Variable pin fin construction to facilitate compliant cold plates

Abstract

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

What is claimed is: 
     
       1. An apparatus, comprising:
 a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises:
 a first active region comprising first pin portions positioned in a first planar arrangement having first links connecting some of the first pin portions, and 
 a second active region comprising second pin portions positioned in a second planar arrangement having second links connecting some of the second pin portions, wherein the second planar arrangement is different from the first planar arrangement, the difference comprising the first planar arrangement having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second planar arrangement; and 
 
 a conformable layer adjacent to at least one of the plurality of layers. 
 
     
     
       2. The apparatus of  claim 1 , wherein the first pin portions positioned in the first planar arrangement result in a first configuration density. 
     
     
       3. The apparatus of  claim 2 , wherein the second pin portions positioned in the second planar arrangement result in a second configuration density. 
     
     
       4. The apparatus of  claim 1 , further comprising:
 a third active region comprising third pin portions positioned in the first planar arrangement, wherein the third active region is disposed between the first active region and the second active region. 
 
     
     
       5. The apparatus of  claim 1 , further comprising:
 a compliant layer disposed on the apparatus and positioned to receive a load or heat source. 
 
     
     
       6. The apparatus of  claim 5 , wherein the compliant layer accommodates dimensional differences between the load or heat source and the apparatus. 
     
     
       7. The apparatus of  claim 1 , wherein the conformable layer is adapted to interface with a load or heat source. 
     
     
       8. The apparatus of  claim 1 , wherein the second planar arrangement is different from the first planar arrangement to facilitate a pressure drop across the apparatus. 
     
     
       9. An apparatus, comprising:
 a plurality of layers adapted to couple to a load or heat source, wherein the plurality of layers are bonded in a stacked configuration and comprise:
 a first active region comprising first pin portions positioned in a first planar arrangement having first links connecting some of the first pin portions, 
 a second active region comprising second pin portions positioned in a second planar arrangement having second links connecting some of the second pin portions, wherein the second planar arrangement is different from the first planar arrangement, the difference comprising the first planar arrangement having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second planar arrangement; and 
 
 a conformable layer adjacent to one or more of the plurality of layers. 
 
     
     
       10. The apparatus of  claim 9 , further comprising:
 links connecting a pair of adjacent pin portions between the first pin portions and the second pin portions to form a planar sheet such that a configuration of a width of the second pin portions to a width of the links is adapted to make the planar sheet flexible. 
 
     
     
       11. The apparatus of  claim 10 , wherein the first planar arrangement is configured in a first pattern and the second planar arrangement is configured in a second pattern and wherein the first pattern is different than the second pattern. 
     
     
       12. The apparatus of  claim 9 , further comprising:
 a third active region comprising third pin portions positioned in the first planar arrangement. 
 
     
     
       13. The apparatus of  claim 9 , further comprising:
 a compliant layer coupled to one or more of the first pin portions and one or more of the second pin portions. 
 
     
     
       14. The apparatus of  claim 9 , wherein the second pin portions are configured to facilitate a pressure drop across the apparatus. 
     
     
       15. A method comprising:
 providing a plurality of layers comprising a plurality of respective pin portions, wherein the providing the plurality of layers comprises:
 configuring a first plurality of first pin portions of a first layer, of the plurality of layers, according to a first configuration having first links connecting some of the first pin portions; and 
 configuring a second plurality of second pin portions of a second layer, of the plurality of layers, according to a second configuration having second links connecting some of the second pin portions, wherein the second configuration is different from the first configuration, the difference comprising the first configuration having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second configuration; 
 
 aligning the first plurality of first pin portions adjacent to the second plurality of second pin portions; 
 stacking the plurality of layers according to the aligning, resulting in adjacent layers; and 
 bonding the adjacent layers and a conformable layer to form a stack of bonded layers, wherein the first plurality of first pin portions and the second plurality of second pin portions form columns of pin fins. 
 
     
     
       16. The method of  claim 15 , wherein the configuring the first plurality of first pin portions comprises configuring an active region of the first plurality of first pin portions in a different configuration than another active region of the second plurality of second pin portions. 
     
     
       17. The method of  claim 16 , wherein the active region comprises a first pin fin density associated with the first plurality of first pin portions that is less than a second pin fin density associated with the second plurality of second pin portions of the other active region. 
     
     
       18. The method of  claim 15 , further comprising:
 adapting an outer layer of the plurality of layers to be compliant with a load or heat source. 
 
     
     
       19. The method of  claim 18 , wherein the outer layer comprises a thermally conductive material. 
     
     
       20. The method of  claim 18 , further comprising:
 adapting a plurality of recesses of an interface plate to interface with the outer layer of the plurality of layers and the load or heat source.