Inner module used in a wireless earphone

Abstract

An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

What is claimed is: 
     
       1. An inner module used in a wireless earphone, comprising
 a circuit loop, which is provided with a first circuit board, a second circuit board extending from the first circuit board, and a lower cover enclosing the first circuit board; and 
 an upper cover, which is installed on the lower cover and is provided with a first side wall forming an angle with respect to the lower cover, with the first side wall being provided with a first positioning slot to accommodate the second circuit board. 
 
     
     
       2. The inner module used in a wireless earphone, according to  claim 1 , wherein the upper cover further includes a second side wall which is opposite to the first side wall, and a connecting wall which is connected between the first side wall and the second side wall, forming a holding space between the upper cover and the lower cover. 
     
     
       3. The inner module used in a wireless earphone, according to  claim 2 , wherein the inner module further comprises a power supply unit which is disposed in the holding space, and the power supply unit is connected with the circuit loop electrically. 
     
     
       4. The inner module used in a wireless earphone, according to  claim 2 , wherein the circuit loop further includes a third circuit board which is extended from the first circuit board to oppose the second circuit board, and the second side wall of the upper cover further includes a second positioning slot to accommodate the third circuit board, enabling the third circuit board to opposite the second circuit board after being installed in the second positioning slot. 
     
     
       5. The inner module used in a wireless earphone, according to  claim 4 , wherein a first latching mechanism is further disposed between the second circuit board and the first positioning slot to latch the second circuit board and the first positioning slot together, allowing the second circuit board to be fixed in the first positioning slot through the first latching mechanism; and a second latching mechanism is further disposed between the third circuit board and the second positioning slot to latch the third circuit board and the second positioning slot together, allowing the third circuit board to be fixed in the second positioning slot through the second latching mechanism. 
     
     
       6. An inner module used in a wireless earphone, comprising
 a circuit loop, which includes a first circuit board and a second circuit board extending from the first circuit board; and 
 an insulation seat, which is formed on the first circuit board and includes a lower cover to enclose the first circuit board, as well as an upper cover extending from the lower cover to form a holding space, with the upper cover being provided with a first side wall extending from the lower cover, a second side wall extending from the lower cover to oppose the first side wall, and a connecting wall connecting the first side wall and the second side wall to oppose the lower cover, with the first side wall being provided with a first positioning slot to accommodate the second circuit board. 
 
     
     
       7. The inner module used in a wireless earphone, according to  claim 6 , wherein the inner module further comprises a power supply unit which is disposed in the holding space, and the power supply unit is connected with the circuit loop electrically. 
     
     
       8. The inner module used in a wireless earphone, according to  claim 6 , wherein the circuit loop further includes a third circuit board which is extended from the first circuit board to oppose the second circuit board, and the second side wall of the insulation seat further includes a second positioning slot to accommodate the third circuit board. 
     
     
       9. The inner module used in a wireless earphone, according to  claim 8 , wherein a first latching mechanism is further disposed between the second circuit board and the first positioning slot to latch the second circuit board and the first positioning slot together, allowing the second circuit board to be fixed in the first positioning slot through the first latching mechanism; and a second latching mechanism is further disposed between the third circuit board and the second positioning slot to latch the third circuit board and the second positioning slot together, allowing the third circuit board to be fixed in the second positioning slot through the second latching mechanism. 
     
     
       10. The inner module used in a wireless earphone, according to  claim 6 , wherein the inner module further comprises a loudspeaker which is connected with the circuit loop electrically, and the connecting wall of the insulation seat is further formed with a rabbet to accommodate the loudspeaker.