Shield case and electronic device

Abstract

According to one embodiment, a shield case includes a frame configured to surround an electronic component and including a contact portion at a top of the frame, and a cover including a side plate and a top plate, a groove being formed at a peripheral portion of the top plate. The side plate is outside the frame and the groove contacts the contact portion when the cover is engaged with the frame.

What is claimed is: 
     
       1. A shield case comprising:
 a frame configured to surround an electronic component and comprising a contact portion at a top of the frame; and 
 a cover comprising a side plate and a top plate, a groove being formed at a peripheral portion of the top plate, wherein the side plate is outside the frame and the groove contacts the contact portion when the cover is engaged with the frame, and the groove is formed along a whole peripheral portion of the top plate. 
 
     
     
       2. The shield case of  claim 1 , further comprising:
 first engagement members provided in the frame; and 
 second engagement members provided in the side plate of the cover, the first engagement members engaging the second engagement members. 
 
     
     
       3. The shield case of  claim 2 , wherein
 the first engagement members comprise projections and the second engagement members comprise holes or recesses. 
 
     
     
       4. The shield case of  claim 2 , wherein
 the first engagement members comprise holes or recesses and the second engagement members comprise projections. 
 
     
     
       5. The shield case of  claim 1 , wherein the frame and the cover are formed of metal. 
     
     
       6. The shield case of  claim 1 , wherein
 a heat-transfer member having elasticity and provided on the electronic component, and 
 the top plate of the cover contacts the heat-transfer member when the cover is engaged with the frame. 
 
     
     
       7. The shield case of  claim 2 , wherein
 a heat-transfer member having elasticity and provided on the electronic component, 
 the top plate of the cover contacts the heat-transfer member when the cover is engaged with the frame, and 
 a compressed stress from the heat-transfer member is applied to the first engagement members and the second engagement members. 
 
     
     
       8. The shield case of  claim 1 , wherein
 the cover is engaged with the frame at a position determined by the heat-transfer member and the contact portion such that electromagnetic noise from the electronic component is blocked. 
 
     
     
       9. A shield case comprising:
 a frame configured to surround an electronic component and comprising a contact portion situated along a top of the frame; and 
 a cover comprising a side plate and a top plate, a groove being formed along an entire peripheral portion of the top plate, wherein the side plate is outside the frame and the groove contacts the contact portion when the cover is engaged with the frame. 
 
     
     
       10. The shield case of  claim 9 , further comprising:
 a first plurality of engagement members provided in the frame; and 
 a second plurality of engagement members provided in the side plate of the cover, the first plurality of engagement members engaging the second plurality of engagement members. 
 
     
     
       11. The shield case of  claim 10 , wherein
 each of the first plurality of engagement members comprises a projection and each of the second plurality of engagement members comprises an aperture or recess to engage with a corresponding projection of one of the first plurality of engagement members. 
 
     
     
       12. The shield case of  claim 10 , wherein
 each of the first plurality of engagement members comprises an aperture or recess and each of the second plurality of engagement members comprise a projection to engage with a corresponding aperture or recess the one of the first plurality of engagement members. 
 
     
     
       13. The shield case of  claim 9  further comprising:
 a heat-transfer member having elasticity and provided on the electronic component, the heat-transfer member being positioned to contact the top plate of the cover when the cover is engaged with the frame. 
 
     
     
       14. The shield case of  claim 10  further comprising:
 a heat-transfer member having elasticity and provided on the electronic component, the heat-transfer member contacting the top plate of the cover when the cover is engaged with the frame and applying a compressed stress to the first plurality of engagement members and the second plurality of engagement members. 
 
     
     
       15. The shield case of  claim 9 , wherein
 the cover is engaged with the frame at a position determined by a heat-transfer member mounted on the electronic component and the contact portion so that electromagnetic noise from the electronic component is blocked.