Electronic component including outer electrodes and a shield electrode

Abstract

An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.

What is claimed is: 
     
       1. An electronic component comprising:
 a main body having a rectangular or substantially rectangular parallelepiped shape; 
 an inner conductor that is provided inside the main body; 
 one or more outer electrodes that are provided on a bottom surface of the main body and are not provided on four side surfaces of the main body; and 
 a shield electrode that covers the four side surfaces of the main body and has a rectangular or substantially rectangular cylindrical shape; wherein 
 the shield electrode is not physically connected to the one or more outer electrodes at a surface of the main body and is physically connected to the inner conductor at a surface of the main body; and 
 the main body includes a stack of a plurality of insulator layers on top of one another in a stacking direction that connects the top surface and the bottom surface of the main body; 
 the plurality of insulator layers include a first insulator layer; and 
 the electronic component further comprises; 
 one or more passive elements that are provided in the main body; and 
 a first ground conductor that is provided on the first insulator layer, which is positioned closer to the top surface of the main body than the one or more passive elements. 
 
     
     
       2. The electronic component according to  claim 1 , wherein
 the one or more outer electrodes include an outer ground electrode that is connected to a ground potential; and 
 the inner conductor electrically connects the shield electrode and the outer ground electrode. 
 
     
     
       3. The electronic component according to  claim 1 , wherein the shield electrode is provided on a top surface of the main body. 
     
     
       4. The electronic component according to  claim 1 , further comprising a resin layer that covers at least a portion of a surface of the shield electrode. 
     
     
       5. The electronic component according to  claim 1 , wherein the shield electrode is not provided on a top surface of the main body. 
     
     
       6. The electronic component according to  claim 5 , wherein the shield electrode does not extend up to the top surface and/or the bottom surface of the main body. 
     
     
       7. The electronic component according to  claim 5 , wherein a surface roughness of the shield electrode is higher than a surface roughness of the main body. 
     
     
       8. The electronic component according to  claim 5 , further comprising a conductor layer provided on the top surface of the main body. 
     
     
       9. The electronic component according to  claim 5 , wherein the plurality of insulator layers are dielectric layers. 
     
     
       10. The electronic component according to  claim 5 , wherein
 the plurality of insulator layers further include a second insulator layer, the second insulator layer being a different layer from the first insulator layer and being positioned closer to the top surface of the main body than the one or more passive elements; and 
 the electronic component further comprises; a second ground conductor that is provided on the second insulator layer; wherein 
 the first ground conductor covers a portion of the first insulator layer; 
 the second ground conductor covers a portion of the second insulator layer; and the first ground conductor and the second ground conductor are collectively 
 superposed with an entirety or substantially an entirety of the top surface of the main body when viewed in the stacking direction. 
 
     
     
       11. The electronic component according to  claim 10 , wherein the first insulator layer and the second insulator layer contact each other at a portion of the second insulator layer where the second ground conductor does not cover the second insulator layer. 
     
     
       12. The electronic component according to  claim 10 , wherein the first ground conductor is exposed to a region outside the main body and is connected to the shield electrode. 
     
     
       13. The electronic component according to  claim 10 , wherein the first ground conductor is connected to the shield electrode at the four side surfaces of the main body. 
     
     
       14. The electronic component according to  claim 10 , wherein the second ground conductor includes ground conductor layers that are L shaped or substantially L shaped. 
     
     
       15. The electronic component according to  claim 10 , wherein the second ground conductor is exposed to a region outside the main body and is connected to the shield electrode. 
     
     
       16. The electronic component according to  claim 10 , wherein the second ground conductor is connected to the shield electrode at the four side surfaces of the main body. 
     
     
       17. The electronic component according to  claim 10 , wherein the electronic component is a chip component. 
     
     
       18. The electronic component according to  claim 1 , wherein the shield electrode is made of copper and stainless steel. 
     
     
       19. The electronic component according to  claim 1 , wherein the inner conductor is made of a material that is different a material from which the shield electrode is made. 
     
     
       20. The electronic component according to  claim 1 , wherein the inner conductor is made of copper and the shield electrode is made of copper and stainless steel.