Method of manufacturing condensation-curable silicone resin composition sheet, and method of manufacturing light-emitting apparatus

Abstract

The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R 1 3 SiO 1/2 ) a′ (R 1 2 SiO 2/2 ) b′ (R 2 SiO 3/2 ) c′ (SiO 4/2 ) d′ (OR 3 ) e′   ( 1 ); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (OR 3 ) e (HSi(OR 3 ) 2 O 1/2 ) f   (2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

The invention claimed is: 
     
       1. A method of manufacturing a condensation-curable silicone resin composition sheet, the method comprising
 diluting an organopolysiloxane composition to constitute the condensation-curable silicone resin composition sheet with an organic solvent, wherein the organopolysiloxane composition comprises:
 a component (B) in an amount of 5 to 100 part by mass based on 100 parts by mass of a component (A), where 
 the component (A) is a organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene and being in a plastic solid state or a semi-solid state at ordinary temperature, with the molecule having at least two silicon atom-bonded alkoxy groups or silicon atom-bonded hydroxy groups, shown by the following formula (1):
   (R 1   3 SiO 1/2 ) a′ (R 1   2 SiO 2/2 ) b′ (R 2 SiO 3/2 ) c′ (SiO 4/2 ) d′ (OR 3 ) e′   (1)
 
 
 
 
       wherein
     each R 1  independently represents a hydrogen atom, a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms, or an aromatic hydrocarbon group having to 12 carbon atoms,   R 2  represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms,   R 3  represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxyalkyl group having 2 to 6 carbon atoms,   each of “a′”, “b′”, “c′”, and “d′” is an integer of 0 or more,   “e′” is an integer of 2 or more, and   b′+c′+d′ is an integer of 1 or more, and     the component (B) is an organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene, with the molecule having at least two silicon atoms, each of which has one hydrogen atom and two alkoxy groups or hydroxy groups, shown by the following formula (2):
   (R 1   3 SiO 1/2 ) a (R 1   2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (OR 3 ) e (HSi(OR 3 ) 2 O 1/2 ) f    (2)
 
   
 
       wherein
     R 1 , R 2  and R 3  have the same meanings as described above,   each of “a”, “b”, “c”, “d”, and “e” is an integer of 0 or more, c+d is an integer of 2 or more, and   “f” is an integer of 2 or more;     
 applying the organopolysiloxane composition diluted with the organic solvent onto a substrate sheet to form a coated film, and 
 drying the formed coated film at 25 to 180° C. to manufacture the condensation-curable silicone resin composition sheet, wherein the condensation-curable silicone resin composition sheet is in a plastic solid state or a semi-solid state at ordinary temperature. 
 
     
     
       2. The method according to  claim 1 , wherein the organopolysiloxane composition further comprises a fluorescent substance as a component (C). 
     
     
       3. The method according to  claim 2 , wherein the content of the component (C) is 0.1 to 1,000 parts by mass with respect to 100 parts by mass of a sum total of the component (A) and the component (13). 
     
     
       4. The method according to  claim 2 , wherein the component (C) has an average particle diameter of 1 to 50 μm. 
     
     
       5. The method according to  claim 3 , wherein the component (C) has an average particle diameter of 1 to 50 μm. 
     
     
       6. A method of manufacturing a light-emitting apparatus having a covered LED device, comprising:
 disposing a condensation-curable silicone resin composition sheet on a surface of an LED device, 
 curing the condensation-curable silicone resin composition sheet by heating to form a silicone resin layer, and 
 covering the surface of the LED device with the formed silicone resin layer; wherein the condensation-curable silicone resin composition sheet comprises 
 organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene and being in a plastic solid state or a semi-solid state at ordinary temperature, with the molecule having at least two silicon atom-bonded alkoxy groups or silicon atom-bonded hydroxy groups, shown by the following formula (1):
   (R 1   3 SiO 1/2 ) a (R 1   2 SiO 2/2 ) b′ (R 2 SiO 3/2 ) c′ (SiO 4/2 ) d′ (OR 3 ) e′   (1)
 
 
 
       wherein
   each R 1  independently represents a hydrogen atom, a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms, or an aromatic hydrocarbon group having 6 to 12 carbon atoms;   R 2  represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms;   R 3  represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxyalkyl group having 2 to 6 carbon atoms;   each of “a′”, “b′”, “c′”, and “d′” is an integer of 0 or more;   “e′” is an integer of 2 or more; and   b′+c′+d′ is an integer of 1 or more; and   
 (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene, with the molecule having at least two silicon atoms, each of which has one hydrogen atom and two alkoxy groups or hydroxy groups, shown by the following formula (2)
   (R 1   3 SiO 1/2 ) a (R 1   2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (OR 3 ) e (HSi(OR 3 ) 2 O 1/2 ) f    (2)
 
 
 
       wherein
   R 1 , R 2  and R 3  have the same meanings as described above;   each of “a”, “b”, “c”, “d”, and “e” is an integer of 0 or more;   c+d is an integer of 2 or more; and   “f” is an integer of 2 or more;   
 wherein the condensation-curable silicone resin composition sheet is in a plastic solid state or a semi-solid state at ordinary temperature and comprises the component (B) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). 
 
     
     
       7. The method according to  claim 6 , wherein the condensation-curable silicone resin composition sheet further comprises a fluorescent substance as a component (C). 
     
     
       8. The method according to  claim 7 , wherein the content of the component (C) is 0.1 to 1,000 parts by mass with respect to 100 parts-by mass of a sum total of the component (A) and the component (B). 
     
     
       9. The method according to  claim 7 , wherein the component (C) has an average particle diameter of 1 to 50 μm. 
     
     
       10. The method according to  claim 8 , wherein the component (C) has an average particle diameter of 1 to 50 μm.