Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same

Abstract

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

The invention claimed is: 
     
       1. A negative-type photosensitive resin composition, comprising:
 an (A1) first resin, an (A2) second resin, a (B) radical polymerizable compound, a (C) photopolymerization initiator, and a (D1) pigment as a (D) coloring agent, wherein 
 the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, 
 the (A2) second resin is one or more species selected from an (A2-1) polyimide precursor, an (A2-2) polybenzo-oxazole precursor, an (A2-3) polysiloxane, an (A2-4) cardo based resin, and an (A2-5) acrylic resin, 
 the (A2-1) polyimide precursor contains a structural unit represented by the following general formula (3), 
 the (A1) first resin content ratio in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within a range of 25 to 90 mass %, and 
 the (D1) pigment content ratio in the entire solid content of the negative photosensitive resin composition is within a range of 5 to 70 mass %, 
 wherein general formula (3) follows, 
 
       
         
           
           
               
               
           
         
       
       wherein
 R 9  represents an organic group which may include a halogen and/or alkoxy substituent having a valence of 4 to 10, 
 R 10  represents an organic group which may include a halogen and/or alkoxy substituent having a valence of 2 to 10, 
 R 11  represents a substituent represented by general formula (5) or general formula (6) below, 
 R 12  represents a phenolic hydroxyl group, a sulfonic group, or a mercapto group, 
 R 13  represents a phenolic hydroxyl group, a sulfonic group, a mercapto group, or a substituent represented by general formula (5) or general formula (6) below, 
 t represents an integer of 2 to 8, u represents an integer of 0 to 6, and v represents an integer of 0 to 8, and 2≤t+u≤8, 
 wherein general formulas (5) and (6) follow, 
 
       
         
           
           
               
               
           
         
       
       in general formula (5),
 R 19  represents an alkyl group having a carbon number of 1 to 10, an acyl group having a carbon number of 2 to 6, or an aryl group having a carbon number of 6 to 15, and in general formula (6), 
 R 20  and R 21  each independently represents hydrogen, an alkyl group having a carbon number of 1 to 10, an acyl group having a carbon number of 2 to 6, or an aryl group having a carbon number of 6 to 15, 
 wherein the one or more species selected from the (A1-1) polyimide, the (A1-2) polybenzo-oxazole, the (A2-1) polyimide precursor, and the (A2-2) polybenzo-oxazole precursor contain a structural unit originating from an amine having an oxyalkylene structure and/or a structural unit originating from an amine derivative having an oxyalkylene structure. 
 
     
     
       2. A negative-type photosensitive resin composition, comprising:
 an (A1) first resin, an (A2) second resin, a (B) radical polymerizable compound, a (C) photopolymerization initiator, and a (D1) pigment as a (D) coloring agent, wherein 
 the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, 
 the (A2) second resin is one or more species selected from an (A2-2) polybenzo-oxazole precursor, an (A2-3) polysiloxane, an (A2-4) cardo based resin, and an (A2-5) acrylic resin, 
 the (A1) first resin content ratio in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within a range of 25 to 90 mass %, and 
 the (D1) pigment content ratio in the entire solid content of the negative photosensitive resin composition is within a range of 5 to 70 mass %. 
 
     
     
       3. The negative-type photosensitive resin composition according to  claim 2 , wherein the negative-type photosensitive resin composition further contains a (E) dispersing agent. 
     
     
       4. The negative-type photosensitive resin composition according to  claim 3 , wherein the negative-type photosensitive resin composition further contains a solvent having a carbonyl group or an ester bond,
 a content ratio of the solvent having a carbonyl group or an ester bond in a total of all solvents is within the range of 50 to 100 mass %, and 
 the solvent having a carbonyl group or an ester bond is a solvent that has an acetate bond. 
 
     
     
       5. The negative-type photosensitive resin composition according to  claim 2 , wherein the (D1) pigment contains a (D1a-1a) benzofuranone based black pigment.