P
US10385249B2ActiveUtilityPatentIndex 61

Hydrofluoroether olefins and methods of using same

Assignee: 3M INNOVATIVE PROPERTIES COPriority: Jul 16, 2014Filed: Jun 20, 2018Granted: Aug 20, 2019
Est. expiryJul 16, 2034(~8 yrs left)· nominal 20-yr term from priority
Inventors:BULINSKI MICHAEL JCOSTELLO MICHAEL GLAMANNA WILLIAM MTEVEROVSKIY GEORGIYSMITH KIAH A
H10P 72/0431H10W 40/73C09K 5/04C07D 265/30H05K 1/0203C07C 211/24C09K 5/10H05K 7/2029C07D 413/12H01F 27/18H01L 21/67098H01L 23/427H05K 7/2039C09K 2205/132C09K 2205/116C09K 2205/112C09K 5/045
61
PatentIndex Score
1
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25
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5
Claims

Abstract

A hydrofluoroether compound represented by the following general formula:

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A working fluid comprising a hydrofluoroether compound represented by the following general formula (II): 
       
         
           
           
               
               
           
         
         wherein,
 Rf 5  and Rf 6  (i) are each independently perfluoroalkyl groups having 1-8 carbon atoms and optionally comprising at least one catenated heteroatom, or (ii) are bonded together to form a ring structure having 4-8 carbon atoms and optionally comprising one or more catenated heteroatoms; 
 Rfh 1  is a linear, branched, cyclic, or acyclic alkylene or fluoroalkylene group having from 1 to 8 carbon atoms and optionally comprising one or more catenated heteroatoms; and 
 each of Rf 7 , Rf 8 , Rf′ 7 , and Rf′ 8  is independently a F or CF 3  group, with the proviso that when: 
 Rf 7  is F, Rf 5  is CF 3 , 
 Rf 8  is F, Rf 7  is CF 3 , 
 Rf′ 7  is F, Rf′ 8  is CF 3 , and 
 Rf′ 8  is F, Rf′ 7  is CF 3 ; 
 
       
       wherein the hydrofluoroether compound is present in the working fluid at an amount of at least 50% by weight based on the total weight of the working fluid. 
     
     
       2. An apparatus for heat transfer comprising:
 a device; and 
 a mechanism for transferring heat to or from the device, the mechanism comprising the working fluid according to  claim 1 . 
 
     
     
       3. An apparatus for heat transfer according to  claim 2 , wherein the device is selected from a microprocessor, a semiconductor wafer used to manufacture a semiconductor device, a power control semiconductor, an electrochemical cell, an electrical distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, and a laser. 
     
     
       4. An apparatus according to  claim 2 , wherein the mechanism for transferring heat is a component in a system for maintaining a temperature or temperature range of an electronic device. 
     
     
       5. A method of transferring heat comprising:
 providing a device; and 
 transferring heat to or from the device using the working fluid according to  claim 1 .

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