Heat dissipation device

Abstract

A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

What is claimed is: 
     
       1. A heat dissipation device, comprising:
 a first fin group; 
 a base in contact with a heat source; 
 a heat pipe comprising a first pipe part and a second pipe part, wherein the second pipe part is connected with a first side of the first pipe part and bent and extended upwardly, the first pipe part is installed on the base, and the second pipe part is penetrated through the first fin group; and 
 a second fin group laterally adjacent to the first fin group, 
 wherein the second fin group has an exposed top surface lower than a top surface of the first fin group and higher than a bottom surface of the first fin group, and the bottom surface of the first fin group is lower than the exposed top surface of the second fin group and higher than a bottom surface of the second fin group. 
 
     
     
       2. The heat dissipation device according to  claim 1 , wherein the maximum vertical distance between the bottom surface of the first fin group and the base is larger than the maximum vertical distance between the bottom surface of the second fin group and the base. 
     
     
       3. The heat dissipation device according to  claim 1 , wherein the first fin group comprises plural first fins, and the plural first fins are arranged along a first arranging direction, wherein the second fin group comprises plural second fins, and the second fins are arranged along a second arranging direction, wherein the first arranging direction is different from the second arranging direction. 
     
     
       4. The heat dissipation device according to  claim 1 , wherein the first fin group is made of a first fin material, and the second fin group is made of a second fin material, wherein a first thermal conductivity coefficient of the first fin material is smaller than a second thermal conductivity coefficient of the second fin material. 
     
     
       5. The heat dissipation device according to  claim 1 , wherein the second fin group comprises plural second fins, and the plural second fins are arranged along a second arranging direction, wherein the heat dissipation device further comprises a covering member that covers the second fin group, the covering member comprises two close-type sidewalls, and the two close-type sidewalls are arranged along the second arranging direction. 
     
     
       6. The heat dissipation device according to  claim 1 , wherein the heat dissipation device further comprises a third fin group, and the heat pipe further comprises a third pipe part, wherein the third pipe part is connected with a second side of the first pipe part and bent and extended upwardly, the third pipe part is penetrated through the third fin group, and the second fin group is arranged between the first fin group and the third fin group. 
     
     
       7. The heat dissipation device according to  claim 6 , wherein the maximum vertical distance between a top surface of the third fin group and the base is larger than the maximum vertical distance between the exposed top surface of the second fin group and the base. 
     
     
       8. The heat dissipation device according to  claim 6 , wherein the maximum vertical distance between a bottom surface of the third fin group and the base is larger than the maximum vertical distance between a the bottom surface of the second fin group and the base. 
     
     
       9. The heat dissipation device according to  claim 6 , wherein the third fin group comprises plural third fins, and the third fins are arranged along a third arranging direction, wherein the second fin group comprises plural second fins, and the second fins are arranged along a second arranging direction, wherein the third arranging direction is different from the second arranging direction. 
     
     
       10. The heat dissipation device according to  claim 6 , wherein the third fin group is made of a third fin material, and the second fin group is made of a second fin material, wherein a third thermal conductivity coefficient of the third fin material is smaller than a second thermal conductivity coefficient of the second fin material. 
     
     
       11. The heat dissipation device according to  claim 3 , wherein a thickness surface of one of the plural first fins faces thickness surfaces of the plural second fins. 
     
     
       12. The heat dissipation device according to  claim 3 , wherein one of the plural second fins has a width less than a width of another one of the plural second fins. 
     
     
       13. The heat dissipation device according to  claim 9 , wherein a thickness surface of one of the plural third fins faces thickness surfaces of the plural second fins.