Acoustic resonator filter package

Abstract

An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.

What is claimed is: 
     
       1. An acoustic resonator filter package comprising:
 an acoustic resonator comprising a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; 
 a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; 
 a filter spaced apart from the acoustic resonator in an upward direction; 
 a second substrate having a lower surface on which the filter is disposed, the second substrate comprising a second coupling member disposed above the first coupling member; and 
 a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made; and 
 a conductive pillar electrically connecting the filter to the first substrate, 
 wherein the second substrate comprises a cavity opening in a downward direction and having the filter disposed therein, and 
 wherein the acoustic resonator filter package further comprises a cavity terminal disposed in the cavity and electrically connecting the filter to the conductive pillar. 
 
     
     
       2. The acoustic resonator filter package of  claim 1 , wherein the filter comprises a high-pass filter having a cut-off frequency higher than a resonance frequency of the acoustic resonator. 
     
     
       3. The acoustic resonator filter package of  claim 1 , wherein the conductive pillar comprises:
 a first conductive coupling pillar electrically connected to the first substrate; 
 a second conductive coupling pillar electrically connected to the filter; and 
 a conductive connection pillar electrically connecting the first conductive coupling pillar and the second conductive coupling pillar to each other, the conductive connection pillar being made of a material different from a material of which the first conductive coupling pillar and the second conductive coupling pillar are made. 
 
     
     
       4. The acoustic resonator filter package of  claim 3 , wherein the first conductive coupling pillar, the second conductive coupling pillar, the first coupling member, and the second coupling member are made of a first material, and
 the conductive connection pillar and the connection member are made of a second material different from the first material. 
 
     
     
       5. The acoustic resonator filter package of  claim 3 , wherein one end of the first conductive coupling pillar and one end of the first coupling member are disposed on a first virtual surface parallel to the upper surface of the first substrate, and
 one end of the second conductive coupling pillar and one end of the second coupling member are disposed on a second virtual surface parallel to the upper surface of the first substrate and spaced apart from the first virtual surface. 
 
     
     
       6. The acoustic resonator filter package of  claim 1 , wherein the cavity further comprises an encapsulant encapsulating the filter, and
 the encapsulant is spaced apart from the acoustic resonator. 
 
     
     
       7. The acoustic resonator filter package of  claim 1 , wherein the cavity terminal is made of a material different from a material of which the conductive pillar is made. 
     
     
       8. The acoustic resonator filter package of  claim 1 , wherein a melting point of each of the first coupling member and the second coupling member is lower than a melting point of the connection member. 
     
     
       9. The acoustic resonator filter package of  claim 8 , wherein the first substrate comprises:
 a first exposed terminal electrically connected to the first electrode of the acoustic resonator; and 
 a second exposed terminal electrically connected to the second electrode of the acoustic resonator, 
 wherein the first exposed terminal, the second exposed terminal, and the connection member are made of the same material. 
 
     
     
       10. An acoustic resonator filter package comprising:
 an acoustic resonator comprising a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface, of the piezoelectric layer; 
 a first substrate having an upper surface on which the acoustic resonator is disposed; 
 a filter spaced apart from the acoustic resonator in an upward direction; 
 a second substrate having a lower surface on which the filter is disposed; and 
 a connection member surrounding an accommodation space between the first substrate and the second substrate, and connecting the first substrate and the second substrate to each other, 
 wherein the second substrate comprises a cavity in which the filter is disposed, and 
 an area of a cross-section of the cavity taken along a first plane parallel to the upper surface of the first substrate is smaller than an area of a cross-section of the accommodation space surrounded by the connection, 
 wherein the acoustic resonator filter package further comprises:
 a conductive pillar disposed on the upper surface of the first substrate; and 
 a cavity terminal disposed in the cavity and electrically connecting the filter to the conductive pillar. 
 
 
     
     
       11. The acoustic resonator filter package of  claim 10 , wherein the conductive pillar comprises:
 a first conductive coupling pillar disposed on the upper surface of the first substrate; 
 a second conductive coupling pillar electrically connected to the cavity terminal and disposed above the first conductive coupling pillar; and 
 a conductive connection pillar disposed between the first conductive coupling pillar and the second conductive coupling pillar, the conductive connection pillar being made of a material different from a material of which the first conductive coupling pillar and the second conductive coupling pillar are made. 
 
     
     
       12. The acoustic resonator filter package of  claim 10 , wherein the filter comprises a high-pass filter having a cut-off frequency higher than a resonance frequency of the acoustic resonator. 
     
     
       13. An acoustic resonator filter package comprising:
 a first substrate having a first surface; 
 a second substrate having a first surface, the first surface of the second substrate facing the first surface of the first substrate; 
 an acoustic resonator disposed on the first surface of the first substrate, the acoustic resonator comprising a piezoelectric layer; 
 a filter disposed on the first surface of the second substrate; 
 a coupling structure coupling the first substrate and the second substrate to each other so that the filter is spaced apart from the acoustic resonator; and 
 a conductive pillar electrically connecting the filter to the first substrate, 
 wherein the coupling structure comprises:
 a first coupling member connected to the first substrate; 
 a second coupling member connected to the second substrate; and 
 a connection member connecting the first coupling member and the second coupling member to each other, and 
 
 the first coupling member and the second coupling member are made of a material having a lower melting point than a material of which the first substrate is made, a material of which the second substrate is made, and a material of which the connection member is made, 
 wherein the second substrate comprises a cavity opening toward the first surface of the first substrate and having the filter disposed therein, and 
 the acoustic resonator filter package further comprises a cavity terminal disposed in the cavity and electrically connecting the filter to the conductive pillar. 
 
     
     
       14. The acoustic resonator filter package of  claim 13 , wherein the conductive pillar comprises:
 a first conductive coupling pillar electrically connected to the first substrate; 
 a second conductive coupling pillar electrically connected to the filter; and 
 a conductive connection pillar electrically connecting the first conductive coupling pillar to the second conductive coupling pillar, 
 the first conductive coupling pillar and the second conductive coupling pillar are made of the same material as the first coupling member and the second coupling member, and 
 the conductive connection pillar is made of the same material as the connection member.