Resistor with upper surface heat dissipation

Abstract

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

What is claimed is: 
     
       1. A resistor comprising:
 a resistive element having an upper surface, an opposite bottom surface, a first side, and an opposite second side; and 
 a first heat dissipation element adjacent the first side of the resistive element, the first heat dissipation element having a bottom surface thermally coupled to the upper surface of the resistive element by an adhesive, an outer portion of the first heat dissipation element compressed in an area adjacent the first side of the resistive element, a bottom surface of the outer portion of the first heat dissipation element being bent toward the resistive element; 
 a second heat dissipation element adjacent the second side of the resistive element and separated by a gap from the first heat dissipation element, the second heat dissipation element having a bottom surface thermally coupled to the upper surface of the resistive element by an adhesive, an outer portion of the second heat dissipation element compressed in an area adjacent the second side of the resistive element, a bottom surface of the outer portion of the second heat dissipation element being bent toward the resistive element; 
 a first electrode layer positioned along the bottom surface of the resistive element, adjacent the first side of the resistive element; and 
 a second electrode layer positioned along the bottom surface of the resistive element, adjacent the second side of the resistive element. 
 
     
     
       2. The resistor of  claim 1 , further comprising:
 a first solderable layer covering a first side of the resistor, the first solderable layer in contact with the first heat dissipation element, the resistive element, and the first electrode layer; and, 
 a second solderable layer covering a second side of the resistor, the second solderable layer in contact with the second heat dissipation element, the resistive element, and the second electrode layer. 
 
     
     
       3. The resistor of  claim 2 , wherein the first solderable layer covers at least a portion of an upper surface of the first heat dissipation element, and at least a portion of a bottom surface of the first electrode layer. 
     
     
       4. The resistor of  claim 3 , wherein the second solderable layer covers at least a portion of an upper surface of the second heat dissipation element, and at least a portion of a bottom surface of the second electrode layer. 
     
     
       5. The resistor of  claim 1 , wherein each of the first heat dissipation element and the second heat dissipation element has a swage at upper and outer corners of the heat dissipation elements. 
     
     
       6. The resistor of  claim 5 , wherein the swages form a step in each of the heat dissipation elements, with the outer portions of the heat dissipation elements having a first height, and inner portions of the heat dissipation elements have a second height greater than the first height. 
     
     
       7. The resistor of  claim 1 , wherein an outer portion of the bottom surface of the first heat dissipation element is positioned closer to the first electrode layer than an inner portion of the bottom surface of the first heat dissipation element, and wherein an outer portion of the bottom surface of the second heat dissipation element is positioned closer to the second electrode layer than an inner portion of the bottom surface of the second heat dissipation element. 
     
     
       8. The resistor of  claim 1 , wherein the first side of the resistive element is rounded, and wherein the second side of the resistive element is rounded. 
     
     
       9. The resistor of  claim 1 , wherein the adhesive is compressed in an area adjacent the first side of the resistive element, and wherein the adhesive is compressed in an area adjacent the second side of the resistive element. 
     
     
       10. The resistor of  claim 9 , wherein the resistive element has curved upper and outer corners adjacent areas where the adhesive is compressed. 
     
     
       11. A method of manufacturing a resistor, the method comprising:
 providing a resistive element having an upper surface, a bottom surface, a first side, and an opposite second side; and 
 thermally coupling a first heat dissipation element to the upper surface of the resistive element adjacent the first side of the resistive element by an adhesive; 
 thermally coupling a second heat dissipation element to the upper surface of the resistive element adjacent the second side of the resistive element by an adhesive; 
 compressing an outer portion the first heat dissipation element so as to bend an outer portion of a bottom surface of the first heat dissipation toward the resistive element in an area adjacent the first side of the resistive element; 
 compressing an outer portion the second heat dissipation element so as to bend an outer portion of a bottom surface of the second heat dissipation toward the resistive element in an area adjacent the second side of the resistive element; 
 providing a first electrode layer along the bottom surface of the resistive element, adjacent the first side of the resistive element; and 
 providing a second electrode layer positioned along the bottom surface of the resistive element, adjacent the second side of the resistive element. 
 
     
     
       12. The method of  claim 11 , further comprising the steps of:
 plating a first solderable layer to a first side of the resistor, the first solderable layer in contact with the first heat dissipation element, the resistive element, and the first electrode layer; and, 
 plating a second solderable layer to a second side of the resistor, the second solderable layer in contact with the second heat dissipation element, the resistive element, and the second electrode layer. 
 
     
     
       13. The method of  claim 12 , wherein the first solderable layer covers at least a portion of an upper surface of the first heat dissipation element, and at least a portion of a bottom surface of the first electrode layer. 
     
     
       14. The method of  claim 13 , wherein the second solderable layer covers at least a portion of an upper surface of the second heat dissipation element, and at least a portion of a bottom surface of the second electrode layer. 
     
     
       15. The method of  claim 11 , further comprising forming a swage in each of the heat dissipation elements at upper and outer corners of the heat dissipation elements. 
     
     
       16. The method of  claim 15 , wherein the swages form a step in each of the heat dissipation elements, with the outer portions of the heat dissipation elements having a first height, and inner portions of the heat dissipation elements have a second height greater than the first height. 
     
     
       17. The method if  claim 11 , further comprising positioning an outer portion of the bottom surface of the first heat dissipation element closer to the first electrode layer than an inner portion of the bottom surface of the first heat dissipation element, and positioning an outer portion of the bottom surface of the second heat dissipation element closer to the second electrode layer than an inner portion of the bottom surface of the second heat dissipation element. 
     
     
       18. The method of  claim 11 , further comprising rounding the first side of the resistive element, and rounding the second side of the resistive element. 
     
     
       19. The method of  claim 11 , further comprising compressing the adhesive in an area adjacent the first side of the resistive element, and compressing the adhesive in an area adjacent the second side of the resistive element.