Split resonator and printed circuit board including the same

Abstract

A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

What is claimed is: 
     
       1. A printed circuit board (PCB) comprising:
 a substrate on which one or more electronic components are populated; 
 a dielectric substrate mounted to one side of the substrate; 
 one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other, and 
 a connection portion provided in the dielectric substrate, and configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate, 
 wherein the one pair of conductors comprises a first conductor and a second conductor, and a length of the first conductor is longer than a distance between the connecting portion and one end of the second conductor, and a length of the second conductor is longer than a distance between the connecting portion and one end of the first conductor. 
 
     
     
       2. The printed circuit board (PCB) according to  claim 1 , wherein the connection portion includes a plurality of connection portions configured to interconnect the one pair of conductors. 
     
     
       3. The printed circuit board (PCB) according to  claim 1 , wherein the one pair of conductors is arranged at a predetermined angle with respect to the thickness direction. 
     
     
       4. The printed circuit board (PCB) according to  claim 1 , wherein the one pair of conductors, the connection portion, and the dielectric substrate are arranged to be symmetrical to each other with respect to an axis in the thickness direction. 
     
     
       5. The printed circuit board (PCB) according to  claim 1 , wherein the dielectric substrate includes FR4. 
     
     
       6. The printed circuit board (PCB) according to  claim 1 , wherein the one pair of conductors has a capacitance, said capacitance based on a predetermined width of the one pair of conductors. 
     
     
       7. The printed circuit board (PCB) according to  claim 1 , wherein the connection portion has an inductance, said inductance based on a cylindrical shape of the connection portion. 
     
     
       8. The printed circuit board (PCB) according to  claim 1 , wherein the conductor and the connection portion are formed of metal. 
     
     
       9. The printed circuit board (PCB) according to  claim 1 , wherein the substrate includes:
 a first ground plane provided in the substrate; 
 a signal line located below the first ground plane, and spaced apart from the first ground plane; and 
 a second ground plane located below the signal line and spaced apart from the signal line. 
 
     
     
       10. A printed circuit board (PCB) comprising:
 a substrate on which one or more electronic components are populated; 
 a dielectric substrate mounted to one side of the substrate; and 
 one or more split resonators provided in the dielectric substrate, and periodically arranged in the dielectric substrate, 
 wherein the split resonator includes: 
 one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and 
 a connection portion provided in the dielectric substrate, and configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate, 
 wherein the one pair of conductors comprises a first conductor and a second conductor, and a length of the first conductor is longer than a distance between the connecting portion and one end of the second conductor, and a length of the second conductor is longer than a distance between the connecting portion and one end of the first conductor. 
 
     
     
       11. The printed circuit board (PCB) according to  claim 10 , wherein the connection portion includes a plurality of connection portions configured to interconnect the one pair of conductors. 
     
     
       12. The printed circuit board (PCB) according to  claim 10 , wherein the one pair of conductors is arranged at a predetermined angle with respect to the thickness direction. 
     
     
       13. The printed circuit board (PCB) according to  claim 10 , wherein the split resonators are symmetrical to each other with respect to an axis in the thickness direction. 
     
     
       14. The printed circuit board (PCB) according to  claim 10 , wherein the dielectric substrate includes an FR4 epoxy substrate. 
     
     
       15. The printed circuit board (PCB) according to  claim 10 , wherein the one pair of conductors has a capacitance, said capacitance based on a predetermined width of the one pair of conductors. 
     
     
       16. The printed circuit board (PCB) according to  claim 10 , wherein the connection portion has an inductance, said inductance based on a cylindrical shape of the connection portion. 
     
     
       17. The printed circuit board (PCB) according to  claim 10 , wherein the conductor and the connection portion are formed of metal. 
     
     
       18. The printed circuit board (PCB) according to  claim 10 , wherein the substrate includes:
 a first ground plane provided in the substrate; 
 a signal line located below the first ground plane, and spaced apart from the first ground plane; and 
 a second ground plane located below the signal line and spaced apart from the signal line. 
 
     
     
       19. A split resonator comprising:
 one pair of conductors provided in a dielectric substrate, spaced apart from a substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and 
 a connection portion provided in the dielectric substrate, and configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate, 
 wherein the one pair of conductors comprises a first conductor and a second conductor, and a length of the first conductor is longer than a distance between the connecting portion and one end of the second conductor, and a length of the second conductor is longer than a distance between the connecting portion and one end of the first conductor.