Thermal cross-talk resistant flow reactor
Abstract
A flow reactor has a module ( 12 ) that comprises at least first ( 20 ), second ( 30 ), and third ( 40 ) parallel plates stacked temporarily or permanently together and defining a first thermal fluid layer ( 25 ) between the first ( 20 ) and second plates ( 30 ) and a process fluid layer ( 35 ) between the second ( 30 ) and third plates ( 40 ), the process fluid layer ( 35 ) comprising a process fluid passage ( 32 ) having two or more U-bends and three or more successive process fluid passage segments joined by respective U-bends, the first thermal fluid layer ( 25 ) comprising at least two open thermal fluid channels ( 26 ) in the second plate ( 30 ), the at least two open channels ( 26 ) positioned, when viewed in a plan view of the module ( 12 ), between respective adjacent process fluid passage segments.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A fluidic module ( 12 ) for a flow reactor, the module ( 12 ) comprising:
at least first, second, and third parallel plates ( 20 , 30 , 40 ) stacked temporarily or permanently together and defining, between the first and second plates, a first thermal fluid layer ( 25 ), and, between the second and third plates, a process fluid layer ( 35 );
within the process fluid layer ( 35 ) between the second and third plates ( 20 , 30 ), a process fluid passage ( 32 ) having one or more U-bends ( 34 ) and three or more successive process fluid passage segments ( 36 ), the successive process fluid passage segments ( 36 ) joined by respective U-bends ( 34 ), each of the three or more successive process fluid passage segments ( 36 ) lying adjacent to at least one other of the three or more successive process fluid passage segments ( 36 ), each successive process fluid passage segment ( 36 ) having a respective process fluid passage segment centerline (PCL);
in the first thermal fluid layer ( 25 ), in a surface ( 28 ) of the second plate ( 30 ), at least two first-thermal-layer open thermal fluid channels or open thermal fluid channel segments ( 26 ), each first-thermal-layer open thermal fluid channel or open thermal fluid channel segment ( 26 ) comprising two sidewalls ( 24 ) and an open top ( 23 ) and having a respective channel or channel segment centerline (CCL 1 ), the respective channel or channel segment centerlines (CCL 1 ) positioned, when viewed in a plan view of the module ( 12 ), between respective adjacent process fluid passage segment centerlines (PCL);
the module further comprising a fourth generally planar and parallel plate ( 50 ) stacked temporarily or permanently together against the third plate ( 40 ) and defining together with the third plate, between the third and fourth plates, a second thermal fluid layer ( 45 ) comprising, in a surface ( 48 ) of the third plate, at least two second-thermal-layer open thermal fluid channels or open thermal fluid channel segments ( 46 ), each second-thermal-layer open thermal fluid channel or open thermal fluid channel segment ( 46 ) comprising two sidewalls ( 44 ) and an open top ( 43 ) and having a respective channel or channel segment centerline (CCL 2 ), the respective channel or channel segment centerlines (CCL 2 ) positioned, when viewed in a plan view of the module ( 12 ), between respective adjacent process fluid passage segment centerlines (PCL).
2. The module ( 12 ) according to claim 1 , wherein at least one of the open thermal fluid channels or open thermal fluid channel segments ( 26 , 46 ) comprises a straight channel sidewall ( 24 , 44 ).
3. The module according to claim 1 , wherein at least one of the open thermal fluid channels or open thermal fluid channel segments ( 26 , 46 ) comprises a wavy channel sidewall ( 24 , 44 ).
4. The module according to claim 3 , wherein the wavy channel sidewall ( 24 , 44 ) has a shape complementary to a shape of a respective adjacent process fluid passage segment ( 36 ).
5. The module according to claim 1 wherein at least one of the sidewalls ( 24 , 44 ) forms an angle of 90° with an associated bottom wall ( 22 , 42 ).
6. The module according to claim 1 wherein at least one of the sidewalls ( 24 , 44 ) forms an angle of greater than 90° with an associated bottom wall ( 22 , 42 ).
7. The module according to claim 1 wherein the second plate ( 30 ) comprises a material having a thermal conductivity of at least 15 W/m·K at 20° C.
8. The module according to claim 1 wherein the second plate ( 30 ) comprises a material having a thermal conductivity of at least 20 W/m·K at 20° C.
9. The module according to claim 1 wherein the second plate ( 30 ) comprises a material having a thermal conductivity of at least 30 W/m·K at 20° C.
10. The module according to claim 1 wherein the second plate ( 30 ) comprises a material having a thermal conductivity of at least 60 W/m·K at 20° C.
11. A reactor ( 10 ) comprising two or more modules ( 12 ) according to claim 1 fluidically coupled together.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.