Electronic component

Abstract

An electronic component includes: four device chips having rectangular planar shapes and arranged on a substrate so that a corner of four corners constituting a rectangle of one device chip is adjacent to the corners of remaining three device chips; first pads located on surfaces of the four device chips and closest to the corner; one or more first bumps bonding the first pads to the substrate in the four device chips; second pads located on surfaces of the four device chips, the second pad being one of pads other than the first pad; and one or more second bumps bonding the second pads to the substrate in the four device chips, a sum of bonded areas between the one or more second bumps and the second pad being less than a sum of bonded areas between the first pad and the one or more first bumps.

What is claimed is: 
     
       1. An electronic component comprising:
 a substrate; 
 four device chips each having a rectangular planar shape, the four device chips being arranged on the substrate so that a corner, which is one corner of four corners constituting a rectangle of one device chip of the four device chips, is adjacent to the corner of each of remaining three device chips of the four device chips; 
 a first pad located on a surface at the substrate side of each of the four device chips and closest to the corner; 
 one or more first bumps bonding the first pad to the substrate in each of the four device chips; 
 a second pad located on the surface at the substrate side of each of the four device chips, the second pad being one of pads other than the first pad; and 
 one or more second bumps bonding the second pad to the substrate in each of the four device chips, a sum of bonded areas between the second pad and the one or more second bumps being less than a sum of bonded areas between the first pad and the one or more first bumps, 
 wherein 
 each of the four device chips includes an acoustic wave element facing the substrate across an air gap. 
 
     
     
       2. The electronic component according to  claim 1 , wherein
 in one of the four device chips, the sum of the bonded areas between the second pad and the one or more second bumps is equal to or less than two-thirds of the sum of the bonded areas between the first pad and the one or more first bumps. 
 
     
     
       3. The electronic component according to  claim 1 , wherein
 in each of the four device chips, only one first bump is bonded with the first pad. 
 
     
     
       4. The electronic component according to  claim 1 , wherein
 in each of the four device chips, a plurality of first bumps is bonded with the first pad. 
 
     
     
       5. The electronic component according to  claim 4 , wherein
 in each of the four device chips, a bonded area between the first pad and one of a plurality of the first bumps is approximately equal to a bonded area between the second pad and one of the one or more second bumps. 
 
     
     
       6. The electronic component according to  claim 1 , wherein
 adjacent two sides of adjacent two device chips of the four device chips are substantially parallel. 
 
     
     
       7. The electronic component according to  claim 1 , wherein
 each of the four device chips includes an acoustic wave filter facing the substrate across an air gap and connected between a common terminal and a signal terminal, and 
 the first pad is coupled to the common terminal. 
 
     
     
       8. The electronic component according to  claim 1 , wherein
 in each of the four device chips, a bonded area between the second pad and one of the one or more second bumps is less than the sum of the bonded areas between the first pad and the one or more first bumps. 
 
     
     
       9. The electronic component according to  claim 1 , wherein
 in each of the four device chips, only one second bump is bonded with the second pad. 
 
     
     
       10. An electronic component comprising:
 a substrate; 
 four device chips each having a rectangular planar shape, the four device chips being arranged on the substrate so that a corner, which is one corner of four corners constituting a rectangle of one device chip of the four device chips, is adjacent to the corner of each of remaining three device chips of the four device chips; 
 a first ad located on a surface at the substrate side of each of the four device chips and closest to the corner; 
 one or more first bumps bonding the first pad to the substrate in each of the four device chips; 
 a second pad located on the surface at the substrate side of each of the four device chips, the second pad being one of pads other than the first pad; and 
 one or more second bumps bonding the second pad to the substrate in each of the four device chips, a sum of bonded areas between the second pad and the one or more second bumps being less than a sum of bonded areas between the first pad and the one or more first bumps, 
 
       wherein
 each of the four device chips includes an acoustic wave filter facing the substrate across an air gap and connected between an input terminal and an output terminal. 
 
     
     
       11. The electronic component according to  claim 10 , wherein
 the first pad is coupled to the input terminal or the output terminal. 
 
     
     
       12. The electronic component according to  claim 10 , wherein
 in one of the four device chips, the sum of the bonded areas between the second pad and the one or more second bumps is equal to or less than two-thirds of the sum of the bonded areas between the first pad and the one or more first bumps. 
 
     
     
       13. The electronic component according to  claim 10 , wherein
 in each of the four device chips, only one first bump is bonded with the first pad. 
 
     
     
       14. The electronic component according to  claim 10 , wherein
 in each of the four device chips, a plurality of first bumps is bonded with the first pad. 
 
     
     
       15. The electronic component according to  claim 10 , wherein
 in each of the four device chips, a bonded area between the first pad and one of a plurality of the first bumps is approximately equal to a bonded area between the second pad and one of the one or more second bumps. 
 
     
     
       16. The electronic component according to  claim 10 , wherein
 adjacent two sides of adjacent two device chips of the four device chips are substantially parallel. 
 
     
     
       17. The electronic component according to  claim 10 , wherein
 in each of the four device chips, a bonded area between the second pad and one of the one or more second bumps is less than the sum of the bonded areas between the first pad and the one or more first bumps. 
 
     
     
       18. The electronic component according to  claim 10 , wherein
 in each of the four device chips, only one second bump is bonded with the second pad.