US10450406B2ActiveUtilityA1
Fluorinated polyimide-based epoxy materials
Est. expiryAug 30, 2037(~11.1 yrs left)· nominal 20-yr term from priority
C08G 73/026C08G 59/504C08G 73/1039C08G 73/024C08G 73/1071C08G 59/5033C08G 59/4042C08G 59/506
58
PatentIndex Score
0
Cited by
7
References
7
Claims
Abstract
A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A curing agent composition for curing an epoxy resin comprising:
first and second imide-amine moieties which each include amine terminal functional groups, and
a fluorinated central moiety covalently bonded to the first and second imide-amine moieties,
wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin,
wherein the curing agent has a molecular weight of less than 2000 grams per mole, and
wherein the curing agent has the following formula:
2. A cured epoxy matrix comprising:
an epoxy resin matrix; and
a curing agent composition cross-linked with the epoxy resin, the curing agent including first and second imide-amine moieties which each include amine terminal functional groups and a fluorinated central moiety covalently bonded to the first and second imide-amine moieties, wherein the amine functional groups of the curing agent take part in curing reactions with ring molecules of the epoxy resin matrix,
wherein the curing agent has the following formula:
3. The cured epoxy matrix of claim 2 , wherein the curing agent is homogenously cross-linked with the epoxy resin throughout the matrix.
4. The cured epoxy matrix of claim 2 , wherein the curing agent has a molecular weight of less than 2000 grams per mole.
5. A curing agent composition for curing an epoxy resin comprising:
first and second imide-amine moieties which each include amine terminal functional groups, and
a fluorinated central moiety covalently bonded to the first and second imide-amine moieties,
wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin,
wherein the curing agent has a molecular weight of less than 2000 grams per mole, and
wherein the curing agent has the following formula:
6. A cured epoxy matrix comprising:
an epoxy resin matrix; and
a curing agent composition cross-linked with the epoxy resin, the curing agent including first and second imide-amine moieties which each include amine terminal functional groups and a fluorinated central moiety covalently bonded to the first and second imide-amine moieties, wherein the amine functional groups of the curing agent take part in curing reactions with ring molecules of the epoxy resin matrix,
wherein the curing agent has the following formula:
7. The cured epoxy matrix of claim 6 , wherein the curing agent is homogenously cross-linked with the epoxy resin throughout the matrix.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.