US10779450B2ActiveUtilityA1

Thermally conductive composition

51
Assignee: KITAGAWA IND CO LTDPriority: Jul 11, 2018Filed: Jul 11, 2019Granted: Sep 15, 2020
Est. expiryJul 11, 2038(~12 yrs left)· nominal 20-yr term from priority
Inventors:Toru MatsuzakiYasuhiro KawaguchiMasahiro SaitoKensuke MitsuyaMasaaki ItoToshiyuki Omori
H10W 42/287H10W 42/284H10W 42/20H10W 40/70H10W 40/257H10W 40/251C08L 33/10C08K 2003/385C08K 2201/001H05K 9/0088H05K 9/0083C09K 5/14C08K 3/36C08K 3/013H01F 1/37
51
PatentIndex Score
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Cited by
6
References
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Claims

Abstract

A thermally conductive composition is provided, which has a base material; and at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material. The entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A thermally conductive composition comprising:
 a base material; and 
 at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material, 
 wherein the entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower. 
 
     
     
       2. The thermally conductive composition according to  claim 1 , wherein a thermal conductivity of entirety of the thermally conductive composition is higher than a thermal conductivity of the base material. 
     
     
       3. The thermally conductive composition according to  claim 1 , wherein at least one of the permittivity adjusting filler and the high permeability filler has an air region inside. 
     
     
       4. The thermally conductive composition according to  claim 1 , wherein the relative permeability has an imaginary part. 
     
     
       5. A thermally conductive composition comprising:
 a base material; 
 a permittivity adjusting filler having a lower permittivity than the base material; and 
 a high permeability filler having a higher permeability than the base material, 
 wherein the entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower. 
 
     
     
       6. The thermally conductive composition according to  claim 5 , wherein the permittivity adjusting filler is a material selected from the group consisting of boron nitride and silica. 
     
     
       7. The thermally conductive composition according to  claim 5 , wherein a thermal conductivity of entirety of the thermally conductive composition is higher than a thermal conductivity of the base material. 
     
     
       8. The thermally conductive composition according to  claim 5 , wherein at least one of the permittivity adjusting filler and the high permeability filler has an air region inside. 
     
     
       9. The thermally conductive composition according to  claim 5 , wherein the relative permeability has an imaginary part.

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