Manufacture of electronic circuits

Abstract

The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.

What is claimed is: 
     
       1. A method for manufacturing an electronic circuit in a production installation, the method comprising:
 detachably connecting a circuit carrier to a measuring module before performance of a process step; 
 performing a measurement with the measuring module during the performance of the process step; 
 removing the measuring module from the circuit carrier after termination of the process step; and 
 mounting an electronic module to the circuit carrier in a location of the measuring module after the measuring module has been removed from the circuit carrier; 
 wherein the process step includes at least one step selected from the group consisting of: applying solder to the circuit carrier, fitting components to the circuit carrier, wetting the circuit carrier with a flux, and forming solder joints on the circuit carrier. 
 
     
     
       2. The method as claimed in  claim 1 , further comprising accessing an electronic component comprising part of the electronic circuit on the circuit carrier, by the measuring module during the process step. 
     
     
       3. The method as claimed in  claim 1 , further comprising producing measurement data with the measuring module during the measuring; and
 forwarding the measurement data to the production installation via an interface. 
 
     
     
       4. The method as claimed in  claim 1 , further comprising producing measurement data during the measurement with the measuring module;
 processing the measurement data; and 
 forwarding a result of the processing as data describing the measurement result or control commands for influencing the at least one process step to the production installation via a data interface. 
 
     
     
       5. The method as claimed in  claim 3 , further comprising processing measurement data from a sensor outside the measuring module in the measuring module. 
     
     
       6. The method as claimed in  claim 1 , wherein the measuring module is secured by adhesive bonding, hook and loop fastening, insertion, or magnetic forces. 
     
     
       7. The method as claimed in  claim 1 , wherein the measuring module measures at least one of the group consisting of: a temperature, a position, and an acceleration.