Fabrication of phosphor film with heat dissipation film

Abstract

A light emitting device and processes for making the same are disclosed. In an aspect, a light-emitting device comprises a substrate, a light emitting diode disposed adjacent the substrate, a color conversion layer disposed adjacent a side of the substrate opposite the light emitting diode, and a heat dissipation layer disposed adjacent the color conversion layer, wherein one or more of the color conversion layer and the heat dissipation layer are formed using adhesive transfer, and wherein the light-emitting device exhibits improved thermal stability and power efficiency as compared to a comparative light-emitting device consisting essentially of the substrate, the light emitting diode, and the color conversion layer without the heat dissipation layer.

What is claimed is: 
     
       1. A light-emitting device comprising:
 a substrate comprising an optically clear adhesive or an optically clear resin; 
 a light emitting diode disposed adjacent the substrate and configured to emit light through the substrate; 
 a color conversion layer disposed adjacent a side of the substrate opposite the light emitting diode, wherein the color conversion layer comprises phosphor and is disposed on the substrate using an adhesive transfer method; 
 a heat dissipation layer disposed adjacent the color conversion layer, wherein the heat dissipation layer is formed using the adhesive transfer method; and 
 an optically clear resin disposed between the color conversion layer and the heat dissipation layer, 
 wherein the light-emitting device exhibits improved thermal stability as compared to a comparative light-emitting device consisting essentially of the substrate, the light emitting diode, and the color conversion layer without the heat dissipation layer, and 
 wherein the light-emitting device exhibits a power efficiency of between about 30 lm/W and about 150 lm/W measured using L-79 test method. 
 
     
     
       2. The light-emitting device of  claim 1 , wherein the heat dissipation layer comprises boron nitride, aluminum nitride, aluminum oxide, silicon nitride, silicon carbide powder, or a combination thereof. 
     
     
       3. The light-emitting device of  claim 1 , wherein the heat dissipation layer is interposed between the color conversion layer and the light emitting diode or wherein the color conversion layer is interposed between the heat dissipation layer and the light emitting diode. 
     
     
       4. The light-emitting device of  claim 1 , wherein the substrate and the color conversion layer are formed as a stacked film. 
     
     
       5. The light-emitting device of  claim 1 , further comprising a hard coating layer disposed such that each of the heat dissipation layer and the color conversion layer are interposed between the hard coating layer and the light emitting diode, wherein the hard coating layer comprises polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polyurethane, polystyrene, polypropylene, polyetherimide, or a combination thereof. 
     
     
       6. The light-emitting device of  claim 5 , wherein the color conversion layer, the heat dissipation layer, and the hard coating layer are affixed to the substrate using an adhesive transfer method. 
     
     
       7. A method of forming the light-emitting device of  claim 1 . 
     
     
       8. A light-emitting device comprising:
 a substrate; 
 a light emitting diode disposed adjacent the substrate; 
 a color conversion layer disposed adjacent a side of the substrate opposite the light emitting diode; 
 a heat dissipation layer disposed adjacent the color conversion layer; and 
 an optically clear resin disposed between the color conversion layer and the heat dissipation layer, 
 wherein one or more of the color conversion layer and the heat dissipation layer are formed using adhesive transfer, and wherein the light-emitting device exhibits improved thermal stability and power efficiency as compared to a comparative light-emitting device consisting essentially of the substrate, the light emitting diode, and the color conversion layer without the heat dissipation layer. 
 
     
     
       9. The light-emitting device of  claim 8 , wherein the color conversion layer comprises phosphor powder. 
     
     
       10. The light-emitting device of  claim 9 , wherein the phosphor powder is selected from the group consisting of red, green, and yellow phosphor powder. 
     
     
       11. The light-emitting device of  claim 8 , wherein the color conversion layer comprises cerium doped yttrium-aluminum-garnet yellow phosphor powder. 
     
     
       12. The light-emitting device of  claim 8 , wherein the heat dissipation layer comprises boron nitride, aluminum nitride, aluminum oxide, silicon nitride, or silicon carbide powder. 
     
     
       13. The light-emitting device of  claim 8 , wherein the heat dissipation layer is interposed between the color conversion layer and the light emitting diode. 
     
     
       14. The light-emitting device of  claim 8 , wherein the color conversion layer is interposed between the heat dissipation layer and the light emitting diode. 
     
     
       15. The light-emitting device of  claim 8 , wherein the substrate comprises an optically clear adhesive or an optically clear resin. 
     
     
       16. The light-emitting device of  claim 15 , wherein the optically clear adhesive or the optically clear resin comprises acrylate, PAA (polyacrylic acid), silicone, urethane, or epoxy groups, or a combination thereof.