P
US10247378B2ActiveUtilityPatentIndex 61

Metal PCB, headlight module having metal PCB applied thereto, and method for assembling headlight module

Assignee: ECOCAB CO LTDPriority: Dec 31, 2015Filed: Dec 28, 2016Granted: Apr 2, 2019
Est. expiryDec 31, 2035(~9.5 yrs left)· nominal 20-yr term from priority
Inventors:KIM CHANG-WON
F21S 41/151H10W 90/00H10W 70/688H10W 70/611H05K 1/0284F21S 45/47F21S 41/192F21S 41/141H05K 2201/09063H05K 1/02H05K 1/189F21S 43/195F21S 43/14F21V 29/503H05K 2201/091F21V 29/89H05K 1/18F21Y 2115/10H05K 2201/10106H05K 1/181H05K 2201/09054H05K 3/0061H05K 1/05H01L 33/64H01L 23/5387H01L 33/62H01L 2933/0066H01L 33/647H01L 25/0753H01L 2933/0075H01L 33/641H10H 20/0365H10H 20/0364H10H 20/8585H10H 20/8581H10H 20/858H10H 20/857
61
PatentIndex Score
1
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References
12
Claims

Abstract

Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A headlight module comprising:
 a back plate having a body extended in a specific length in accordance with a headlight housing; and 
 a metal PCB connected to the back plate and having a plurality of LED chips mounted thereon through patterns integrated with the metal PCB, the metal PCB being coupled with the back plate through a coupler, wherein the patterns are formed on a base made of metal, and chip mounting parts having the LED chips mounted thereon are disposed to be bent, 
 wherein a coupling part of the back plate coupled to the headlight housing is provided at a bottom of the body and a plurality of consecutive support surfaces is provided on the back plate, 
 wherein a plurality of board mounting parts having identical or different slopes are integrated and protruded from respective tops of the plurality of consecutive support surfaces, and 
 wherein each of the chip mounting parts is bent at a specific angle with respect to the base through a cut face on the base. 
 
     
     
       2. A method of assembling a headlight module, comprising steps of:
 preparing a metal PCB which includes patterns so that a plurality of LED chips is mounted on a base made of metal equipped with bending grooves for multi-faced bending at a bottom of the base, wherein a plurality of chip mounting parts is banked so that angles of the LED chips are relatively adjusted with respect to the metal PCB; 
 preparing a back plate in which board mounting parts, each one having a slope corresponding to the respective chip mounting part, protrude forward from support surfaces; and 
 coupling the chip mounting parts of the metal PCB to the back plate in an inclined state through a coupler when the metal PCB is coupled to a top of the back plate, 
 wherein the coupler, the board mounting parts, and the support surfaces are integrated in the back plate through a mold, 
 a downward location determination jaw and an upward location determination jaw preventing a downward and upward movement of each of the bent chip mounting parts, respectively, are integrated in each of the support surfaces so that an angle of each of the chip mounting parts is adjusted and firmly fixed when the metal PCB is coupled, and 
 the coupler includes a hook to couple the back plate and the metal PCB. 
 
     
     
       3. The method of  claim 2 , wherein the chip mounting parts and the mounting surfaces are simultaneously formed on the metal PCB by pressing the chip mounting parts and the mounting surfaces using the mold formed to correspond to the board mounting parts and the support surfaces in the back plate. 
     
     
       4. The method of  claim 2 , wherein the chip mounting parts are formed by blanking at least one side of the metal PCB by a pair of blanking molds in a state in which the patterns have been connected. 
     
     
       5. A headlight module, comprising:
 a back plate having a body extended in a specific length in accordance with a headlight housing; and 
 a metal PCB connected to the back plate and having a plurality of LED chips mounted thereon through patterns integrated with the metal PCB, the metal PCB being coupled with the back plate through a coupler, wherein the patterns are formed on a base made of metal and chip mounting parts having the LED chips mounted thereon are disposed to be bent, 
 wherein a coupling part of the back plate coupled to the headlight housing is provided at a bottom of the body and a plurality of consecutive support surfaces is provided on the back plate, 
 wherein a plurality of board mounting parts having identical or different slopes are integrated and protruded from respective tops of the plurality of consecutive support surfaces, and 
 wherein the coupler includes a latching hook and a fixing hook, each having an inclined surface thereon, and each of the latching hook and the fixing hook is coupled to a support jaw protruding from one side of the metal PCB. 
 
     
     
       6. The headlight module of  claim 5 , wherein each of the board mounting parts comprises:
 a triangular block protruding from the back plate to have a slope on the respective support surface, and 
 a fixed jaw disposed on one side of the triangular block to prevent an upward motion of the metal PCB. 
 
     
     
       7. The headlight module of  claim 5 , wherein each of the board mounting parts comprises:
 triangular walls spaced apart from each other and each protruding from the back plate to have a slope, 
 a downward location determination jaw disposed on an inside of each triangular wall, and 
 an upward location determination jaw disposed on one side of each triangular wall. 
 
     
     
       8. The headlight module of  claim 7 , wherein each of the board mounting parts further comprises:
 guide protrusions protruding on an inside of each triangular wall to be coupled to the guide holes. 
 
     
     
       9. The headlight module of  claim 5 , wherein the back plate has an air flow hole depressed and formed in a portion coming into contact with the metal PCB. 
     
     
       10. The headlight module of  claim 5 , wherein the metal PCB is a thin plate shape bending through a plurality of bending grooves provided at a bottom of the chip mounting part, and
 wherein the plurality of the bending grooves are arranged to be parallel to each other or to form a triangle, and one of the plurality of the bending grooves has one of V, U and C shapes. 
 
     
     
       11. The headlight module of  claim 5 , wherein one of the plurality of consecutive support surfaces is a stepped shape configuration or a configuration of an inclined shape having a different angle. 
     
     
       12. The headlight module of  claim 5 , wherein the metal PCB has a configuration in which a flexible board having the LED chips is bonded to a top of a heat-dissipation plate made of aluminum.

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