Organic electronic device

Abstract

The present application relates to an organic electronic device, a method for preparing same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.

The invention claimed is: 
     
       1. An organic electronic device comprising a substrate in which an organic electronic element is formed on a first surface of said substrate and
 an adhesive layer formed on a second surface of said substrate and comprising a polymer derived from butylene and a curable oligomer. 
 
     
     
       2. The organic electronic device according to  claim 1 , wherein the polymer derived from butylene is a homopolymer of a butylene monomer; a copolymer obtained by copolymerizing another monomer polymerizable with a butylene monomer; a reactive oligomer using a butylene monomer; or a mixture thereof. 
     
     
       3. The organic electronic device according to  claim 2 , wherein another monomer polymerizable with a butylene monomer is isoprene, styrene or butadiene. 
     
     
       4. The organic electronic device according to  claim 2 , wherein the reactive oligomer using a butylene monomer comprises a butylene polymer having a reactive functional group, and said butylene polymer is associated with another polymer having a reactive functional group. 
     
     
       5. The organic electronic device according to  claim 1 , wherein the polymer derived from butylene has a weight average molecular weight in a range of 10,000 to 2,000,000. 
     
     
       6. The organic electronic device according to  claim 1 , wherein the curable oligomer is a hydrogenated compound. 
     
     
       7. The organic electronic device according to  claim 1 , wherein the curable oligomer is an aromatic compound. 
     
     
       8. The organic electronic device according to  claim 1 , wherein the curable oligomer has a weight average molecular weight in a range of 400 to 10,000. 
     
     
       9. The organic electronic device according to  claim 1 , wherein the curable oligomer is a hydrogenated aromatic epoxy compound. 
     
     
       10. The organic electronic device according to  claim 1 , wherein the curable oligomer has an epoxy equivalent in a range of 100 to 1500 g/eq. 
     
     
       11. The organic electronic device according to  claim 1 , wherein the curable oligomer is included in an amount of 15 to 100 parts by weight, relative to 100 parts by weight of the polymer derived from butylene. 
     
     
       12. The organic electronic device according to  claim 1 , further comprising a curable monomer. 
     
     
       13. The organic electronic device according to  claim 12 , wherein the curable monomer has a weight average molecular weight of less than 400. 
     
     
       14. The organic electronic device according to  claim 12 , wherein the curable monomer has a cyclic structure in which ring constituent atoms in the molecular structure are in a range of 3 to 10. 
     
     
       15. The organic electronic device according to  claim 12 , wherein the curable monomer is included in an amount of 20 to 80 parts by weight, relative to 100 parts by weight of the polymer derived from butylene. 
     
     
       16. The organic electronic device according to  claim 12 , wherein the curable monomer and the curable oligomer are included in ratios of 10 to 50 parts by weight and 20 to 70 parts by weight, respectively. 
     
     
       17. The organic electronic device according to  claim 1 , wherein the adhesive layer comprises no tackifier. 
     
     
       18. The organic electronic device according to  claim 1 , wherein the adhesive layer has a storage elastic modulus, as measured in conditions of a temperature of 25° C., a strain of 5% and a frequency of 1 Hz after curing, in a range of 10 5  Pa to 10 9  Pa. 
     
     
       19. The organic electronic device according to  claim 1 , comprising at least one folding portion satisfying Equation 1 below:
     X≤ 10%  [Equation 1]
 
 wherein, X is a luminance change rate before and after a folding test in which a process of folding the folding portion of said organic electronic device to a curvature radius of 1 R (1 mm) at a temperature of 25° C. and a relative humidity of 50%, is repeated 100,000 times. 
 
     
     
       20. The organic electronic device according to  claim 1 , further comprising an encapsulating layer covering the entire surface of the organic electronic element. 
     
     
       21. A method for manufacturing the organic electronic device according to  claim 1 , comprising steps of forming the adhesive layer comprising a polymer derived from butylene and a curable oligomer on a second surface of said substrate, forming an organic electronic element on a first surface of said substrate, and curing said adhesive layer.