Conductive polymers within drilled holes of printed circuit boards

Abstract

A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

What is claimed is: 
     
       1. A method comprising applying a triggering condition to a conductive polymer, positioned in a drilled hole in a printed circuit board, that is an electrically conductive path between contact pads located in different layers of the printed circuit board, whereby the polymer vertically contracts within the drilled hole such that the electrically conductive path between the contact pads is broken. 
     
     
       2. The method of  claim 1 , wherein the applying the triggering condition is responsive to a command from a processor to sever an electrical connection between the contact pads. 
     
     
       3. The method of  claim 1 , wherein electronic components communicate across the electrically conductive path. 
     
     
       4. The method of  claim 1 , wherein the polymer comprises an electroactive polymer, and the triggering condition is voltage applied to the polymer. 
     
     
       5. The method of  claim 4 , wherein the voltage is applied via additional contact pads arranged vertically outside of the contacts pads within the drilled hole. 
     
     
       6. The method of  claim 1 , wherein the polymer comprises gas-filled microspheres, and the triggering condition is a pressure increase applied to the polymer such that the microspheres contract.