PCB integrated waveguide terminations and load

Abstract

The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy.

What is claimed is: 
     
       1. A radar system comprising:
 at least one attenuation component disposed on a circuit board, wherein the at least one attenuation component is configured to dissipate electromagnetic energy; 
 a beamforming network comprising:
 a beamforming network input, and 
 at least one beamforming network output coupled to a radiating waveguide input; and 
 
 at least one attenuation port configured to couple the beamforming network to the at least one attenuation component. 
 
     
     
       2. The radar system according to  claim 1 , wherein the at least one attenuation port comprises a plurality of attenuation ports,
 wherein the at least one attenuation component comprises a plurality of attenuation components, and 
 wherein each attenuation port is coupled to a respective attenuation component. 
 
     
     
       3. The radar system according to  claim 1 , wherein the at least one attenuation component comprises a patch on the circuit board. 
     
     
       4. The radar system according to  claim 3 , wherein the patch comprises a surface configured to absorb electromagnetic energy. 
     
     
       5. The radar system according to  claim 1 , wherein the at least one attenuation port is perpendicular to a plane of the waveguides. 
     
     
       6. The radar system according to  claim 1 , wherein the at least one attenuation component comprises at least one microstrip line on the circuit board. 
     
     
       7. The radar system according to  claim 1 , wherein the at least one attenuation component comprises conductive ink printed on the circuit board. 
     
     
       8. A method comprising:
 receiving electromagnetic energy by a waveguide; 
 coupling at least a first portion of the electromagnetic energy to radiating components of the waveguide, wherein a second portion of the electromagnetic energy is reflected as reflected electromagnetic energy; 
 coupling at least a portion of the reflected electromagnetic energy to an attenuation port such that the attenuation port couples the portion of the reflected electromagnetic energy to an attenuation component disposed on a circuit board; and 
 dissipating the portion of the reflected electromagnetic energy coupled to the attenuation component by the attenuation component. 
 
     
     
       9. The method according to  claim 8 , wherein the waveguide comprises a plurality of attenuation ports, and
 wherein each attenuation port is coupled to a respective attenuation component in a plurality of attenuation components. 
 
     
     
       10. The method according to  claim 8 , wherein the attenuation component comprises a patch on the circuit, and
 wherein the method further comprises: 
 coupling the portion of the reflected electromagnetic energy by the patch. 
 
     
     
       11. The method according to  claim 8 , further comprising absorbing the portion of the reflected electromagnetic energy by a surface of the patch. 
     
     
       12. The method according to  claim 8 , wherein the attenuation component comprises at least one microstrip line on the circuit board. 
     
     
       13. The method according to  claim 8 , wherein the attenuation component comprises conductive ink printed on the circuit board. 
     
     
       14. A waveguide system comprising:
 a waveguide feed configured to receive electromagnetic energy; 
 a beamforming network comprising at least one waveguide coupled to the waveguide feed; 
 at least one radiating waveguide that
 comprises at least one radiating element, and 
 receives at least a portion of the of electromagnetic energy and wherein the radiating element is configured to: 
 radiate at least a first portion of the received portion of electromagnetic energy, and 
 reflect a second portion of the received portion of electromagnetic energy; 
 
 at least one attenuation port coupled to the at least one radiating waveguide and configured to couple the second portion of the received portion of electromagnetic energy; and 
 at least one attenuation component coupled to the at least one attenuation port and configured to attenuate the second portion of the received portion of electromagnetic energy, wherein the at least one attenuation component is disposed on a circuit board. 
 
     
     
       15. The waveguide system according to  claim 14 , wherein the beamforming network comprises a plurality of beamforming waveguides and is configured to divide the electromagnetic energy based on a taper profile. 
     
     
       16. The waveguide system according to  claim 14 , wherein the at least one attenuation component comprises a patch on the circuit board. 
     
     
       17. The waveguide system according to  claim 16 , wherein the patch comprises a surface configured to absorb electromagnetic energy. 
     
     
       18. The waveguide system according to  claim 14 , wherein the at least one attenuation port is perpendicular to the plane of the waveguides. 
     
     
       19. The waveguide system according to  claim 14 , wherein the at least one attenuation component comprises at least one microstrip line on the circuit board. 
     
     
       20. The waveguide system according to  claim 14 , wherein the at least one attenuation component comprises conductive ink printed on the circuit board.