Adhesive composition

Abstract

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.

What is claimed is: 
     
       1. An adhesive composition for encapsulating an organic electronic element, comprising:
 an olefin-based resin having a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less; 
 a heat-curable resin; and 
 a photocurable compound, 
 wherein the olefin-based resin has a weight average molecular weight of less than 100,000, 
 wherein the olefin-based resin, the heat-curable resin and the photocurable compound are comprises at 40 to 90 parts by weight, 5 to 50 parts by weight and 1 to 40 parts by weight, respectively, and 
 wherein the adhesive composition is a solventless liquid at 25° C. 
 
     
     
       2. The adhesive composition of  claim 1 , wherein the olefin-based resin has one or more reactive functional groups having reactivity with the heat-curable resin. 
     
     
       3. The adhesive composition of  claim 2 , wherein the functional group having reactivity with the heat-curable resin is an acid anhydride group, a carboxyl group, an epoxy group, an amino group, a hydroxyl group, an isocyanate group, an oxazoline group, an oxetane group, a cyanate group, a phenol group, a hydrazide group or an amide group. 
     
     
       4. The adhesive composition of  claim 1 , wherein heat-curable resin comprises at least one heat-curable functional group. 
     
     
       5. The adhesive composition of  claim 4 , wherein the heat-curable functional group comprises an epoxy group, an isocyanate group, a hydroxyl group, a carboxyl group or an amide group. 
     
     
       6. The adhesive composition of  claim 1 , wherein the heat-curable resin is comprised at 10 to 70 parts by weight with respect to 100 parts by weight of the olefin-based resin. 
     
     
       7. The adhesive composition of  claim 1 , further comprising:
 a heat-curing agent. 
 
     
     
       8. The adhesive composition of  claim 7 , wherein the heat-curing agent is a latent curing agent. 
     
     
       9. The adhesive composition of  claim 8 , wherein the heat-curing agent is comprised at 1 to 30 parts by weight with respect to 100 parts by weight of the heat-curable resin. 
     
     
       10. The adhesive composition of  claim 1 , wherein the photocurable compound is a multifunctional active energy ray-polymerizable compound. 
     
     
       11. The adhesive composition of  claim 1 , wherein the photocurable compound is comprised at 10 to 100 parts by weight with respect to 100 parts by weight of the olefin-based resin. 
     
     
       12. The adhesive composition of  claim 1 , further comprising:
 a photoradical initiator at 0.1 to 20 parts by weight with respect to 100 parts by weight of the photocurable compound. 
 
     
     
       13. The adhesive composition of  claim 1 , further comprising:
 a moisture absorbent. 
 
     
     
       14. The adhesive composition of  claim 13 , wherein the moisture absorbent is included at 5 to 100 parts by weight with respect to 100 parts by weight of the olefin-based resin. 
     
     
       15. An organic electronic device, comprising:
 a substrate; 
 an organic electronic element formed on the substrate; and 
 a side encapsulation layer formed on a peripheral portion of the substrate to surround side surfaces of the organic electronic element, and comprising the adhesive composition of  claim 1 . 
 
     
     
       16. The organic electronic device of  claim 15 , further comprising:
 an entire encapsulation layer for covering the entire surface of the organic electronic element, 
 wherein the entire encapsulation layer is present in the same plane as the side encapsulation layer. 
 
     
     
       17. A method of manufacturing an organic electronic device, comprising:
 applying the adhesive composition of  claim 1  to a peripheral portion of a substrate on which an organic electronic element is formed to surround side surfaces of the organic electronic element; 
 irradiating the adhesive composition with light; and 
 heating the adhesive composition.