Method of manufacturing a semiconductor package

Abstract

In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.

What is claimed is: 
     
       1. A method of manufacturing a semiconductor package, the method comprising:
 arranging a first semiconductor device on a package substrate; 
 forming an electrostatic discharge structure above an upper surface of the package substrate and on a ground substrate pad exposed from the upper surface of the package substrate; 
 stacking a plurality of second semiconductor devices on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices; and 
 forming a molding member on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices. 
 
     
     
       2. The method of  claim 1 , wherein the forming the electrostatic discharge structure is performed during a wiring bonding process for electrically connecting the first semiconductor device and the package substrate. 
     
     
       3. The method of  claim 1 , wherein the forming the electrostatic discharge structure comprises forming, on the ground substrate pad, a wire loop having an arch shape. 
     
     
       4. The method of  claim 1 , wherein the forming the electrostatic discharge structure is performed after at least one second semiconductor device of the plurality of second semiconductor devices is adhered to the package substrate. 
     
     
       5. The method of  claim 1 , wherein the ground substrate pad is grounded through a ground plate in the package substrate. 
     
     
       6. The method of  claim 1 , further comprising forming a second electrostatic discharge structure on at least one ground chip pad exposed from an upper surface of the first semiconductor device. 
     
     
       7. The method of  claim 1 , wherein the forming the electrostatic discharge structure comprises forming, on the ground substrate pad, a wire bump having a tip portion on an upper portion thereof. 
     
     
       8. The method of  claim 7 , wherein the forming the electrostatic discharge structure comprises:
 bonding a wire to the ground substrate pad by a wire bonding apparatus; and 
 cutting the wire to have a predetermined height. 
 
     
     
       9. The method of  claim 1 , wherein the stacking the plurality of second semiconductor devices on the package substrate comprises adhering the plurality of second semiconductor devices using adhesive films. 
     
     
       10. The method of  claim 9 , further comprising performing a wire bonding process to electrically connect the plurality of second semiconductor devices to the package substrate. 
     
     
       11. A method of manufacturing a semiconductor package, the method comprising:
 providing a package substrate having a ground substrate pad on an upper surface thereof; 
 arranging a first semiconductor device on the package substrate; 
 performing a wire bonding process to electrically connect the first semiconductor device to the package substrate; 
 forming an electrostatic discharge structure above the upper surface of the package substrate and on the ground substrate pad during the wire bonding process; 
 stacking a plurality of second semiconductor devices on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices; and 
 forming a molding member on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices. 
 
     
     
       12. The method of  claim 11 , wherein the forming the electrostatic discharge structure comprises forming, on the ground substrate pad, a wire loop having an arch shape. 
     
     
       13. The method of  claim 11 , wherein the forming the electrostatic discharge structure is performed after at least one second semiconductor device of the plurality of second semiconductor devices is adhered to the package substrate. 
     
     
       14. The method of  claim 11 , wherein the ground substrate pad is grounded through a ground plate in the package substrate. 
     
     
       15. The method of  claim 11 , further comprising forming a second electrostatic discharge structure on a ground chip pad of the first semiconductor device during the wire bonding process. 
     
     
       16. The method of  claim 11 , wherein the first semiconductor device comprises a logic chip, and the plurality of second semiconductor devices comprises a memory chip. 
     
     
       17. The method of  claim 11 , wherein the forming the electrostatic discharge structure comprises forming, on the ground substrate pad, a wire bump having a tip portion on an upper portion thereof. 
     
     
       18. The method of  claim 17 , wherein the forming the electrostatic discharge structure comprises:
 bonding a wire to the ground substrate pad by a wire bonding apparatus; and 
 cutting the wire to have a predetermined height. 
 
     
     
       19. The method of  claim 11 , wherein the stacking the plurality of second semiconductor devices on the package substrate comprises adhering the plurality of second semiconductor devices using adhesive films. 
     
     
       20. The method of  claim 19 , further comprising performing a wire bonding process to electrically connect the plurality of second semiconductor devices to the package substrate.