US10744600B2ActiveUtilityA1

Metal plate for laser processing and method for producing stainless steel plate for laser processing

68
Assignee: NIPPON STEEL & SUMITOMO METAL CORPPriority: Mar 1, 2011Filed: Apr 18, 2017Granted: Aug 18, 2020
Est. expiryMar 1, 2031(~4.6 yrs left)· nominal 20-yr term from priority
C21D 1/28B23K 3/0638C22C 38/40C22C 38/58B23K 26/384C21D 8/0247B23K 26/14B23K 2103/26B23K 2101/18C22C 38/38B23K 1/0016C22C 38/18B23K 2103/10C22C 38/002B23K 3/08B21B 2001/386C21D 8/0236B23K 2103/05C21D 2211/001C21D 2211/005C22C 38/48C21D 2261/00B21B 1/26B23K 2101/42C22C 38/00C22C 38/02C22F 1/183B23K 26/40B05C 21/005C21D 8/0226C21D 9/46B23K 2103/14C22C 38/04Y10T428/12C22C 38/001C22C 14/00Y10T428/12361B23K 26/382C21D 8/0273C22F 1/18B21B 1/38C21D 1/30
68
PatentIndex Score
0
Cited by
26
References
1
Claims

Abstract

A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (μm) and a plate thickness t (μm) which satisfy the equation d≤0.0448·t−1.28.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A method of making a metal mask comprising:
 providing a metal plate selected from an austenitic stainless steel plate, a ferritic stainless steel plate, and a titanium plate, the metal plate having a centerline surface roughness of at most 0.16 μm, a plate thickness t of at most 400 μm, and an average grain diameter d, wherein the plate thickness t and average grain diameter d satisfy the following Equation (1):
     d≤ 0.0448· t− 1.28  (1);
 
 
 
       where a unit of d and t is μm;
 cutting the metal plate into a metal mask using a laser beam so that a pattern of holes or slits is formed in the metal mask; 
 the metal plate having a spreading value of at most 10% of the plate thickness wherein the spreading value is determined by subtracting a cut width of the hole or slit in a surface of the metal plate on an exit side of the laser beam from a cut width of the hole or slit in a surface of the metal plate on an incident side of the laser beam.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.