Liquid cooling device

Abstract

A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

What is claimed is: 
     
       1. A liquid cooling device, configured to be in thermal contact with a first heat source and a second heat source which are disposed on a printed circuit board, the liquid cooling device comprising:
 a first thermal plate, configured to be disposed on the printed circuit board; 
 a second thermal plate, disposed on the first thermal plate, the first thermal plate and the second thermal plate together forming a storage space, and the storage space configured to store a coolant; and 
 a first thermal block and a second thermal block, wherein the first thermal block is configured to be in thermal contact with the first heat source, the second thermal block is configured to be in thermal contact with the second heat source; the first thermal block and the second thermal block are movably disposed on the second thermal plate, such that a protruding height of the first thermal block from the second thermal plate is adjustable according to a gap width between the first heat source and the second thermal plate, and a protruding height of the second thermal block from the second thermal plate is adjustable according to a gap width between the second heat source and the second thermal plate. 
 
     
     
       2. The liquid cooling device according to  claim 1 , further comprising at least one first elastic component and at least one second elastic component, wherein one end of the at least one first elastic component is connected to the first thermal plate or the second thermal plate, and another end of the at least one first elastic component is connected to the first thermal block so that the at least one first elastic component forces the first thermal block to move away from the first thermal plate; one end of the at least one second elastic component is connected to the first thermal plate or the second thermal plate, and another end of the at least one second elastic component is connected to the second thermal block so that the at least one second elastic component forces the second thermal block to move away from the first thermal plate. 
     
     
       3. The liquid cooling device according to  claim 2 , wherein the at least one first elastic component and the at least one second elastic component are located in the storage space, two opposite ends of the first elastic component respectively press against the first thermal plate and the first thermal block, and two opposite ends of the second elastic component respectively press against the first thermal plate and the second thermal block. 
     
     
       4. The liquid cooling device according to  claim 2 , wherein the at least one first elastic component surrounds the first thermal block, the at least one second elastic component surrounds the second thermal block, two opposite ends of the first elastic component respectively press against the second thermal plate and the first thermal block, and two opposite ends of the second elastic component respectively press against the second thermal plate and the second thermal block. 
     
     
       5. The liquid cooling device according to  claim 1 , further comprising a plurality of first guiding pillars and a plurality of second guiding pillars, wherein one end of each of the plurality of first guiding pillars is fixed on the second thermal plate, another end of each of the plurality of first guiding pillars is integrated into the first thermal block, one end of each of the plurality of second guiding pillars is fixed on the second thermal plate, and another end of each of the plurality of second guiding pillars is disposed through the second thermal block. 
     
     
       6. The liquid cooling device according to  claim 5 , further comprising a plurality of first retaining rings and a plurality of second retaining rings, wherein the plurality of first retaining rings are respectively attached to the plurality of first guiding pillars and located on one side of the first thermal block away from the first thermal plate, and the plurality of second retaining rings are respectively attached to the plurality of second guiding pillars and located on one side of the second thermal block away from the first thermal plate. 
     
     
       7. The liquid cooling device according to  claim 6 , further comprising a plurality of first elastic components and a plurality of second elastic components, wherein the plurality of first elastic components are respectively sleeved on the plurality of first guiding pillars, one end of each of the plurality of first elastic components presses against the second thermal plate, and another end of each of the plurality of first elastic components presses against the first thermal block so that the plurality of first elastic components force the first thermal block to move away from the first thermal plate; the plurality of second elastic components are respectively sleeved on the plurality of second guiding pillars, one end of each of the plurality of second elastic components presses against the second thermal plate, and another end of each of the plurality of second elastic components presses against the second thermal block so that the plurality of second elastic components force the second thermal block to move away from the first thermal plate. 
     
     
       8. The liquid cooling device according to  claim 5 , further comprising a plurality of fasteners, wherein some of the plurality of fasteners are respectively disposed through the first thermal plate, the second thermal plate and the plurality of first guiding pillars and configured to be fixed to the printed circuit board, and another some of the plurality of fasteners are respectively disposed through the first thermal plate, the second thermal plate and the plurality of second guiding pillars and configured to be fixed to the printed circuit board. 
     
     
       9. The liquid cooling device according to  claim 1 , wherein the second thermal plate further has a first through hole and a second through hole, the first through hole and the second through hole are connected to the storage space, the first thermal block is slidably disposed in the first through hole, and the second thermal block is slidably disposed in the second through hole. 
     
     
       10. The liquid cooling device according to  claim 9 , wherein the second thermal plate further has a first restricting groove and a second restricting groove, the first restricting groove is connected to the first through hole, the second restricting groove is connected to the second through hole, the first thermal block further has a first restricting protrusion, the first restricting protrusion is slidably located in the first restricting groove, the second thermal block further has a second restricting protrusion, and the second restricting protrusion is slidably located in the second restricting groove. 
     
     
       11. The liquid cooling device according to  claim 9 , further comprising a first sealing component and a second sealing component, wherein the first sealing component is located between and clamped by the second thermal plate and the first thermal block, and the second sealing component is located between and clamped by the second thermal plate and the second thermal block. 
     
     
       12. The liquid cooling device according to  claim 1 , wherein the first thermal block further has a first cooling fin, the first cooling fin is located in the storage space, the second thermal block further has a second cooling fin, and the second cooling fin is located in the storage space. 
     
     
       13. The liquid cooling device according to  claim 1 , further comprising a plurality of fasteners, wherein the plurality of fasteners are disposed through the first thermal plate and the second thermal plate and configured to be fixed to the printed circuit board. 
     
     
       14. The liquid cooling device according to  claim 1 , wherein the first thermal plate further has a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are connected to the storage space. 
     
     
       15. A liquid cooling device, configured to be in thermal contact with a first heat source and a second heat source which are disposed on a printed circuit board, the liquid cooling device comprising:
 a first thermal plate, configured to be disposed on the printed circuit board; 
 a second thermal plate, disposed on the first thermal plate, the first thermal plate and the second thermal plate together forming a storage space, and the storage space configured to store a coolant; and 
 a first thermal block and a second thermal block, wherein the first thermal block is configured to be in thermal contact with the first heat source, the second thermal block is configured to be in thermal contact with the second heat source, the second thermal block is immovably fixed on the second thermal plate; the first thermal block is movably disposed on the second thermal plate, such that a protruding height of the first thermal block from the second thermal plate is adjustable according to a gap width between the first heat source and the second thermal plate. 
 
     
     
       16. The liquid cooling device according to  claim 15 , further comprising at least one first elastic component, wherein one end of the at least one first elastic component is connected to the first thermal plate or the second thermal plate, and another end of the at least one first elastic component is connected to the first thermal block so that the at least one first elastic component forces the first thermal block to move away from the first thermal plate. 
     
     
       17. The liquid cooling device according to  claim 15 , further comprising a plurality of first guiding pillars, wherein one end of each of the plurality of first guiding pillars is fixed on the second thermal plate, and another end of each of the plurality of first guiding pillars is integrated into the first thermal block. 
     
     
       18. The liquid cooling device according to  claim 17 , further comprising a plurality of first retaining rings, wherein the plurality of first retaining rings are respectively attached to the plurality of first guiding pillars and located on one side of the first thermal block away from the first thermal plate. 
     
     
       19. The liquid cooling device according to  claim 18 , further comprising a plurality of first elastic components, wherein the plurality of first elastic components are respectively sleeved on the plurality of first guiding pillars, one end of each of the plurality of first elastic components presses against the first thermal plate, and another end of each of the plurality of first elastic components presses against the first thermal block so that the plurality of first elastic components force the first thermal block to move away from the first thermal plate. 
     
     
       20. The liquid cooling device according to  claim 17 , further comprising a plurality of fasteners, wherein some of the plurality of fasteners are respectively disposed through the first thermal plate, the second thermal plate and the plurality of first guiding pillars and configured to be fixed to the printed circuit board, and another some of the plurality of fasteners are respectively disposed through the first thermal plate and the second thermal plate and configured to be fixed to the printed circuit board. 
     
     
       21. The liquid cooling device according to  claim 15 , further comprising at least one first elastic component, wherein the at least one first elastic component is located in the storage space, and two opposite ends of the at least one first elastic component respectively press against the first thermal plate and the first thermal block. 
     
     
       22. The liquid cooling device according to  claim 15 , further comprising at least one first elastic component, wherein the at least one first elastic component surrounds the first thermal block, and two opposite ends of the at least one first elastic component respectively press against the second thermal plate and the first thermal block. 
     
     
       23. The liquid cooling device according to  claim 15 , wherein the second thermal plate further has a first through hole, the first through hole is connected to the storage space, and the first thermal block is slidably disposed in the first through hole. 
     
     
       24. The liquid cooling device according to  claim 23 , wherein the second thermal plate further has a first restricting groove, the first restricting groove is connected to the first through hole, the first thermal block further has a first restricting protrusion, and the first restricting protrusion is slidably located in the first restricting groove. 
     
     
       25. The liquid cooling device according to  claim 23 , further comprising a first sealing component, wherein the first sealing component is located between and clamped by the second thermal plate and the first thermal block. 
     
     
       26. The liquid cooling device according to  claim 15 , wherein the first thermal block further has a first cooling fin, the first cooling fin is located in the storage space, the second thermal block further has a second cooling fin, and the second cooling fin is located in the storage space. 
     
     
       27. The liquid cooling device according to  claim 15 , further comprising a plurality of fasteners, wherein the plurality of fasteners are disposed through the first thermal plate and the second thermal plate and configured to be fixed to the printed circuit board. 
     
     
       28. A liquid cooling device, configured to be in thermal contact with a first heat source which is disposed on a printed circuit board, the liquid cooling device comprising:
 a first thermal plate, configured to be disposed on the printed circuit board; 
 a second thermal plate, disposed on the first thermal plate, the first thermal plate and the second thermal plate together forming a storage space, and the storage space configured to store a coolant; 
 a first thermal block, configured to be in thermal contact with the first heat source, and the first thermal block movably disposed on the second thermal plate; and 
 a first elastic component, surrounding the first thermal block, wherein one end of the first elastic component is connected to the second thermal plate, and another end of the first elastic component is connected to the first thermal block so that the first elastic component forces the first thermal block to move away from the first thermal plate, and a protruding height of the first thermal block from the second thermal plate is adjustable according to a gap width between the first heat source and the second thermal plate. 
 
     
     
       29. The liquid cooling device according to  claim 28 , further comprising a plurality of first guiding pillars, wherein one end of each of the plurality of first guiding pillars is fixed on the second thermal plate, and another end of each of the plurality of first guiding pillars is integrated into the first thermal block. 
     
     
       30. The liquid cooling device according to  claim 29 , further comprising a plurality of first retaining rings, wherein the plurality of first retaining rings are respectively attached to the plurality of first guiding pillars and located on one side of the first thermal block away from the first thermal plate. 
     
     
       31. The liquid cooling device according to  claim 29 , further comprising a plurality of fasteners, wherein the plurality of fasteners are respectively disposed through the first thermal plate, the second thermal plate and the plurality of first guiding pillars and configured to be fixed to the printed circuit board. 
     
     
       32. The liquid cooling device according to  claim 28 , wherein the second thermal plate further has a first through hole, the first through hole is connected to the storage space, and the first thermal block is slidably disposed in the first through hole. 
     
     
       33. The liquid cooling device according to  claim 32 , further comprising a first sealing component, wherein the first sealing component is located between and clamped by the second thermal plate and the first thermal block. 
     
     
       34. The liquid cooling device according to  claim 28 , wherein the first thermal block further has a first cooling fin, and the first cooling fin is located in the storage space. 
     
     
       35. The liquid cooling device according to  claim 28 , further comprising a plurality of fasteners, wherein the plurality of fasteners are disposed through the first thermal plate and the second thermal plate and configured to be fixed to the printed circuit board. 
     
     
       36. A liquid cooling device, configured to be in thermal contact with a first heat source which is disposed on a printed circuit board, the liquid cooling device comprising:
 a first thermal plate, configured to be disposed on the printed circuit board; 
 a second thermal plate, disposed on the first thermal plate, the first thermal plate and the second thermal plate together forming a storage space, and the storage space configured to store a coolant; 
 a first thermal block, configured to be in thermal contact with the first heat source, and the first thermal block movably disposed on the second thermal plate; 
 a plurality of first guiding pillars, wherein one end of each of the plurality of first guiding pillars is fixed on the second thermal plate, another end of each of the plurality of first guiding pillars is integrated into the first thermal block; and 
 a plurality of first elastic components, respectively surrounding the plurality of first guiding pillars, wherein one end of each of the plurality of first elastic components is connected to the second thermal plate, and another end of each of the plurality of first elastic components is connected to the first thermal block so that the plurality of first elastic components force the first thermal block to move away from the first thermal plate, and a protruding height of the first thermal block from the second thermal plate is adjustable according to a gap width between the first heat source and the second thermal plate. 
 
     
     
       37. The liquid cooling device according to  claim 36 , further comprising a plurality of first retaining rings, wherein the plurality of first retaining rings are respectively attached to the plurality of first guiding pillars and located on one side of the first thermal block away from the first thermal plate. 
     
     
       38. The liquid cooling device according to  claim 36 , further comprising a plurality of fasteners, wherein the plurality of fasteners respectively disposed through the first thermal plate, the second thermal plate and the plurality of first guiding pillars and configured to be fixed to the printed circuit board. 
     
     
       39. The liquid cooling device according to  claim 36 , wherein the second thermal plate further has a first through hole, the first through hole is connected to the storage space, and the first thermal block is slidably disposed in the first through hole. 
     
     
       40. The liquid cooling device according to  claim 39 , further comprising a first sealing component, wherein the first sealing component is located between and clamped by the second thermal plate and the first thermal block. 
     
     
       41. The liquid cooling device according to  claim 36 , wherein the first thermal block further has a first cooling fin, and the first cooling fin is located in the storage space. 
     
     
       42. The liquid cooling device according to  claim 36 , further comprising a plurality of fasteners, wherein the plurality of fasteners are disposed through the first thermal plate and the second thermal plate and configured to be fixed to the printed circuit board. 
     
     
       43. A liquid cooling device, configured to be in thermal contact with a first heat source which is disposed on a printed circuit board, the liquid cooling device comprising:
 a first thermal plate, configured to be disposed on the printed circuit board; 
 a second thermal plate, disposed on the first thermal plate, the first thermal plate and the second thermal plate together forming a storage space, and the storage space configured to store a coolant; 
 a first thermal block, configured to be in thermal contact with the first heat source, and the first thermal block movably disposed on the second thermal plate; 
 a plurality of first guiding pillars, wherein one end of each of the plurality of first guiding pillars is fixed on the second thermal plate, another end of each of the plurality of first guiding pillars is integrated into the first thermal block so as to guide the first thermal block to move relative to the second thermal plate; and 
 a plurality of fasteners, respectively disposed through the first thermal plate, the second thermal plate and the plurality of first guiding pillars and configured to be fixed to the printed circuit board. 
 
     
     
       44. The liquid cooling device according to  claim 43 , further comprising at least one first elastic component, wherein one end of the at least one first elastic component is connected to the first thermal plate or the second thermal plate, and another end of the at least one first elastic component is connected to the first thermal block so that the at least one first elastic component forces the first thermal block to move away from the first thermal plate. 
     
     
       45. The liquid cooling device according to  claim 43 , further comprising a plurality of first retaining rings, wherein the plurality of first retaining rings are respectively attached to the plurality of first guiding pillars and located on one side of the first thermal block away from the first thermal plate. 
     
     
       46. The liquid cooling device according to  claim 43 , wherein the second thermal plate further has a first through hole, the first through hole is connected to the storage space, and the first thermal block is slidably disposed in the first through hole. 
     
     
       47. The liquid cooling device according to  claim 43 , further comprising a first sealing component, wherein the first sealing component is located between and clamped by the second thermal plate and the first thermal block.