Manufacturing method of display device and manufacturing method of electronic device

Abstract

A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.

What is claimed is: 
     
       1. A method for manufacturing a display device, the method comprising steps of:
 forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode; 
 forming a second layer over a second substrate; 
 attaching the first substrate to the second substrate using a bonding layer such that the first layer and the second layer face each other with the display element therebetween; 
 separating the first substrate from the second substrate, wherein the separation occurs in the first layer; 
 attaching a third substrate to the first layer; 
 separating the second substrate from the third substrate, wherein the separation occurs in the second layer, a part of the bonding layer overlapping with the peeling layer, and the peeling layer; 
 attaching a fourth substrate to the second layer; and 
 forming an external electrode electrically connected to the terminal electrode, 
 wherein the first layer comprises a first organic film, and 
 wherein the second layer comprises a second organic film. 
 
     
     
       2. The method according to  claim 1 , wherein the separation of the first substrate or the second substrate is performed by laser light irradiation. 
     
     
       3. The method according to  claim 1 , wherein the external electrode is a flexible printed circuit. 
     
     
       4. The method according to  claim 1 , further comprising a step of forming a transistor over the first layer. 
     
     
       5. The method according to  claim 1 , wherein the first layer or the second layer comprises a photosensitive resin material. 
     
     
       6. The method according to  claim 1 , further comprising a step of forming a first insulating layer over the first layer and the terminal electrode,
 wherein the first insulating layer comprises a first opening, and 
 wherein the peeling layer is over the first insulating layer and in the first opening. 
 
     
     
       7. The method according to  claim 6 ,
 wherein the first layer comprises a second insulating layer over the first organic film, and 
 wherein the second layer comprises a third insulating layer over the second organic film. 
 
     
     
       8. A method for manufacturing a display device, the method comprising steps of:
 forming a first layer over a first substrate, a terminal electrode over the first layer, a light-emitting element over the first layer, and a peeling layer overlapping with the terminal electrode; 
 forming a second layer over a second substrate; 
 attaching the first substrate to the second substrate using a bonding layer such that the first layer and the second layer face each other with the light-emitting element therebetween; 
 separating the first substrate from the second substrate, wherein the separation occurs in the first layer; 
 attaching a third substrate to the first layer; 
 separating the second substrate from the third substrate, wherein the separation occurs in the second layer, a part of the bonding layer overlapping with the peeling layer, and the peeling layer; 
 attaching a fourth substrate to the second layer; and 
 forming an external electrode electrically connected to the terminal electrode, 
 wherein the first layer comprises a first organic film, 
 wherein the second layer comprises a second organic film, 
 wherein the light-emitting element comprises a first electrode, an EL layer, and a second electrode, 
 wherein the peeling layer comprises a first peeling layer and a second peeling layer, and 
 wherein the EL layer and the first peeling layer are formed from a same material. 
 
     
     
       9. The method according to  claim 8 , wherein the second electrode and the second peeling layer are formed from a same material. 
     
     
       10. The method according to  claim 8 , wherein the separation of the first substrate or the second substrate is performed by laser light irradiation. 
     
     
       11. The method according to  claim 8 , wherein the external electrode is a flexible printed circuit. 
     
     
       12. The method according to  claim 8 , further comprising a step of forming a transistor over the first layer. 
     
     
       13. The method according to  claim 8 , wherein the first layer or the second layer comprises a photosensitive resin material. 
     
     
       14. The method according to  claim 8 , further comprising a step of forming a first insulating layer over the first layer and the terminal electrode,
 wherein the first insulating layer comprises a first opening, and 
 wherein the first peeling layer and the second peeling layer are over the first insulating layer and in the first opening. 
 
     
     
       15. The method according to  claim 14 ,
 wherein the first layer comprises a second insulating layer over the first organic film, and 
 wherein the second layer comprises a third insulating layer over the second organic film. 
 
     
     
       16. A method for manufacturing a display device, the method comprising steps of:
 forming a first layer over a first substrate, a terminal electrode over the first layer, and a first insulating layer over the terminal electrode and the first layer; 
 forming a first opening in the first insulating layer, the first opening overlapping with a part of the terminal electrode; 
 forming a display element over the first insulating layer, and a peeling layer over the first insulating layer and in the first opening; 
 forming a second layer over a second substrate; 
 forming a second opening in the second layer; 
 attaching the first substrate to the second substrate using a bonding layer such that the first layer and the second layer face each other with the display element therebetween and the first opening and the second opening overlap with each other; 
 peeling the first substrate off from the first layer; 
 attaching a third substrate to the first layer; 
 peeling the second substrate off from the second layer; and 
 attaching a fourth substrate to the second layer, 
 wherein, in the step of peeling the second substrate off from the second layer, a part of the bonding layer between the first opening and the second opening and a part of the peeling layer overlapping with the part of the bonding layer are peeled together with the second substrate so that the part of the terminal electrode is exposed, 
 wherein the first layer comprises a first organic film, and 
 wherein the second layer comprises a second organic film. 
 
     
     
       17. The method according to  claim 16 , wherein the peeling of the first substrate or the second substrate is performed by laser light irradiation. 
     
     
       18. The method according to  claim 16 , further comprising a step of forming a transistor over the first layer. 
     
     
       19. The method according to  claim 16 , wherein the first layer or the second layer comprises a photosensitive resin material. 
     
     
       20. The method according to  claim 16 ,
 wherein the first layer comprises a second insulating layer over the first organic film, and 
 wherein the second layer comprises a third insulating layer over the second organic film.