest of the heat dissipating fins located at the far side, so as to form a yielding area. 
 
     
     
       6. The electronic device as claimed in  claim 5 , wherein the fan housing has a side wall and a guiding wall, and the first airflow guiding channel is formed by the side wall and the guiding wall. 
     
     
       7. The electronic device as claimed in  claim 5 , wherein the second airflow guiding channel is formed by hollowing out a portion of the heat dissipating member. 
     
     
       8. The electronic device as claimed in  claim 5 , wherein the chassis has a heat dissipating outlet, and the yielding area is correspondingly located in the heat dissipating outlet. 
     
     
       9. The electronic device as claimed in claim 5 , wherein the heat dissipating member further comprises a heat pipe disposed on the heat sink body.