Electronic control device

Abstract

An electronic control device includes a heating element, a circuit substrate, a heat radiation plate, and a heat radiation material. Connection terminals of the heating element are fixed to wiring patterns on a circuit principal surface of the circuit substrate with solder. Through holes are provided in the circuit substrate at portions spaced away from the distal ends of the connection terminals of the heating element by a distance equal to or smaller than a thickness of the circuit substrate. The heat radiation material applied between a circuit principal surface of the circuit substrate and the heat radiation plate is exposed to the circuit principal surface via the through holes. The heat radiation material exposed to the circuit principal surface covers the distal ends of the connection terminals fixed with the solder.

What is claimed is: 
     
       1. An electronic control device, comprising:
 a substrate provided with a heating element on a first surface of the substrate; 
 a second heat radiator provided on a second surface of the substrate that is opposite to the first surface of the substrate; and 
 a first heat radiator provided such that the second heat radiator is interposed between the first heat radiator and the second surface of the substrate, wherein 
 the substrate includes a through hole that passes through the substrate in its a thickness direction of the substrate and is provided away from peripheral edges of the heating element at a position where the second heat radiator is interposed, 
 the heating element includes a plurality of terminals on the peripheral edges of the heating element, and 
 a part of the terminals is covered with the second heat radiator exposed to the first surface of the substrate. 
 
     
     
       2. The electronic control device according to  claim 1 , wherein
 the substrate includes substrate electrodes, 
 the terminals are connected to the substrate electrodes with solder, and 
 a part of the substrate electrodes is exposed to an inside of the through hole of the substrate. 
 
     
     
       3. The electronic control device according to  claim 1 , wherein
 the second heat radiator is exposed to the first surface of the substrate via the through hole provided in the substrate. 
 
     
     
       4. The electronic control device according to  claim 3 , wherein
 the terminals are connected, with solder, to substrate electrodes provided on the first surface of the substrate. 
 
     
     
       5. The electronic control device according to  claim 4 , wherein
 the second heat radiator has a curability and an insulating property.