Electronic device and method for fabricating the same

Abstract

The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

What is claimed is: 
     
       1. A method for fabricating an electronic device, comprising:
 providing an optical layer, wherein the optical layer comprises a first surface and a second surface opposite to each other, and the first surface has a plurality of first convex lens structures; 
 forming an adhesive layer on the first convex lens structures; 
 picking up a plurality of light-emitting elements by using the first convex lens structures, wherein the light-emitting elements are bonded on the first convex lens structures through the adhesive layer; and 
 transferring, through the optical layer, the light-emitting elements bonded by the first convex lens structures to a driving-circuit substrate. 
 
     
     
       2. The method for fabricating an electronic device according to  claim 1 , wherein the step of providing the optical layer comprises:
 injecting an optical material into a female die, wherein a first surface inside the female die has a plurality of first curved grooves corresponding to the first convex lens structures; 
 curing the optical material inside the female die to form the optical layer; and 
 separating the female die from the optical layer. 
 
     
     
       3. The method for fabricating an electronic device according to  claim 1 , wherein the second surface of the optical layer has a plurality of second convex lens structures, and the method further comprises:
 before the step of picking up light-emitting elements, bonding a carrier to the second convex lens structures, wherein adhesiveness between the carrier and the second convex lens structures is less than adhesiveness of the adhesive layer; and 
 after the step of transferring the light-emitting elements to the driving-circuit substrate, removing the carrier. 
 
     
     
       4. The method for fabricating an electronic device according to  claim 3 , wherein the step of providing the optical layer comprises:
 injecting an optical material into a female die, wherein a first surface inside the female die has a plurality of first curved grooves corresponding to the first convex lens structures, and a second surface inside the female die has a plurality of second curved grooves corresponding to the second convex lens structures; 
 curing the optical material inside the female die to form the optical layer; and 
 separating the female die from the optical layer. 
 
     
     
       5. The method for fabricating an electronic device according to  claim 1 , wherein the driving-circuit substrate comprises:
 a substrate; 
 a plurality of driving elements, disposed on the substrate; 
 an insulation layer, disposed on the driving elements; 
 a plurality of first connection electrodes, wherein each of the first connection electrodes has a first end and a second end, the first end is electrically connected to a corresponding driving element, and the second end is disposed on the insulation layer; 
 a plurality of second connection electrodes, disposed on the insulation layer; and 
 a patterned bank layer, disposed on the insulation layer, and having a plurality of openings; 
 wherein the step of transferring the light-emitting elements to the driving-circuit substrate comprises:
 transferring the light-emitting elements inside the openings, wherein the first electrode of each of the light-emitting elements is electrically connected to the second end of a corresponding first connection electrode, and the second electrode of each of the light-emitting elements is electrically connected to a corresponding second connection electrode. 
 
 
     
     
       6. The method for fabricating an electronic device according to  claim 1 , further comprising:
 after the step of transferring the light-emitting elements to the driving-circuit substrate, forming a sealant between the optical layer and the driving-circuit substrate; and 
 curing the sealant located on an edge of the optical layer and an edge of the driving-circuit substrate, wherein the light-emitting elements on an inner side of the sealant.