US10244623B2ActiveUtilityPatentIndex 52
Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
Est. expiryDec 2, 2034(~8.4 yrs left)· nominal 20-yr term from priority
H05K 1/0284H05K 3/0058B29C 65/72H05K 2201/0323H05K 3/20H05K 2201/0133H05K 1/028H05K 3/125B33Y 80/00H05K 1/0283B29L 2031/3425H05K 1/092H05K 1/0296B33Y 10/00
52
PatentIndex Score
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Cited by
9
References
9
Claims
Abstract
A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A system for electrically connecting uneven two-dimensional (2-D) or three-dimensional (3-D) surfaces of an object, comprising:
a printer;
a stretchable substrate comprising a first surface and a second surface;
a conductive material; and
the object, wherein
an amount of the conductive material required is based on a length between two points on a surface of the object,
the surface of the object includes at least an uneven surface,
the printer deposits the conductive material on the first surface of the stretchable substrate, and
the second surface of the stretchable substrate mates with the object.
2. The system of claim 1 , wherein the amount of the conductive material deposited is based on a calculated volume of the amount of the conductive material required to electrically connect the two points of the object.
3. The system of claim 1 , wherein the conductive material is a stretchable conductive material.
4. The system of claim 1 , wherein the conductive material forms a patterned circuit on the stretchable substrate.
5. The system of claim 4 , wherein the patterned circuit is a horseshoe patterned circuit.
6. The system of claim 1 , wherein the conductive material is conductive ink.
7. The system of claim 6 , wherein the conductive ink includes conductive particles.
8. The system of claim 1 , wherein the second surface of the stretchable substrate includes an adhesive material.
9. The system of claim 1 , wherein the printer is a 3-D printer and the 3-D printer further deposits the conductive material into a reservoir area within the stretchable substrate.Cited by (0)
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