US10385249B2ActiveUtilityPatentIndex 61
Hydrofluoroether olefins and methods of using same
Est. expiryJul 16, 2034(~8 yrs left)· nominal 20-yr term from priority
H10P 72/0431H10W 40/73C09K 5/04C07D 265/30H05K 1/0203C07C 211/24C09K 5/10H05K 7/2029C07D 413/12H01F 27/18H01L 21/67098H01L 23/427H05K 7/2039C09K 2205/132C09K 2205/116C09K 2205/112C09K 5/045
61
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Claims
Abstract
A hydrofluoroether compound represented by the following general formula:
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A working fluid comprising a hydrofluoroether compound represented by the following general formula (II):
wherein,
Rf 5 and Rf 6 (i) are each independently perfluoroalkyl groups having 1-8 carbon atoms and optionally comprising at least one catenated heteroatom, or (ii) are bonded together to form a ring structure having 4-8 carbon atoms and optionally comprising one or more catenated heteroatoms;
Rfh 1 is a linear, branched, cyclic, or acyclic alkylene or fluoroalkylene group having from 1 to 8 carbon atoms and optionally comprising one or more catenated heteroatoms; and
each of Rf 7 , Rf 8 , Rf′ 7 , and Rf′ 8 is independently a F or CF 3 group, with the proviso that when:
Rf 7 is F, Rf 5 is CF 3 ,
Rf 8 is F, Rf 7 is CF 3 ,
Rf′ 7 is F, Rf′ 8 is CF 3 , and
Rf′ 8 is F, Rf′ 7 is CF 3 ;
wherein the hydrofluoroether compound is present in the working fluid at an amount of at least 50% by weight based on the total weight of the working fluid.
2. An apparatus for heat transfer comprising:
a device; and
a mechanism for transferring heat to or from the device, the mechanism comprising the working fluid according to claim 1 .
3. An apparatus for heat transfer according to claim 2 , wherein the device is selected from a microprocessor, a semiconductor wafer used to manufacture a semiconductor device, a power control semiconductor, an electrochemical cell, an electrical distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, and a laser.
4. An apparatus according to claim 2 , wherein the mechanism for transferring heat is a component in a system for maintaining a temperature or temperature range of an electronic device.
5. A method of transferring heat comprising:
providing a device; and
transferring heat to or from the device using the working fluid according to claim 1 .Cited by (0)
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