Display device

Abstract

According to one embodiment, a display device comprises a flexible substrate, a first insulating film disposed on the flexible substrate, a switching element disposed on the first insulating film, a signal wiring electrically connected with the switching element, a first organic film disposed on the signal wiring, a connection wiring disposed on the first organic film, a second organic film disposed on the connection wiring and a pad electrode disposed on the second organic film. The connection wiring is located between the first organic film and the second organic film and is in contact with the first organic film and the second organic film.

What is claimed is: 
     
       1. An electronic device comprising:
 a flexible substrate; 
 a first insulating film provided on the flexible substrate; 
 a switching element provided on the first insulating film; 
 a second insulating film provided on a semiconductor layer of the switching element; 
 a third insulating film provided on a gate electrode of the switching element; 
 a first organic film provided on the third insulating film; 
 a wiring electrically connected with the switching element; and 
 a pad electrode electrically connected with the wiring, 
 wherein 
 the wiring is in a first portion, a second portion, and a third portion, 
 the second portion is between the first portion and the third portion, 
 the pad electrode is in the third portion, 
 in the first portion and the third portion, the first insulating film, the second insulating film, and the first organic film are between the flexible substrate and the wiring, 
 in the second portion, the first organic film is between the flexible substrate and the wiring and in contact with a surface of the flexible substrate, and 
 a thickness of the first organic film located in the second portion is larger than a thickness of the first organic film located in the first portion and the third portion. 
 
     
     
       2. The electronic device of  claim 1 , further comprising a second organic film covering the wiring,
 wherein the wiring is between the first organic film and the second organic film. 
 
     
     
       3. The electronic device of  claim 1 , wherein
 the flexible substrate is formed of polyimide. 
 
     
     
       4. The electronic device of  claim 1 , wherein
 the wiring includes a signal wiring and a connection wiring, 
 the signal wiring is provided on the third insulating film, and 
 the connection wiring is provided on the first organic film. 
 
     
     
       5. The electronic device of  claim 4 , wherein
 the signal wiring and the connection wiring are connected to each other through a first contact portion in the first organic film. 
 
     
     
       6. The electronic device of  claim 5 , wherein
 the first contact portion is in the first portion. 
 
     
     
       7. The electronic device of  claim 2 , wherein
 the wiring includes a signal wiring and a connection wiring, 
 the signal wiring is provided on the third insulating film, 
 the connection wiring is provided on the first organic film, and 
 the pad electrode is provided on the second organic film. 
 
     
     
       8. The electronic device of  claim 7 , wherein
 the signal wiring and the connection wiring are connected to each other through a first contact portion in the first organic film, and 
 the connection wiring and the pad electrode are connected to each other through a second contact portion in the second organic film. 
 
     
     
       9. The electronic device of  claim 8 , vherein
 the first contact portion is in the first portion, and 
 the second contact portion is in the third portion. 
 
     
     
       10. The electronic device of  claim 8 , vherein
 the second portion is between the first contact portion and the second contact portion. 
 
     
     
       11. The electronic device of  claim 1 , wherein
 the flexible substrate is bent in the second portion.