Power module and semiconductor apparatus

Abstract

Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.

The invention claimed is: 
     
       1. A power module comprising:
 a resin housing including a main body and at least one projection protruding from the main body; and 
 a lead terminal extending outwardly from the main body, wherein 
 a through-hole is provided so as to penetrate the main body and the projection. 
 
     
     
       2. The power module according to  claim 1 , wherein
 a bottom surface of the projection is a flat surface. 
 
     
     
       3. The power module according to  claim 2 , wherein
 a side surface and the flat surface of the projection are connected by a curved surface. 
 
     
     
       4. The power module according to  claim 1 , wherein
 the projection protrudes 1.5 to 2 mm or more relative to the main body. 
 
     
     
       5. The power module according to  claim 1 , wherein
 the at least one projection comprises two projections, and 
 the resin housing includes a connecting member protruding from the main body and connecting the two projections. 
 
     
     
       6. The power module according to  claim 5 , wherein
 a width of the connecting member decreases as a distance from the projections increases in planar view. 
 
     
     
       7. The power module according to  claim 6 , wherein
 a side surface of the connecting member is a curved surface. 
 
     
     
       8. The power module according to  claim 5 , wherein
 the side surface and the bottom surface of the connecting member are connected by a curved surface. 
 
     
     
       9. The power module according to  claim 5 , wherein
 an amount of protrusion of each of the projections relative to the main body is greater than an amount of protrusion of the connecting member relative to the main body. 
 
     
     
       10. The power module according to  claim 9 , further comprising grease applied on the bottom surface of the connecting member. 
     
     
       11. The power module according to  claim 1 , wherein
 the resin housing includes a fin protruding from the main body in same direction as the projection. 
 
     
     
       12. The power module according to  claim 11 , wherein
 a bottom surface of the fin is a curved surface. 
 
     
     
       13. The power module according to  claim 12 , wherein
 the at least one projection comprises two projections, 
 the fin is provided between the two projections, and 
 an amount of protrusion of the fin from the main body is maximum on a line connecting the two projections. 
 
     
     
       14. The power module according to  claim 1 , wherein
 the resin housing includes a plurality of blocks protruding from the main body in same direction as the projection. 
 
     
     
       15. The power module according to  claim 14 , wherein a bottom surface of each of the blocks is a curved surface. 
     
     
       16. The power module according to  claim 14 , wherein
 the at least one projection comprises two projections, and 
 amounts of protrusion of the blocks from the main body are maximum on a line connecting the two projections. 
 
     
     
       17. A semiconductor apparatus comprising:
 a power module including
 a resin housing having a main body and a projection protruding from the main body, and 
 a lead terminal extending outwardly from the main body, a through-hole being provided so as to penetrate the main body and the projection; and 
 
 a printed circuit board including a substrate through-hole, the lead terminal passing through the substrate through-hole, wherein 
 the projection is in contact with the printed circuit board. 
 
     
     
       18. The semiconductor apparatus according to  claim 17 , further comprising a screw passing through the through-hole and bringing the projection into close contact with the printed circuit board. 
     
     
       19. The semiconductor apparatus according to  claim 17 , wherein
 a bottom surface of the projection is in contact with the printed circuit board, and 
 a side surface and the bottom surface of the projection are connected by a curved surface. 
 
     
     
       20. The semiconductor apparatus according to  claim 18 , further comprising a heat sink on an upper surface of the resin housing, the upper surface being opposite to a surface provided with the projection, wherein
 the screw is screwed into the heat sink, thereby bringing the upper surface into close contact with the heat sink and bringing the projection into close contact with the printed circuit board. 
 
     
     
       21. The semiconductor apparatus according to  claim 17 , wherein
 a surface mount component is fixed to the printed circuit board right under the power module. 
 
     
     
       22. The semiconductor apparatus according to  claim 17 , further comprising grease between the main body and the printed circuit board.