Surface-mounted signal transceiver module with multi-signal feed-in

Abstract

A surface-mounted signal transceiver module with multi-signal feed-in includes an antenna unit, a circuit board and a signal-integrating component. A radiation layer is arranged on a substrate-front face of the antenna unit. A ground layer is arranged on a substrate-back face. A first-feed-in line and a second-feed-in line are arranged on a substrate-side face. A first-ground face arranged on a circuit-board-front face of the circuit board is connected to the ground layer. A first contact and a second contact of the circuit board are connected to the first-feed-in line and the second-feed-in line respectively, and electrically connected to a fixing-connecting area arranged on a circuit-board-back face. The signal-integrating component is electrically connected to the fixing-connecting area, and connected to the first-feed-in line and the second-feed-in line through the first contact and the second contact respectively, to integrate signals sent through the first-feed-in line and the second-feed-in line.

What is claimed is: 
     
       1. A signal transceiver module in a surface-mounted type with multi-signal feed-in comprising:
 an antenna unit comprising a substrate, a radiation layer, a ground layer, a first-feed-in line and a second-feed-in line, the substrate comprising a substrate-front face, a substrate-back face and a substrate-side face, the radiation layer arranged on the substrate-front face of the substrate, the ground layer arranged on the substrate-back face of the substrate, the first-feed-in line and the second-feed-in line arranged on the substrate-side face of the substrate, one side of the first feed-in line and one side of the second feed-in line extending to the substrate-front face of the substrate respectively to form coupled electrical connections with the radiation layer, the other side of the first feed-in line and the other side of the second feed-in line extending to the substrate-back face of the substrate respectively, neither the other side of the first feed-in line nor the other side of the second feed-in line electrically connected to the ground layer; 
 a circuit board comprising a circuit-board-front face, a circuit-board-back face, a first-ground face, a first contact, a second contact and a fixing-connecting area, the first-ground face, the first contact and the second contact arranged on the circuit-board-front face, the first-ground face electrically connected to the ground layer, the first contact and the second contact electrically connected to the first-feed-in line and the second-feed-in line respectively, the first contact and the second contact electrically connected to the fixing-connecting area arranged on the circuit-board-back face through the circuit board respectively; and 
 a signal-integrating component electrically connected to and arranged on the fixing-connecting area, so the signal-integrating component is electrically connected to the first-feed-in line and the second-feed-in line through the first contact and the second contact respectively, 
 wherein the first-feed-in line and the second-feed-in line are arranged on the substrate-front face, the substrate-side face and the substrate-back face of the substrate with a mutually perpendicular status; the signal-integrating component is configured to integrate a plurality of signals sent through the first-feed-in line and the second-feed-in line; 
 wherein the first-ground face is cross-shaped. 
 
     
     
       2. The signal transceiver module in  claim 1 , wherein an area of the radiation layer is less than an area of a substrate surface of the substrate. 
     
     
       3. The signal transceiver module in  claim 1 , wherein an area of the ground layer is equal to an area of the substrate-back face. 
     
     
       4. A signal transceiver module in a surface-mounted type with multi-signal feed-in comprising:
 an antenna unit comprising a substrate, a radiation layer, a ground layer, a first-feed-in line and a second-feed-in line, the substrate comprising a substrate-front face, a substrate-back face and a substrate-side face, the radiation layer arranged on the substrate-front face of the substrate, the ground layer arranged on the substrate-back face of the substrate, the first-feed-in line and the second-feed-in line arranged on the substrate-side face of the substrate, one side of the first feed-in line and one side of the second feed-in line extending to the substrate-front face of the substrate respectively to form coupled electrical connections with the radiation layer, the other side of the first feed-in line and the other side of the second feed-in line extending to the substrate-back face of the substrate respectively, neither the other side of the first feed-in line nor the other side of the second feed-in line electrically connected to the ground layer; 
 a circuit board comprising a circuit-board-front face, a circuit-board-back face, a first-ground face, a first contact, a second contact and a fixing-connecting area, the first-ground face, the first contact and the second contact arranged on the circuit-board-front face, the first-ground face electrically connected to the ground layer, the first contact and the second contact electrically connected to the first-feed-in line and the second-feed-in line respectively, the first contact and the second contact electrically connected to the fixing-connecting area arranged on the circuit-board-back face through the circuit board respectively; and 
 a signal-integrating component electrically connected to and arranged on the fixing-connecting area, so the signal-integrating component is electrically connected to the first-feed-in line and the second-feed-in line through the first contact and the second contact respectively, 
 wherein the first-feed-in line and the second-feed-in line are arranged on the substrate-front face, the substrate-side face and the substrate-back face of the substrate with a mutually perpendicular status; the signal-integrating component is configured to integrate a plurality of signals sent through the first-feed-in line and the second-feed-in line; 
 wherein the circuit board further comprises four second-ground faces; four sides of the first-ground face are adjacent to the four second-ground faces; the second-ground face is electrically connected to the ground layer. 
 
     
     
       5. The signal transceiver module in  claim 4 , wherein the first contact and the second contact are arranged between two of the second-ground faces respectively. 
     
     
       6. The signal transceiver module in  claim 1 , wherein the first contact and the second contact are arranged on the circuit-board-front face of the circuit board with the mutually perpendicular status. 
     
     
       7. The signal transceiver module in  claim 1  further comprising a cable connector, wherein the signal-integrating component is electrically connected to the cable connector through the circuit board. 
     
     
       8. The signal transceiver module in  claim 1 , wherein the substrate is made of ceramic materials. 
     
     
       9. A signal transceiver module in a surface-mounted type with multi-signal feed-in comprising:
 an antenna unit comprising a substrate, a radiation layer, a ground layer, a first-feed-in line and a second-feed-in line, the substrate comprising a substrate-front face, a substrate-back face and a substrate-side face, the radiation layer arranged on the substrate-front face of the substrate, the ground layer arranged on the substrate-back face of the substrate, the first-feed-in line and the second-feed-in line arranged on the substrate-side face of the substrate, one side of the first feed-in line and one side of the second feed-in line extending to the substrate-front face of the substrate respectively to form coupled electrical connections with the radiation layer, the other side of the first feed-in line and the other side of the second feed-in line extending to the substrate-back face of the substrate respectively, neither the other side of the first feed-in line nor the other side of the second feed-in line electrically connected to the ground layer; 
 a metal shell comprising a platform, a plurality of support chips and a plurality of joint parts, the platform comprising a platform surface and a platform-side edge, the platform surface of the platform electrically connected to the ground layer, the platform-side edge of the platform extending to the support chips, the platform and the support chips having a mutually perpendicular status, each of the support chips extending to the joint part, two openings defined by the platform; 
 a circuit board comprising a circuit-board-front face, a circuit-board-side edge, a circuit-board-back face, two signal feed-in points, a plurality of ground parts and at least one conducting part, the two signal feed-in points arranged on the circuit-board-front face of the circuit board, a plurality of notches defined by the circuit-board-side edge of the circuit board, each of the ground parts arranged on the circuit-board-back face of the circuit board and arranged in accordance with each of the notches, the joint parts electrically connected to the ground parts through the notches, the at least one conducting part arranged on the circuit-board-back face of the circuit board; and 
 two conducting components electrically contacted between the first-feed-in line, the second-feed-in line and the two signal feed-in points of the circuit board, 
 wherein the first-feed-in line and the second-feed-in line are arranged on the substrate-front face, the substrate-side face and the substrate-back face of the substrate with the mutually perpendicular status; the first-feed-in line and the second-feed-in line are arranged on the metal shell in accordance with the two openings and are perpendicular to each other; the two conducting components are electrically contacted or connected to the two signal feed-in points of the circuit board through the two openings. 
 
     
     
       10. The signal transceiver module in  claim 9 , wherein an area of the radiation layer is less than an area of a substrate surface of the substrate. 
     
     
       11. The signal transceiver module in  claim 9 , wherein an area of the ground layer is equal to an area of the substrate-back face. 
     
     
       12. The signal transceiver module in  claim 9  further comprising an electronic part, wherein the circuit-board-front face of the circuit board is electrically connected to the electronic part. 
     
     
       13. The signal transceiver module in  claim 12 , wherein the electronic part comprises a filter and an amplifier; the filter is electrically connected to the amplifier. 
     
     
       14. The signal transceiver module in  claim 12 , wherein the electronic part comprises a receiver module, a filter and an amplifier; the filter is electrically connected to the receiver module; the amplifier is electrically connected to the receiver module and the filter. 
     
     
       15. The signal transceiver module in  claim 9 , wherein the joint part is bended or straight to be through the notch defined by the circuit-board-side edge of the circuit board to be electrically connected to the ground part. 
     
     
       16. The signal transceiver module in  claim 9 , wherein the two conducting components are segments, columns, shrapnel or springs made of metal materials. 
     
     
       17. The signal transceiver module in  claim 9 , wherein the conducting part renders that the circuit board is electrically connected to and arranged on a motherboard of an electronic apparatus. 
     
     
       18. The signal transceiver module in  claim 9 , wherein the substrate is made of ceramic materials.