Structure and testing device for measuring the bonding strength of the light-emitting panel

Abstract

The structure and the testing device used for measuring the bonding strength of the light-emitting panel, including: a substrate, a flip chip film is disposed on the substrate, and a bonding portion of the flip chip film is bonded to the substrate. Wherein an orthographic projection of a non-bonding portion of the flip chip film on the substrate covers an orthographic projection of the bonding portion on the substrate, and the non-bonding portion is stretched to measure a bonding strength between the flip chip film and the substrate, thereby reducing the risk of breakage between the layers inside the substrate, thereby the bonding strength between the flip chip film and the substrate can be measured more accurately.

What is claimed is: 
     
       1. A structure for measuring a bonding strength of a light-emitting panel, comprising:
 a substrate on which a flip chip film is disposed, and a bonding portion of the flip chip film is bonded on the substrate; and 
 an orthographic projection of a non-bonding portion of the flip chip film on the substrate covers an orthographic projection of the bonding portion on the substrate, and the non-bonding portion is stretched to measure a bonding strength of the flip chip film and the substrate. 
 
     
     
       2. The structure for measuring the bonding strength of a light-emitting panel according to  claim 1 , wherein a stretching direction of the non-bonding portion is an inclined direction of the non-bonding portion. 
     
     
       3. The structure for measuring the bonding strength of a light-emitting panel according to  claim 1 , wherein a bent portion is formed between the bonding portion and the non-bonding portion, and the flip chip film is bent by the bent portion. 
     
     
       4. The structure for measuring the bonding strength of a light-emitting panel according to  claim 3 , wherein the bent portion is aligned with an end of the substrate. 
     
     
       5. The structure for measuring the bonding strength of a light-emitting panel according to  claim 3 , wherein a horizontal length of the bonding portion is smaller than a horizontal length of the non-bonding portion to cause a mechanical arm to stretch the non-bonding portion. 
     
     
       6. The structure for measuring the bonding strength of a light-emitting panel according to  claim 1 , wherein the substrate comprises a bottom plate and a flexible layer, the flexible layer covering the substrate by stretching the non-bonding portion to prevent the flexible layer from separating from the bottom plate. 
     
     
       7. The structure for measuring the bonding strength of a light-emitting panel according to  claim 1 , wherein a first surface of the flip chip film is a smooth surface to reduce a friction between the non-bonding portion and the bonding portion when the non-bonding portion is stretched. 
     
     
       8. The structure for measuring the bonding strength of a light-emitting panel according to  claim 1 , wherein the substrate comprises: a bottom plate and a flexible layer, the flexible layer covering the bottom plate. 
     
     
       9. The structure for measuring the bonding strength of a light-emitting panel according to  claim 8 , wherein the flexible layer comprises polyimide. 
     
     
       10. A testing device for measuring a bonding strength of a light-emitting panel, comprising:
 a mechanical arm and a slide rail, the mechanical arm being connected to the slide rail by a pulley at the end; and 
 the mechanical arm is configured to fit a non-bonding portion of a flip chip film so that the non-bonding portion covers a bonding portion of the flip chip film, and the non-bonding portion is stretched to measure a bonding strength between the flip chip film and a substrate. 
 
     
     
       11. The testing device for measuring the bonding strength of a light-emitting panel according to  claim 10 , wherein two sides of the pulleys are oppositely disposed with convex portions so that the pulleys abut against the sliding rails. 
     
     
       12. The testing device for measuring the bonding strength of a light emitting panel according to  claim 10 , wherein the sliding rail is semicircular, so that the non-bonding portion is covered on the bonding portion by being rotated 180°. 
     
     
       13. A structure for measuring the bonding strength of a light-emitting panel, comprising:
 a substrate on which a flip chip film is disposed, and a bonding portion of the flip chip film is bonded to the substrate; and 
 an orthographic projection of a non-bonding portion of the flip chip film on the substrate covers an orthographic projection of the bonding portion on the substrate, and the non-bonding portion is stretched to measure a bonding strength of the flip chip film and the substrate, wherein a bent portion is formed between the bonding portion and the non-bonding portion, and the flip chip film is bent by the bent portion, and a first surface of the flip chip film is a smooth surface to reduce a friction between the non-bonding portion and the bonding portion when the non-bonding portion is stretched.