Substrate treating apparatus, and method of controlling the substrate treating apparatus

Abstract

In a coating apparatus, a nozzle moving mechanism selectively grips any one of a plurality of coating solution nozzles, moves the gripped coating solution nozzle and a solvent nozzle together, and moves at least the solvent nozzle to a solvent suction unit. The moved solvent nozzle is caused to dispense a solvent to the solvent suction unit, and the gripped coating solution nozzle is caused to suck the solvent retained in the same solvent suction unit to which the solvent has been dispensed. Thus, since dispensation and suction of the solvent are done in the same solvent suction unit, the quantity of the solvent used can be held down. Further, a supply line for supplying the solvent does not need to be provided for the suction unit. The construction of the suction unit can therefore be made simple, and its cost can be held down.

The invention claimed is: 
     
       1. A substrate treating apparatus comprising:
 a plurality of first nozzles for dispensing a first treating liquid to substrates; 
 a second nozzle for dispensing a second treating liquid to the substrates; 
 a nozzle moving mechanism for gripping one of the plurality of first nozzles and moving the gripped first nozzle and the second nozzle together; 
 a suction unit for allowing the gripped first nozzle to suck the second treating liquid, the suction unit including a receiving vessel for receiving the second treating liquid dispensed from the second nozzle, and a retaining vessel provided separate from the receiving vessel and communicating with the receiving vessel; and 
 a controller for causing the nozzle moving mechanism to move at least the second nozzle to the suction unit, causing the moved second nozzle to dispense the second treating liquid to the receiving vessel, and causing the gripped first nozzle to suck the second treating liquid retained in the retaining vessel. 
 
     
     
       2. The substrate treating apparatus according to  claim 1 , wherein:
 one or more suction units are provided in a number smaller than the plurality of first nozzles; and 
 the controller causes the nozzle moving mechanism to move at least the second nozzle to one of the suction units. 
 
     
     
       3. The substrate treating apparatus according to  claim 1 , further comprising a nozzle standby portion for receiving the first nozzles on standby;
 wherein the suction unit is provided separate from the nozzle standby portion. 
 
     
     
       4. The substrate treating apparatus according to  claim 3 , further comprising a plurality of holding and spinning units for holding and spinning the substrates;
 wherein the suction unit is provided between two adjacent holding and spinning units of the plurality of holding and spinning units. 
 
     
     
       5. The substrate treating apparatus according to  claim 1 , wherein the controller causes the nozzle moving mechanism to move the first nozzle and the second nozzle to the suction unit, after the movement, in a state of positions of the gripped first nozzle, the second nozzle, and the suction unit being fixed, causes the second nozzle to dispense the second treating liquid to the suction unit, and causes the gripped first nozzle to suck the second treating liquid retained in the suction unit to which the second treating liquid has been dispensed. 
     
     
       6. The substrate treating apparatus according to  claim 1 , wherein:
 the controller causes the nozzle moving mechanism to move the second nozzle to the suction unit, and causes the moved second nozzle to dispense the second treating liquid to the suction unit; and 
 the controller causes the nozzle moving mechanism to move the gripped first nozzle at least horizontally to the suction unit to which the second treating liquid has been dispensed, and after the movement of the first nozzle, causes the gripped first nozzle to suck the second treating liquid retained in the suction unit. 
 
     
     
       7. The substrate treating apparatus according to  claim 1 , wherein the first treating liquid is a coating solution for forming film on the substrates. 
     
     
       8. The substrate treating apparatus according to  claim 1 , wherein the second treating liquid is a solvent. 
     
     
       9. The substrate treating apparatus according to  claim 1 , further comprising a plurality of holding and spinning units for holding and spinning the substrates;
 wherein the suction unit is provided between two adjacent holding and spinning units of the plurality of holding and spinning units. 
 
     
     
       10. A method of controlling a substrate treating apparatus having a plurality of first nozzles for dispensing a first treating liquid to substrates, and a second nozzle for dispensing a second treating liquid to the substrates, the method comprising:
 a step of causing a nozzle moving mechanism for gripping one of the plurality of first nozzles and moving the gripped first nozzle and the second nozzle together to move at least the second nozzle to a suction unit; 
 a step of causing the moved second nozzle to dispense the second treating liquid to a receiving vessel of the suction unit; and 
 a step of causing the gripped first nozzle to suck the second treating liquid retained in a retaining vessel of the suction unit, the retaining vessel being provided separate from the receiving vessel and communicating with the receiving vessel.