Apparatus and method for reconfigurable thermal management using flow control of liquid metal

Abstract

An apparatus includes a substrate and a matrix having multiple cells embedded within the substrate. The matrix is configured to generate electrostatic fields to define at least one flow path for liquid metal. The apparatus also includes a pump configured to create movement of the liquid metal through the at least one flow path defined by the matrix. The matrix is configured to transport the liquid metal through the at least one flow path in order to remove thermal energy from one or more areas of the substrate. The matrix could include a matrix of capacitors, and polarities of charges stored on the capacitors could define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal. The cells that block or restrict passage of the liquid metal could be configured to increase a viscosity of the liquid metal.

What is claimed is: 
     
       1. An apparatus comprising:
 a substrate; 
 a matrix comprising multiple cells embedded within the substrate, the matrix configured to generate electrostatic fields to define at least one flow path for liquid metal; and 
 a pump configured to create movement of the liquid metal through the at least one flow path defined by the matrix; 
 wherein the matrix is configured to transport the liquid metal through the at least one flow path in order to remove thermal energy from one or more areas of the substrate; and 
 wherein the cells of the matrix comprise capacitors. 
 
     
     
       2. The apparatus of  claim 1 , wherein polarities of charges stored on the capacitors define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal. 
     
     
       3. The apparatus of  claim 2 , wherein the cells that block or restrict passage of the liquid metal are configured to increase a viscosity of the liquid metal. 
     
     
       4. The apparatus of  claim 1 , wherein the pump comprises an electromagnetic pump. 
     
     
       5. The apparatus of  claim 1 , further comprising:
 a controller configured to adjust the matrix to define the at least one flow path for the liquid metal. 
 
     
     
       6. The apparatus of  claim 5 , wherein the controller is configured to adjust the matrix to define different flow paths or different combinations of flow paths for the liquid metal, the different flow paths or different combinations of flow paths configured to allow transport of the liquid metal to different areas of the substrate. 
     
     
       7. The apparatus of  claim 1 , further comprising:
 at least one flow path that is fixed and not reconfigurable. 
 
     
     
       8. The apparatus of  claim 7 , wherein:
 the substrate comprises at least one edge rail; and 
 the at least one fixed flow path travels along the at least one edge rail. 
 
     
     
       9. A system comprising:
 multiple circuit cards, at least one of the circuit cards comprising:
 a substrate; and 
 a matrix comprising multiple cells embedded within the substrate, the matrix configured to generate electrostatic fields to define at least one flow path for liquid metal; and 
 
 at least one pump configured to create movement of the liquid metal through the at least one flow path defined by the matrix of the at least one circuit card; 
 wherein the matrix of the at least one circuit card is configured to transport the liquid metal through the at least one flow path in order to remove thermal energy from one or more areas of the substrate of the at least one circuit card; and 
 wherein the cells of the matrix of the at least one circuit card comprise capacitors. 
 
     
     
       10. The system of  claim 9 , wherein polarities of charges stored on the capacitors define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal. 
     
     
       11. The system of  claim 10 , wherein the cells that block or restrict passage of the liquid metal are configured to increase a viscosity of the liquid metal. 
     
     
       12. The system of  claim 9 , wherein the at least one pump comprises at least one electromagnetic pump. 
     
     
       13. The system of  claim 9 , further comprising:
 at least one controller configured to adjust the matrix of the at least one circuit card to define the at least one flow path for the liquid metal. 
 
     
     
       14. The system of  claim 13 , wherein the at least one controller is configured to adjust the matrix of the at least one circuit card to define different flow paths or different combinations of flow paths for the liquid metal, the different flow paths or different combinations of flow paths configured to allow transport of the liquid metal to different areas of the substrate of the at least one circuit card. 
     
     
       15. The system of  claim 9 , wherein the at least one circuit card further comprises:
 at least one flow path that is fixed and not reconfigurable. 
 
     
     
       16. The system of  claim 15 , wherein:
 the substrate of the at least one circuit card comprises at least one edge rail; and 
 the at least one fixed flow path travels along the at least one edge rail. 
 
     
     
       17. A method comprising:
 configuring a matrix comprising multiple cells embedded within a substrate to generate electrostatic fields in order to define at least one flow path through the substrate; 
 pumping liquid metal through the at least one flow path defined by the matrix; and 
 removing thermal energy from one or more areas of the substrate using the liquid metal; 
 wherein the cells of the matrix comprise capacitors. 
 
     
     
       18. The method of  claim 17 , further comprising:
 reconfiguring the matrix in order to define at least one second flow path through the substrate; and 
 pumping the liquid metal through the at least one second flow path. 
 
     
     
       19. The method of  claim 17 , wherein:
 polarities of charges stored on the capacitors define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal; and 
 the cells that block or restrict passage of the liquid metal are configured to increase a viscosity of the liquid metal. 
 
     
     
       20. The method of  claim 17 , wherein the substrate further comprises at least one flow path that is fixed and not reconfigurable.