Method for manufacturing active matrix array device, and active matrix array device manufactured thereby

Abstract

A conventional active matrix array device is manufactured by performing various process steps on the same substrate. Control circuit portions each including a transistor are formed in some of the process steps. In contrast, the problem described above is solved by forming the control circuit portions of an active matrix array device on a substrate different from that of other portions, and the control circuit portions are respectively mounted on matrix elements in a middle step of the manufacturing process of the matrix array body or after a final step thereof.

The invention claimed is: 
     
       1. A method for manufacturing an active matrix array device in which a plurality of row interconnects and a plurality of column interconnects that mutually orthogonally intersect and a plurality of matrix elements that are arranged in a vertical direction and a horizontal direction are formed on an active matrix substrate, the method for manufacturing an active matrix array device comprising:
 forming a plurality of control circuits for the matrix elements on a common film on a substrate that is different from the active matrix substrate; 
 separating each of the plurality of control circuits along with a corresponding portion of the film from the different substrate; and 
 arranging the separated plurality of control circuits respectively on regions in each of which a matrix element is to be formed on the active matrix substrate, and connecting the row interconnects and the column interconnects to corresponding electrode portions of the matrix elements, 
 wherein the separated control circuit is arranged on the active matrix substrate with the film facing away from the active matrix substrate. 
 
     
     
       2. The method for manufacturing an active matrix array device according to  claim 1 , wherein a predetermined operation test is performed on each of the control circuits, and only good control circuits are selected and arranged on the active matrix substrate. 
     
     
       3. The method for manufacturing an active matrix array device according to  claim 1 , wherein the control circuits are each an organic TFT formed of an organic semiconductor. 
     
     
       4. The method for manufacturing an active matrix array device according to  claim 1 , wherein the different substrate is constituted by attaching the film to a glass substrate, and when the control circuits are separated along with the film, the control circuits along with the film are peeled off from the glass substrate without the glass substrate being completely cut. 
     
     
       5. An active matrix array device manufactured by the method according to  claim 1 . 
     
     
       6. The method for manufacturing an active matrix array device according to  claim 1 , wherein the active matrix substrate on which the separated control circuit is arranged comprises a gate line connection, a data line connection, and a pixel electrode, the control circuit comprises a gate electrode, a source electrode, and a drain electrode, and the separated control circuit is placed face down on the active matrix substrate so that the gate electrode is electrically connected with the gate line connection, the source electrode is electrically connected with the data line connection, and the drain electrode is electrically connected with the pixel electrode.