Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips

Abstract

By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

We claim: 
     
       1. A method, comprising:
 determining an alignment point for a photonic element in a substrate of a given material; 
 applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and 
 removing the patterned region from the photonic element via the etchant. 
 
     
     
       2. The method of  claim 1 , further comprising:
 connecting the engagement feature to the mating feature of the PIC; and 
 affixing the photonic element to the PIC, wherein affixing consists of one of:
 epoxy bonding; 
 thermocompression bonding; and 
 wafer bonding. 
 
 
     
     
       3. The method of  claim 1 , further comprising:
 wherein the patterned region further defines a cable connector in the un-patterned region; 
 wherein a first end of a waveguide defined in the substrate is aligned according to the alignment point relative to the engagement feature; and 
 wherein a second end of the waveguide is aligned according to the alignment point relative to the cable connector. 
 
     
     
       4. The method of  claim 1 , wherein the engagement feature is defined at a first predefined position relative to a waveguide defined in the substrate and the mating feature is defined at a second predefined position relative to an integrated waveguide included in the PIC. 
     
     
       5. The method of  claim 1 , further comprising detailing the photonic element, wherein detailing the photonic element includes at least one of:
 dicing the photonic element from the substrate; 
 polishing at least one surface of the photonic element; and 
 affixing the photonic element to a second photonic element to form a multi-piece optical adapter. 
 
     
     
       6. The method of  claim 1 , further comprising:
 prior to applying the etchant, physically etching a second portion of the photonic element to affect flow of the etchant during application. 
 
     
     
       7. A method, comprising:
 imparting a first pattern on a light-transmissive material by a laser, wherein the first pattern extends into the light-transmissive material from a first side to a second side that is opposite to the first side, wherein the first pattern defines an un-patterned region of the light-transmissive material and a patterned region of the light-transmissive material that has an increased reactivity to an etchant relative to the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); 
 imparting a second pattern on the light-transmissive material by the laser, wherein the second pattern extends to neither the first side nor the second side, the second pattern defining a waveguide within the light-transmissive material aligned relative to the engagement feature to optically couple with an integrated waveguide of the PIC; and 
 removing the patterned region of the first pattern via the etchant. 
 
     
     
       8. The method of  claim 7 , wherein the first pattern and the second pattern are applied in a predefined order of one of:
 the first pattern before the second pattern; 
 the second pattern before the first pattern; and 
 the first pattern simultaneously with the second pattern. 
 
     
     
       9. The method of  claim 7 , wherein the waveguide runs from the second side to a third side orthogonal to the second side to enable evanescent coupling with the integrated waveguide of the PIC. 
     
     
       10. The method of  claim 7 , wherein the patterned region defines a mating interface in a plane parallel to the second side and the waveguide runs from the second side to the mating interface. 
     
     
       11. The method of  claim 7 , further comprising:
 imparting a third pattern on the light-transmissive material by the laser, wherein the third pattern extends into the light-transmissive material from the first side, the third pattern defining a second patterned region of the light-transmissive material and a second un-patterned region of the light-transmissive material, wherein a chemical structure of the second patterned region has an increased reactivity to the etchant relative to the second un-patterned region, and wherein the second patterned region defines a cable connector with the patterned region. 
 
     
     
       12. The method of  claim 11 , wherein the third pattern extends from the first side to the second side, the third pattern defining an open channel orthogonally to the second side. 
     
     
       13. The method of  claim 7 , further comprising:
 wherein the first pattern further defines a first photonic element and a second photonic element; 
 applying the etchant to the first side; and 
 affixing the first photonic element to the second photonic element to form a multi-piece optical adapter. 
 
     
     
       14. A method, comprising:
 imparting a first pattern on a light-transmissive material by a laser, wherein the first pattern extends into the light-transmissive material from a first side to a second side that is opposite to the first side, wherein the first pattern defines an un-patterned region of the light-transmissive material and a patterned region of the light-transmissive material that has an increased reactivity to an etchant relative to the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); 
 imparting a second pattern on the light-transmissive material by the laser, wherein the second pattern extends to neither the first side nor the second side, the second pattern defining a waveguide within the light-transmissive material aligned relative to the engagement feature to optically couple with an integrated waveguide of the PIC; and 
 imparting a third pattern on the light-transmissive material by the laser, wherein the third pattern extends into the light-transmissive material from the first side, the third pattern defining a second patterned region of the light-transmissive material and a second un-patterned region of the light-transmissive material, wherein a chemical structure of the second patterned region has an increased reactivity to the etchant relative to the second un-patterned region, and wherein the second patterned region defines a cable connector with the patterned region. 
 
     
     
       15. The method of  claim 14 , wherein the first pattern and the second pattern are applied in a predefined order of one of:
 the first pattern before the second pattern; 
 the second pattern before the first pattern; and 
 the first pattern simultaneously with the second pattern. 
 
     
     
       16. The method of  claim 14 , wherein the waveguide runs from the second side to a third side orthogonal to the second side to enable evanescent coupling with the integrated waveguide of the PIC. 
     
     
       17. The method of  claim 14 , wherein the patterned region defines a mating interface in a plane parallel to the second side and the waveguide runs from the second side to the mating interface. 
     
     
       18. The method of  claim 14 , wherein the third pattern extends from the first side to the second side, the third pattern defining an open channel orthogonally to the second side. 
     
     
       19. The method of  claim 14 , further comprising:
 wherein the first pattern further defines a first photonic element and a second photonic element; 
 applying the etchant to the first side; and 
 affixing the first photonic element to the second photonic element to form a multi-piece optical adapter.