Wireless antenna array system architecture and methods to achieve 3D beam coverage

Abstract

Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

What is claimed is: 
     
       1. A multilayer package for high frequency communications, comprising:
 multiple layers that include a first, second and third layer, the second layer disposed between the first and third layers; 
 a first plurality of directional antennas disposed on the first layer, the first plurality of directional antennas being broadside antennas; 
 a second plurality of directional antennas disposed on the third layer, the second plurality of directional antennas being dipole antennas; and 
 an integrated circuit coupled to the first and second plurality of directional antennas. 
 
     
     
       2. The multilayer package of  claim 1 , further comprising:
 a first interconnect coupling a first of the broadside antennas to the integrated circuit through the second layer; and 
 a second interconnect coupling a second of the broadside antennas to the integrated circuit through the second layer. 
 
     
     
       3. The multilayer package of  claim 2 , wherein:
 at least one of the first, second or third layer comprises a conductive layer, and 
 a different interconnect couples each conductive layer to the integrated circuit. 
 
     
     
       4. The multilayer package of  claim 2 , wherein:
 the second layer comprises a conductive layer, and 
 a third interconnect couples the conductive layer to the integrated circuit. 
 
     
     
       5. The multilayer package of  claim 4 , further comprising:
 a fourth interconnect and a fifth interconnect, each of the fourth and fifth interconnect coupling a different one of the dipole antennas to the integrated circuit. 
 
     
     
       6. The multilayer package of  claim 5 , wherein:
 the third layer comprises a conductive layer, and 
 a sixth interconnect couples the conductive layer of the third layer to the integrated circuit. 
 
     
     
       7. The multilayer package of  claim 1 , wherein the integrated circuit is disposed on the third layer. 
     
     
       8. The multilayer package of  claim 1 , wherein the integrated circuit is configured to:
 transmit signals to a first antenna of the first plurality of directional antennas through a first interconnect and receive signals from a second antenna of the first plurality of directional antennas through a second interconnect; and 
 transmit signals to a first antenna of the second plurality of directional antennas through a third interconnect and receive signals from a second antenna of the second plurality of directional antennas through a fourth interconnect. 
 
     
     
       9. The multilayer package of  claim 1 , wherein the integrated circuit is configured to modify a radiation pattern of the first and second plurality of directional antennas according to a switched-beam configuration. 
     
     
       10. The multilayer package of  claim 1 , wherein:
 each of the first and second plurality of directional antennas is configured to operate in a 60 GHz band. 
 
     
     
       11. The multilayer package of  claim 1 , wherein the integrated circuit is a complimentary metal-oxide semiconductor (CMOS) radio frequency integrated chip (RFIC). 
     
     
       12. The multilayer package of  claim 1 , wherein:
 each of the first and second plurality of directional antennas is configured to operate in a bandwidth greater than about 20 GHz. 
 
     
     
       13. The multilayer package of  claim 1 , wherein:
 at least some of the first and second plurality of directional antennas do not overlap in a direction perpendicular to a surface of the first and second layer on which the first and second plurality of directional antennas is disposed, respectively. 
 
     
     
       14. A method of operating a multilayer package for high frequency communications, the method comprising:
 transmitting signals from an integrated circuit to a first antenna of a first plurality of directional antennas through a first interconnect, the first plurality of directional antennas disposed on a first layer, the first interconnect coupling the integrated circuit to the first antenna of the first plurality of directional antennas through a second layer; 
 receiving signals at the integrated circuit from a second antenna of the first plurality of directional antennas through a second interconnect, the second interconnect coupling the integrated circuit to the second antenna of the first plurality of directional antennas through the second layer; 
 transmitting signals from the integrated circuit to a first antenna of a second plurality of directional antennas through a third interconnect; the second plurality of directional antennas disposed on a third layer on an opposite side of the second layer than the first layer, the integrated circuit disposed on the third layer; and 
 receiving signals at the integrated circuit from a second antenna of the second plurality of directional antennas through a fourth interconnect. 
 
     
     
       15. The method of  claim 14 , wherein the integrated circuit is coupled to a conductive layer of the second layer via a third interconnect. 
     
     
       16. The method of  claim 14 , wherein the integrated circuit is configured to modify the radiation of the first plurality of antennas in a broadside direction and to modify the radiation of the second plurality of dipole antennas in an end-fire direction. 
     
     
       17. The method of  claim 14 , wherein:
 the first plurality of directional antennas are broadside antennas; and 
 the second plurality of directional antennas are dipole antennas. 
 
     
     
       18. The method of  claim 14 , further comprising:
 configuring each of the first plurality of directional antennas to radiate in a 60 GHz band in a broadside direction, and 
 configuring each of the second plurality of directional antennas to radiate in the 60 GHz band in an end-fire direction. 
 
     
     
       19. The method of  claim 14 , further comprising:
 the integrated circuit modifying a radiation pattern of the first and second plurality of directional antennas according to a switched-beam configuration. 
 
     
     
       20. A multilayer package for high frequency communications, comprising:
 multiple layers that include a first, second and third layer, the second layer disposed between the first and third layers: 
 a first plurality of directional antennas disposed on the first layer; 
 a second plurality of directional antennas disposed on the third layer; and 
 an integrated circuit disposed on the third layer, the integrated circuit coupled to the first and second plurality of directional antennas through different sets of interconnects, the integrated circuit coupled to different antennas of the first plurality of directional antennas through different interconnects of a first set of interconnects and different antennas of the second plurality of directional antennas through different interconnects of a second set of interconnects, a direction of radiation different for the first plurality of directional antennas than for the second plurality of directional antennas. 
 
     
     
       21. The multilayer package of  claim 20 , wherein:
 the first plurality of directional antennas are broadside antennas; and 
 the second plurality of directional antennas are dipole antennas. 
 
     
     
       22. The multilayer package of  claim 20 , wherein:
 at least one of the first, second or third layer comprises a conductive layer, and 
 a different interconnect couples each conductive layer to the integrated circuit. 
 
     
     
       23. The multilayer package of  claim 20 , wherein:
 each of the first plurality of directional antennas is configured to radiate in a 60 GHz band in a broadside direction, and each of the second plurality of directional antennas are configured to radiate in the 60 GHz band in an end-fire direction.