Method for manufacturing implantable device header with embedded sensor and antenna

Abstract

A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions. The method further directs the proximal ends of the conductors through the passage to align with the interconnect regions and secures the proximal ends and the interconnect regions to one another through the window.

What is claimed is: 
     
       1. A method for manufacturing an implantable cardiac device, comprising:
 assembling a device housing having electronic components therein; 
 joining a feed-through assembly to the device housing, the feed-through assembly including conductors having distal ends connected to the electronic components and having proximal ends projecting from the feed-through assembly; 
 encapsulating a sensing electrode and an antenna within a non conductive header body formed from a biocompatible material, the electrode and antenna including corresponding interconnection plates, the header body including a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates, the header body further including an window, opening laterally onto a side of the header body, the window exposing the interconnect cavity and interconnect regions; 
 directing the proximal ends of the conductors through the passage to align with the interconnect regions; and 
 securing the proximal ends and the interconnect regions to one another through the window. 
 
     
     
       2. The method of  claim 1 , wherein the assembling operation comprises injection molding a flowable material about the electrode and antenna. 
     
     
       3. The method of  claim 1 , wherein the assembling operation comprises casting a flowable material about the electrode and antenna. 
     
     
       4. The method of  claim 1 , further comprising configuring the electronic components to record cardiac signals sensed by the sensing electrode. 
     
     
       5. The method of  claim 1 , wherein the header is molded or cast to embed the electrode and antenna in the header body before securing the header to the device housing. 
     
     
       6. The method of  claim 1 , wherein the header includes opposite sides that are elongated to extend along a longitudinal axis and the electrode includes a body portion, the assembling operation comprising positioning the body portion to face laterally proximate to a side of the header and to orient the body portion along a plane that extends at a select angle to the longitudinal axis. 
     
     
       7. The method of  claim 1 , wherein the passage extends in a first direction from the mounting surface through the header and the window opens laterally onto a side of the header. 
     
     
       8. The method of  claim 1 , wherein the header body includes an interconnect cavity having at least one passage extending thereto from a mounting surface, the mounting surface configured to adjoin the device housing, the header body including a window provided in a side of the header body, the window affording access to the interconnect cavity. 
     
     
       9. The method of  claim 1 , wherein the securing operation includes welding the proximal ends of the conductors to the corresponding interconnect regions of the sensor and antenna. 
     
     
       10. The method of  claim 1 , further comprising injecting an adhesive or epoxy through the window such that the adhesive or epoxy flows through the window and into the interconnect cavity and the passages. 
     
     
       11. The method of  claim 1 , wherein the header body includes a mounting surface having a recessed chamber therein, the recessed chamber configured to receive a feedthrough assembly on the device housing. 
     
     
       12. The method of  claim 1  wherein the header body includes a mounting surface having a recessed chamber therein, the recessed chamber configured to receive a band provided about a perimeter of the recessed chamber. 
     
     
       13. The method of  claim 12 , wherein the band includes one or more tabs that are bent to extend inward above the recessed chamber to provide mechanical anchoring points between the header and the device housing.