Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer composite

Abstract

A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

What is claimed is: 
     
       1. A multilayer film structure comprising:
 a top encapsulation Layer A; 
 a bottom Layer C comprising a propylene-based polymer having at least one melting point greater than 125° C.; 
 a tie Layer B between Layer A and Layer C; 
 the multilayer film structure characterized in that Layer B consists of (1) a block composite resin (BC), (2) an optional polyolefin consisting of ethylene and α-olefin, (3) an optional colorant, (4) an optional stabilizer, and (5) an optional antioxidant, the BC made from monomers consisting of propylene and ethylene and the BC has
 i) an ethylene-propylene copolymer (EP) comprising at least 40 mol % polymerized ethylene; 
 ii) a crystalline propylene-based polymer (CPP); and 
 iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 40 mol % polymerized ethylene and (b) a crystalline propylene block. 
 
 
     
     
       2. The multilayer film structure of  claim 1  wherein the CPP comprises greater than 90 mol % polymerized propylene. 
     
     
       3. The multilayer film structure of  claim 2  wherein the block composite resin in Layer B has two peak melting temperatures. 
     
     
       4. The multilayer film structure of  claim 3  wherein the block composite resin in layer B has a first peak melting temperature greater than 120° C. 
     
     
       5. The multilayer film structure of  claim 4  wherein the block composite resin in layer B has a first peak melting temperature greater than 125° C. 
     
     
       6. The multilayer film structure of  claim 1  wherein the crystalline propylene block (iii)(b) of the diblock copolymer is the same composition as the crystalline propylene-based polymer (CPP) of the block composite resin. 
     
     
       7. The multilayer film structure of  claim 6  wherein the ethylene-propylene block (iii)(a) of the diblock copolymer is the same composition as the EP copolymer of the block composite resin. 
     
     
       8. The multilayer film structure of  claim 1  wherein the Layer B block composite resin has an ethylene-propylene block amount in the range of from 30 to 70 weight % based on total weight of the diblock copolymer (iii). 
     
     
       9. The multilayer film structure of  claim 1  wherein the block composite resin has a CBCI from 0.3 to 0.8. 
     
     
       10. The multilayer film structure of  claim 1  wherein the tie Layer B is a blend with greater than 40 weight percent of the block composite resin. 
     
     
       11. The multilayer film structure of  claim 1  wherein the top encapsulation Layer A comprises an ethylene/octene copolymer elastomer or plastomer. 
     
     
       12. The multilayer film structure of  claim 11  wherein the top encapsulation Layer A comprises a silane-graft containing ethylene/octene copolymer. 
     
     
       13. The multilayer film structure of  claim 1  comprising
 the top seal Layer A comprising a silane-graft containing ethylene/alpha-olefin copolymer; 
 the bottom Layer C comprising the propylene-based polymer; and 
 the tie Layer B between Layer A and Layer C, the block composite resin with
 i) an ethylene-propylene polymer (EP) comprising at least 93 mol % polymerized ethylene; 
 ii) the crystalline propylene-based polymer; and 
 iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 93 mol % polymerized ethylene and (b) a crystalline propylene block. 
 
 
     
     
       14. The multilayer film structure of  claim 1  having a thickness from 0.2 mm to 1.5 mm wherein
 the top encapsulation Layer A is from 0.15 mm to 1.25 mm in thickness; 
 the tie Layer B is from 10 to 150 μm in thickness; and 
 Layer C is from 150 to 375 μm in thickness. 
 
     
     
       15. An electronic device (ED) module comprising an electronic device and a multilayer film structure of  claim 1 . 
     
     
       16. The multilayer film structure of  claim 1  wherein the Layer (B) consists of (1) the BC, (2) the colorant, (3) the stabilizer that is a UV stabilizer, and (4) the antioxidant. 
     
     
       17. The multilayer film structure of  claim 1  wherein the Layer (B) consists of (1) the BC, (2) the colorant, and (3) the stabilizer that is a UV stabilizer. 
     
     
       18. The multilayer film structure of  claim 1  wherein the Layer (B) consists of (1) the BC, and (2) the colorant.